Search Results - "Moon, Jong Tae"

Characterization of polymer matrix and low melting point solder for anisotropic conductive film by Eom, Yong-Sung, Baek, Ji-Won, Moon, Jong-Tae, Nam, Jae-Do, Kim, Jong-Min

“…The chemo-rheological mechanisms of a polymer matrix and a low melting point solder for an anisotropic conductive film (ACF) have been characterized. For the…”
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Chemo-rheological characteristics of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder by Baek, Ji-Won, Jang, Keon-Soo, Eom, Yong-Sung, Moon, Jong-Tae, Kim, Jong-Min, Nam, Jae-Do

“…To achieve the excellent wettability of a solder in an anisotropic conductive adhesive (ACA) in micro-packaging technology, not only the removal of the…”
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Design and Fabrication of 1.25-Gb/s Full-Triplex Transceiver Module With PLC on a Lossy Si Substrate for G/E-PONs by KIM, Sungil, EOM, Yong-Sung, LEE, Chul-Wook, BAEK, Yongsoon, MOON, Jong-Tae, KANG, Kwang-Yong, LEE, Hai-Young

“…1.25 Gb/s optoelectronic full-triplex transceiver module with planar-lightwave-circuits was designed and fabricated for the fiber-to-the-home services…”
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Synthesis of Spherical TiO2 Particles with Disordered Rutile Surface for Photocatalytic Hydrogen Production by Na Yeon Kim, Hyeon Kyeong Lee, Jong Tae Moon, Ji Bong Joo

“…One of the most important issues in photocatalysis research has been the development of TiO2-based photocatalysts that work efficiently under visible light…”
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Controllable one-pot synthesis of uniform colloidal TiO2 particles in a mixed solvent solution for photocatalysis by Moon, Jong Tae, Lee, Seung Ki, Joo, Ji Bong

“…This study reports on the controllable synthesis of uniform colloidal titanium dioxide (TiO2) particles and their photocatalytic applications toward rhodamine…”
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Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis by Yoon, Hyungseok, Choi, Kwang-Seong, Bae, Hyun-Cheol, Moon, Jong-Tae, Eom, Yong-Sung, Jeon, Insu

“…The effects of the material properties of the underfill layer on thermal stress and deformation in 3D through silicon via (TSV) integration packages were…”
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On the formation of MoSi2 by self-propagating high-temperature synthesis by JO, S.-W, LEE, G.-W, MOON, J.-T, KIM, Y.-S

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Development of Packaging Technologies for High-Speed ( ≫40Gb/s) Optical Modules by Choi, K.-S., Kwon, Y.-H., Choe, J.-S., Chung, Y.-D., Kang, Y.-S., Kim, J., Ahn, B.-T., Moon, J.-T.

“…We developed high-speed optoelectronics packaging technologies for a waveguide photodiode and a traveling wave electro-absorption modulator device for 40-Gb/s…”
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The effects of probiotics on symptoms of irritable bowel syndrome by Kim, Young Gyun, Moon, Jong Tae, Lee, Kuen Man, Chon, Nu Ri, Park, Hyojin

“…Irritable bowel syndrome (IBS) is a functional gastrointestinal (GI) tract disorder that has heterogeneous clinical presentations such as abdominal pain,…”
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Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder by Eom, Yong-Sung, Jang, Keonsoo, Moon, Jong-Tae, Nam, Jae-Do, Kim, Jong-Min

“…For the highly reliable interconnection in a micro-packaging technology requiring an excellent electrical and mechanical performance, the new anisotropic…”
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Correlation between clinical symptoms and radiologic findings before and after pneumatic balloon dilatation for achalasia by Moon, Jong Tae, Jung, In Su, Kim, Young Shin, Cho, Seung Hyun, Park, Hyojin, Lee, Sang In

“…We investigated the risk factors for short-term recurrence and analyzed the correlation between subjective clinical symtoms and objective radiological findings…”
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Reliability of composite solder bumps produced by an in-situ process by LEE, Jong-Hyun, DAEJIN PARK, MOON, Jong-Tae, LEE, Yong-Ho, DONG HYUK SHIN, KIM, Yong-Seog

“…In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Cu sub(6)Sn sub(5) dispersoids was investigated…”
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Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering by LEE, Jong-Hyun, DAEJIN PARK, MOON, Jong-Tae, LEE, Yong-Ho, SHIN, Dong-Hyuk, KIM, Yong-Seog

“…In an attempt to develop a fluxless reflow solder bumping process, the effects of processing variables, which include energy input rate and time, and the shape…”
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Clinical significance of insulin receptor substrate-I down-regulation in non-small cell lung cancer by Han, Chang Hoon, Cho, Jae Yong, Moon, Jong Tae, Kim, Hyung Jung, Kim, Se Kyu, Shin, Dong Hwan, Chang, Joon, Ahn, Chul Min, Kim, Sung Kyu, Chang, Yoon Soo

“…Insulin receptor substrate-1 (IRS-1) is an adaptor protein for insulin-like growth factor (IGF) signaling and it is presumed associated with cancer…”
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Fabrication and Characteristics of 40-Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Laser Modules by YUN, Ho-Gyeong, CHOI, Kwang-Seong, KWON, Yong-Hwan, CHOE, Joong-Seon, MOON, Jong-Tae

“…We have developed 40-Gb/s traveling-wave electroabsorption-modulator-integrated distributed feedback laser (TW-EML) modules using several advanced…”
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Integration and Characteristics of 40-Gb/s Electroabsorption Modulator Integrated Laser Module With a Driver Amplifier and Bias Tees by YUN, Ho-Gyeong, CHOI, Kwang-Seong, KWON, Yong-Hwan, CHOE, Joong-Seon, MOON, Jong-Tae

“…Integration of a 40-Gb/s electroabsorption modulator integrated distributed feedback (DFB) laser (EML) module with a driver amplifier and bias tee was…”
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System-on-Packaging with Electroabsorption Modulator for a 60-GHz Band Radio-Over-Fiber Link by CHOI, Kwang-Seong, CHUNG, Yong-Duck, JUN, Dong-Suk, MOON, Jong-Tae, KIM, Jeha, YU, Hyun-Kyu, PARK, Hyo-Hoon

“…A system-on-packaging (SoP) with an electroabsorption modulator (EAM) for a 60 GHz band radio-over-fiber (RoF) link is described. The system consists of an EAM…”
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RF MEMS wafer-level packaging using solder paste by via filling process by Sunghae Jung, Myunglae Lee, Jong-Tae Moon

“…In this paper, the design, fabrication technology, and experimental evaluation of the RF frequency performance of a new type of solder paste via filled…”
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Cost-effective and high-performance FBAR duplexer module with wafer level packaging by Hyun-Cheol Bae, Sung-Chan Kim, Jong-Tae Moon, Kwang-Seong Choi

“…This paper presents a cost-effective and high-performance film bulk acoustic resonator (FBAR) duplexer module for USPCS handset applications. The FBAR device…”
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Bumping and stacking processes for 3D IC using fluxfree polymer by Kwang-Seong Choi, Ki-Jun Sung, Hyun-Cheol Bae, Jong-Tae Moon, Yong-Sung Eom

“…A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed…”
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