Search Results - "Monlevade, E."

Numerical modeling of flow stress and grain evolution of an Mg AZ31B alloy based on hot compression tests by Giorjao, R. A. R., Monlevade, E. F., Avila, J. A., Tschiptschin, A. P.

“…Magnesium alloys offer a wide range of applications in modern lightweight structures, although the correct forming parameters need to be found to reach a good…”
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Magnetic Barkhausen Noise in Quenched Carburized Nickel-Steels by Monlevade, E. F., de Campos, M. F., Franco, F. A., Capo-Sanchez, J., Goldenstein, H., Padovese, L. R.

“…Two steel sheets, one with 5% Ni and another with 10% Ni, were submitted to carburization and quenching, obtaining a microstructure with martensite and…”
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Comparison of the Magnetic Barkhausen Noise for Low Carbon Steel in Deformed and Annealed Conditions by de Campos, M. F., da Silva, F. R. F., Lins, J. F. C., Monlevade, E. F., Campos, M. A., Perez-Benitez, J., Goldenstein, H., Padovese, L. R.

“…The magnetic Barkhausen noise (MBN) in low carbon steel (0.034%C) was examined for two situations: after deformation and after recrystalization. The steel…”
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Orientation relationships associated with austenite formation from ferrite in a coarse-grained duplex stainless steel by MONLEVADE, E. F, FALLEIROS, I. G. S

“…Studies on the morphology and crystallography of austenite precipitated from ferrite were performed in an Fe-22.5 pct Cr-4.7 pct Ni-3 pct Mo-duplex stainless…”
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Effect of Selected Process Parameters on Durability and Defects in Surface-Mount Assemblies for Portable Electronics by Ladani, L.J., Dasgupta, A., Cardoso, I., Monlevade, E.

“…This paper presents a systematic approach to study the effect of manufacturing variables on the creation of defects and the effect of those defects on the…”
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Galvanic corrosion of electroless nickel/immersion gold plated non-permanent electric contacts used in electronic devices–direct evidence of triggering mechanism by Monlevade, E.F., Cardoso, I.A.P., Maciel, E.F.L., Alonso-Falleiros, N.

“…An electrical failure in non-permanent gold plated connectors, detected during routine testing in the assembly line of mobile phones, is investigated. The…”
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Failure mechanisms and crack propagation paths in thermally aged Pb-free solder interconnects by FRANCO DE MONLEVADE, Eduardo, WEIQUN PENG

“…Studies were conducted on Pb-free solder interconnects after aging for up to 1,000 h at temperatures of up to 150 degrees Celsius and submitting to drop…”
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Fracture surface analysis of aged and drop tested Sn-Ag-Cu solder joints by Monlevade, E.F., Reinikainen, T.

“…A propagating crack can follow several different paths, depending mainly on the energy associated with the advancing crack tip. The crack can follow single…”
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