Search Results - "Mondelli, A.A."

A finite integration method for conformal, structured-grid, electromagnetic simulation by Cooke, S.J., Shtokhamer, R., Mondelli, A.A., Levush, B.

“…We describe a numerical scheme for solving Maxwell’s equations in the frequency domain on a conformal, structured, non-orthogonal, multi-block mesh. By…”
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Advances in modeling and simulation of vacuum electronic devices by Antonsen, T.M., Mondelli, A.A., Levush, B., Verboncoeur, J.P., Birdsall, C.K.

“…Recent advances in the modeling and simulation of vacuum electronic devices are reviewed. Design of these devices makes use of a variety of physical models and…”
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Vacuum electronics for the 21st century by Abrams, R.H., Levush, B., Mondelli, A.A., Parker, R.K.

“…This article explores the history and diversity of this remarkable technology, with emphasis on advances in vacuum-electronic amplifiers, including the…”
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Cold-tested and interaction models for helix TWT's in MMACE by Mondelli, A.A., Petillo, J.J., Freund, H.P.

“…The tri-service MMACE program has developed a numerical framework for the design of microwave power tubes, with particular attention to the design of helix…”
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Cold-test, large signal simulator: a conformal-mesh electromagnetic field solver by Shtokhamer, R., Cooke, S.J., Mondelli, A.A., Levush, B.

“…Summary form only given. The Cold-Test, Large-Signal Simulation code (CTLSS) is being developed to provide an electromagnetic simulation tool that is designed…”
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CTLSS features supporting vacuum electron device design by Cooke, S.J., Chang, C.L., Mondelli, A.A., Chernin, D.P., Antonsen, T.M., Levush, B.

“…Summary form only given, as follows. The Cold-Test, Large-Signal Simulation Code (CTLSS) is being developed to provide a 3D electromagnetic simulation tool…”
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3D ARGUS-ESP computations of vacuum eigenmodes for standing-wave and traveling-wave structures by Petillo, J.J., Chernin, D.P., Mondelli, A.A.

“…Summary form only given, as follows. The ARGUS-ESP code has been used to calculate electromagnetic vacuum eigenmodes, including dispersion diagrams, for both…”
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LEBT modeling with ARGUS by Petillo, J.J., Mondelli, A.A.

“…ARGUS is a 3-D particle-in-cell (PIC) simulation code that, in addition to full time-dependent PIC capability, supports steady-state calculations using an…”
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An advanced electromagnetic eigenmode solver for vacuum electronics devices-CTLSS by Cooke, S.J., Mondelli, A.A., Levush, B., Petillo, J.J., Nelson, E., Chernin, D.P., Antonsen, T.M.

“…Summary form only given. The first module of the Cold-Test and Large-Signal Simulation (CTLSS) code, a next generation design tool for vacuum electronics…”
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Linear e+e- colliders above 1 TeV (CM) by Mondelli, A.A.

“…The scaling of the e/sup +/e/sup -/ linear collider beyond the Next Linear Collider (NLC) to TeV-class devices is described. The study includes considerations…”
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Beam dynamics in the spiral-line induction accelerator by Petillo, J.J., Chernin, D.P., Mondelli, A.A.

“…The 3-D electrostatic particle/field simulation code SPIRAL is used to trace electron trajectories through a 180 degrees bend in a spiral-line induction…”
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Development of design tools for vacuum electron devices by Levush, B., Antonsen, T.M., Mondelli, A.A., Chernin, D., Petillo, J.

“…Describes recent progress in the development of design tools for vacuum electronics and presents plans for future developments in this area. The paper will…”
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A complete space-charge model for 3D structures in the CHRISTINE 3D large-signal code by Cooke, S.J., Chang, C.-L., Antonsen, T.M., Chernin, D.P., Levush, B., Mondelli, A.A.

“…The CHRISTINE 3D code was developed to simulate the large-signal characteristics of slow-wave devices using a fast, parametric model. The model includes a…”
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Applications of CTLSS to cold-test designs for vacuum electron devices by Cooke, S.J., Shtokhamer, R., Levush, B., Mondelli, A.A.

“…The CTLSS code is an integrated three-dimensional cold-test and large-signal simulation suite. This paper treats the 3D cold-test portion of CTLSS, which is a…”
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SLIA beam line design by Petillo, J.J., Kostas, C., Chernin, D.P., Mondelli, A.A.

“…The design of the beam line for the Spiral-Line Induction Accelerator (SLIA), a 10-kA recirculating induction electron accelerator that uses stellarator…”
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An advanced electromagnetic eigenmode solver for vacuum electronics devices-CTLSS by Cooke, S.J., Levush, B., Mondelli, A.A., Petillo, J.J., Chernin, D.P., Kostas, C., Czarnaski, M., Nelson, E., Antonsen, T.M.

“…The Cold-Test and Large-Signal Simulation code (CTLSS), a design tool for vacuum electronics devices, is presented. The prototype tool is a three-dimensional,…”
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Novel electrostatic column for ion projection lithography by Chalupka, A., Stengl, G., Buschbeck, H., Lammer, G., Vonach, H., Fischer, R., Hammel, E., Löschner, H., Nowak, R., Wolf, P., Finkelstein, W., Hill, R. W., Berry, I. L., Harriott, L. R., Melngailis, J., Randall, J. N., Wolfe, J. C., Stroh, H., Wollnik, H., Mondelli, A. A., Petillo, J. J., Leung, K.

“…Ion projection lithography (IPL) is being considered for high volume sub‐0.25‐μm lithography. A novel ion‐optical column has been designed for exposing 20×20…”
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