Search Results - "Moll, A.J."

Smallholder dairy production and markets: A comparison of production systems in Zambia, Kenya and Sri Lanka by Moll, Henk A.J., Staal, Steven J., Ibrahim, M.N.M.

“…Three smallholder dairy production systems in Zambia, Sri Lanka and Kenya are analysed and compared. The focus is on the relationships between the animal…”
Get full text

Risk-matching behavior in microcredit group formation: evidence from northern Ethiopia by Berhane, Guush, Gardebroek, Cornelis, Moll, Henk A.J

“…Theoretical models on group lending assume the formation of groups of homogenous risk types. Recent theoretical and empirical findings challenge this view…”
Get full text

Investigation of circuit-level oxide degradation and its effect on CMOS inverter operation and MOSFET characteristics by Cheek, B.J., Stutzke, N., Kumar, S., Baker, R.J., Moll, A.J., Knowlton, W.B.

“…Circuit-level oxide degradation effects on CMOS inverter circuit operation and individual MOSFET behavior is investigated. Individual PMOSFET and NMOSFET…”
Get full text

Effects of circuit-level stress on inverter performance and MOSFET characteristics by Stutzke, N., Cheek, B.J., Kumar, S., Baker, R.J., Moll, A.J., Knowlton, W.B.

“…The effects of circuit level-stress on both inverter operation and MOSFET characteristics have been investigated. Individual MOSFETs, with gate oxide…”
Get full text

Costs and benefits of livestock systems and the role of market and nonmarket relationships by Moll, H.A.J

“…In developing countries livestock are kept not only for their physical products, but also for insurance, financing, and to display status. Though this range of…”
Get full text

Substitutionality of Ge atoms in ion implanted AlSb by Yu, Kin Man, Moll, A. J., Chan, Ning, Walukiewicz, W., Becla, P.

“…The substitution of Ge atoms into ion implanted AlSb is investigated by extended x-ray absorption fine structure spectroscopy. Our results reveal that in the…”
Get full text

Direct evidence of carbon precipitates in GaAs and InP by Moll, A. J., Haller, E. E., Ager, J. W., Walukiewicz, W.

“…Raman spectra of carbon-doped GaAs and InP show two peaks which are characteristic of C clusters with sp2 bonding. The peaks are seen in C-implanted GaAs and…”
Get full text

Thermo-mechanical characterization of copper through-wafer interconnects by Miranda, P.A., Moll, A.J.

“…Copper through wafer interconnects (TWIs) have become a viable solution to providing interconnectivity between stacked die. In a world where minimizing chip…”
Get full text

Coimplantation and electrical activity of C in GaAs : stoichiometry and damage effects by MOLL, A. J, KIN MAN YU, WALUKIEWICZ, W, HANSEN, W. L, HALLER, E. E

“…We have coimplanted carbon and a series of elements (B, N, Al, P, Ar, Ga, As, and Kr) in GaAs to study the effect of both implant damage and stoichiometry on…”
Get full text

Silicon solar cells using backside contacts with through-wafer interconnects by Erbe, A., Moll, A.J.

“…In this paper, a viable alternative design for silicon solar cells using backside contacts with through-wafer interconnects (TWI) is discussed. TWI technology…”
Get full text

Amphoteric substitutionality and lattice distortion of Ge in InP by Yu, Kin Man, Moll, A. J., Walukiewicz, W., Derhacobian, N., Rossington, C.

“…We have studied the electrical and structural properties of InP implanted with Ge ions (2×1015/cm2). The implantation was performed at both room temperature…”
Get full text

Integrating Through-Wafer Interconnects With Active Devices and Circuits by Jozwiak, Jim, Southwick, Richard G., Johnson, Vaughn N., Knowlton, William B., Moll, Amy J.

“…Through wafer interconnects (TWIs) enable vertical stacking of integrated circuit chips in a single package. A complete process to fabricate TWIs has been…”
Get full text

Energy scavenging device in LTCC materials by Scherrer, S., Plumlee, D.G., Moll, A.J.

“…Energy scavenging devices can use environmental vibrations to power remote devices without the need for wires or batteries. This paper discusses the use of low…”
Get full text

On the Nature of Self-Assembled Collagen Fibrils as Biomolecular Nanowires for Sensor Applications by Araujo, D., Price, P., Brotherton, J., Coonse, K., Southwick, R. G., Moll, A.J., Oxford, J.T., Knowlton, W.B.

“…The self assembly mechanism of collagen monomers into nanoscale fibrils provides the opportunity to investigate their possible use as biological nanowires…”
Get full text

A Stackable Silicon Interposer with Integrated Through-Wafer Inductors by Carlson, J., Lueck, M., Bower, C.A., Temple, D., Feng, Z.-P., Steer, M.B., Moll, A.J., Knowlton, W.B.

“…Three-dimensional (3-D) device stacking technologies provide an effective path to the miniaturization of electronic systems. These 3-D stacks can be envisioned…”
Get full text

Measuring and interpreting the benefits of goat keeping in tropical farm systems by Bosman, H.G., Moll, H.A.J., Udo, H.M.J.

“…The measurement of biological production in goat systems is discussed by reviewing existing indices for reproduction and flock productivity. On-station and…”
Get full text

Novel slurry solutions for thick Cu CMP by Miranda, P.A., Imonigie, J.A., Erbe, A.L., Moll, A.J.

“…Electro-plating methods currently used to deposit Cu in through-wafer interconnect applications result in the formation of a thick Cu layer with large amounts…”
Get full text

Interaction effects of slurry chemistry on chemical mechanical planarization of electroplated copper by Miranda, P.A., Imonigie, J.A., Moll, A.J.

“…Recent studies have been conducted investigating the effects of slurry chemistry on the copper CMP process. Slurry pH and hydrogen peroxide concentration are…”
Get full text

Economic Reforms and Evolution of Producer Prices in Kenya: An ARCH-M Approach by Karanja, Andrew M., Kuyvenhoven, Arie, Moll, Henk A.J.

“…:  For the last two decades,most countries in sub‐Saharan Africa have been liberalizing their economies,and agricultural markets in particular.The reforms were…”
Get full text

Electrical characterization of through-wafer interconnects by Lawrence, T.E., Donovan, S.M., Knowlton, W.B., Rush-Byers, J., Moll, A.J.

“…Through-wafer interconnects (TWI) allows 3-D chip stacking enabling integration of multiple chip functions (i.e. opto-electronic, analog or digital) with…”
Get full text