Search Results - "Mok, InSu"

Chip Stackable, Ultra-thin, High-Flexibility 3D FOWLP (3D SWIFT® Technology) for Hetero-Integrated Advanced 3D WL-SiP by WonMyoung Ki, WonGeol Lee, IlBok Lee, InSu Mok, WonChul Do, Kolbehdari, Moh, Copia, Alex, Jayaraman, Suresh, Zwenger, Curtis, KangWook Lee

“…Fan-out wafer level packaging (FOWLP) is one of the latest technologies to meet the requirements of high performance and thin form-factor, especially for…”
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Wafer Level Void-Free Molded Underfill for High-Density Fan-out Packages by Mok, InSu, Bae, JaeHun, Ki, WonMyoung, Yoo, HoDol, Ryu, SeungMan, Kim, SooHyun, Jung, GyuIck, Hwang, TaeKyeong, Do, WonChul

“…In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density…”
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