Effect of kaolin geopolymer ceramic addition on the properties of Sn-3.0Ag-0.5Cu solder joint

Effect of kaolin geopolymer ceramic addition on the properties of Sn-3.0Ag-0.5Cu solder joint

[Display omitted] •Addition of 1.0 wt.% KGC was found to be an optimum value which could improve the Sn-3.0Ag-0.5Cu solder performance.•KGC additions decrease the area formation of β-Sn and increase eutectic area with fine intermetallics particles.•KGC additions reduce the undercooling value of Sn-3...

Full description

Saved in:
Bibliographic Details
Published in:Materials today communications Vol. 25; p. 101469
Main Authors: Mohamad Zaimi, N.S., Mohd Salleh, M.A.A., Abdullah, M.M.A.B., Ahmad, R., Mostapha, M., Yoriya, S., Chaiprapa, J., Zhang, G., Harvey, D.M.
Format: Journal Article
Language:English
Published: Elsevier Ltd 01-12-2020
Subjects:
Geopolymer ceramics
Intermetallics
Microstructure
Solder material
Soldering
Intermetallics
Microstructure
Soldering
Geopolymer ceramics
Solder material
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:[Display omitted] •Addition of 1.0 wt.% KGC was found to be an optimum value which could improve the Sn-3.0Ag-0.5Cu solder performance.•KGC additions decrease the area formation of β-Sn and increase eutectic area with fine intermetallics particles.•KGC additions reduce the undercooling value of Sn-3.0Ag-0.5Cu solder.•The thickness of IMC layer was suppressed with additions of KGC which results in improving the joint strength•The spreading area was improved by 26.3 % with additions of KGC into Sn-3.0Ag-0.5Cu. This paper investigates the effects of different weight percentages (0, 0.5, 1.0, 1.5 and 2.0 wt.%) of kaolin geopolymer ceramic (KGC) on the microstructure formation, thermal properties, spreadability and joint strength in Sn-3.0Ag-0.5Cu (SAC305) lead-free solder alloys in order to develop a new composite solder system. Advanced characterization techniques such as Electron backscatter diffraction (EBSD) and synchrotron micro-XRF were used to study the behaviors of the pure SAC305 and KGC reinforced SAC305 composite solders. Experimental results shows that the addition of KGC refines the β-Sn area and increases the eutectic area with fine intermetallics formation. In addition, the thickness of the IMC layer is reduced with a reduction in undercooling value for the KGC reinforced SAC305 composite solder. The spreadability of the KGC reinforced SAC305 composite solder is significantly increased in the spreadable area with a higher strength of solder joint. Significantly, the results obtained prove that 1.0 wt.% KGC addition gives better performance in terms of microstructure formation, thermal properties, spreadability and joint strength. Synchrotron micro-XRF interestingly indicated that some Al and Si, which are the major elements in geopolymer systems, migrate into the solder area.
ISSN:2352-4928
2352-4928
DOI:10.1016/j.mtcomm.2020.101469