Search Results - "Moeller, Berthold"

Edge trimming for surface activated dielectric bonded wafers by Inoue, Fumihiro, Jourdain, Anne, Visker, Jakob, Peng, Lan, Moeller, Berthold, Yokoyama, Kaori, Phommahaxay, Alain, Rebibis, Kenneth June, Miller, Andy, Beyne, Eric, Sleeckx, Erik

“…The impact of the edge trimming process on permanently bonded wafers is described. The edge trimming process is a blade sawing process applied on the Si wafer…”
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Application of the surface planer process to Cu pillars and wafer support tape for high-coplanarity wafer-level packaging by Inoue, Fumihiro, Phommahaxay, Alain, Gokita, Yohei, Möller, Berthold, Beyne, Eric

“…We used the surface planer process to minimize the within-die and within-wafer nonuniformity caused by the nonoptimized Cu pillar and Si thinning processes…”
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Advanced Dicing Technologies for Combination of Wafer to Wafer and Collective Die to Wafer Direct Bonding by Inoue, Fumihiro, Phommahaxay, Alain, Podpod, Arnita, Suhard, Samuel, Hoshino, Hitoshi, Moeller, Berthold, Sleeckx, Erik, June Rebibis, Kenneth, Miller, Andy, Beyne, Eric

“…Feasibility study of alternative dicing technologies for collective die to wafer direct bonding combined with wafer to wafer direct bonded dies has been…”
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Das Wahlrecht in Wilhelm von Humboldts Entwurf einer Ständischen Verfassung für Preußen vom Jahre 1819 by Kaehler, Siegfried, von Möller, Berthold

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