Search Results - "Missinne, J"
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Laser Written Glass Interposer for Fiber Coupling to Silicon Photonic Integrated Circuits
Published in IEEE photonics journal (01-02-2021)“…Recent advancements in photonic-electronic integration push towards denser multichannel fiber to silicon photonic chip coupling solutions. However, current…”
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2
Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer
Published in Applied physics letters (10-02-2014)“…This letter reports the use of the Laser-Induced Forward Transfer (LIFT) technique for the fabrication of indium micro-bumps for the flip-chip (FC) bonding of…”
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3
Fabrication and Characterization of High-Optical-Quality-Factor Hybrid Polymer Microring Resonators Operating at Very Near Infrared Wavelengths
Published in IEEE photonics journal (01-04-2016)“…In this paper, we present a new fabrication method for large-area hybrid polymer microring resonators using a rib waveguide configuration with a minimum…”
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4
UNFOLDING LEONARDO DA VINCI’S GLOBE (AD 1504) TO REVEAL ITS HISTORICAL WORLD MAP
Published in ISPRS annals of the photogrammetry, remote sensing and spatial information sciences (17-08-2017)“…This paper reports in detail on the image-based modelling and unwrapping approach used to create a two-dimensional projected map of an astonishing ostrich egg…”
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Interfacing silicon photonics for CPO
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28-05-2024)“…We report the development of high-yield and scalable optical coupling interfaces for CPO. Two concepts are discussed, a polymer waveguide based optical…”
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Conference Proceeding -
6
The oldest anatomical handmade skull of the world c. 1508: ‘The ugliness of growing old’ attributed to Leonardo da Vinci
Published in Wiener medizinische Wochenschrift (01-06-2014)“…Summary The author discusses a previously unknown early sixteenth-century renaissance handmade anatomical miniature skull. The small, naturalistic skull made…”
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Packaging of Ultra-dynamic Photonic Switches and Transceivers for Integration into 5G Radio Access Network and Datacenter Sub-systems
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01-05-2023)“…We report the development of a fully non-blocking optical switch fabric, enabling a deterministic and dynamic network infrastructure. Focus is on scalable…”
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Non-Volatile Microfluidics Controlled Switch Fabricated in Fused Silica by Femtosecond Laser Inscription
Published in 2019 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC) (01-06-2019)“…The spreading of fiber to the home technology, driven by the increasing amount of internet traffic over the past decade, requires development of optical power…”
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9
Assembly of optoelectronics for efficient chip-to-waveguide coupling
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01-12-2013)“…This paper presents two solutions to achieve efficient optical coupling between vertical cavity surface emitting lasers and planar optical waveguides, by…”
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Conference Proceeding -
10
Flexible Shear Sensor Based on Embedded Optoelectronic Components
Published in IEEE photonics technology letters (15-06-2011)“…Tactile shear stresses play an important role in the medical field and robotics. To monitor these stresses in situ, there is a need for unobtrusive flexible…”
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Highly Reliable Flexible Active Optical Links
Published in IEEE photonics technology letters (01-03-2010)“…We present a process to embed commercially available optical material layers into a flexible foil. Patterning of the embedded layers results in highly…”
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12
Compact coupling and packaging concepts for flexible and stretchable polymer optical interconnects
Published in 2012 Optical Interconnects Conference (01-05-2012)“…We present the design and fabrication of a complete optical interconnection scheme including the optoelectronic package, containing driving Vertical Cavity…”
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13
Ultrathin Optoelectronic Device Packaging in Flexible Carriers
Published in IEEE journal of selected topics in quantum electronics (01-05-2011)“…This paper presents the development of an advanced packaging technique for commercially available optoelectronic devices. Vertical cavity surface emitting…”
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14
Ultra Small Integrated Optical Fiber Sensing System
Published in Sensors (Basel, Switzerland) (01-09-2012)“…This paper introduces a revolutionary way to interrogate optical fiber sensors based on fiber Bragg gratings (FBGs) and to integrate the necessary driving…”
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15
Photonic Incremental Pressure Sensor Based on Optical Feedback in a Polymer Embedded VCSEL
Published in IEEE photonics technology letters (01-07-2012)“…A highly accurate integrated incremental pressure sensor is presented based on optical feedback in a vertical-cavity surface-emitting laser (VCSEL). This laser…”
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16
Expanded-Beam Through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics
Published in 2018 Optical Fiber Communications Conference and Exposition (OFC) (01-03-2018)“…We demonstrate an alignment tolerant through-substrate coupling interface by combining an optimized downward-directionality grating on a silicon photonic chip…”
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Conference Proceeding -
17
Packaging silicon photonics with polymer waveguides for 3D electro-optical integration
Published in 2017 IEEE Photonics Conference (IPC) (01-10-2017)“…We have demonstrated packaging of a silicon photonic chip with polymer multimode waveguides on a package substrate in a face-up electro-optic 3D integration…”
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18
Embedded multiplexed polymer optical fiber sensor for esophageal manometry
Published in 2011 IEEE SENSORS Proceedings (01-10-2011)“…There is a growing interest for esophageal measurements which can provide important and reliable data when diagnosing the motor function of the sphincters and…”
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Integration of Ball Lens in Through-Package Via to Enable Photonic Chip-to-Board Coupling
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01-05-2018)“…Optical interconnects offer a promising solution to achieve a larger bandwidth distance product, interconnect density and power efficiency compared to their…”
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20
Chip-Level Interconnections Realized Via the Laser-Induced Forward Transfer Technique
Published in 2014 Asia Communications and Photonics Conference (ACP) (01-11-2014)“…In this paper, successful flip-chip bonding and DC characterization of single photodiode and VCSEL chips via Laser-Induced Forward Transfer (LIFT) printed…”
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Conference Proceeding