Search Results - "Missinne, J"

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  1. 1

    Laser Written Glass Interposer for Fiber Coupling to Silicon Photonic Integrated Circuits by Desmet, A., Radosavljevic, A., Missinne, J., Van Thourhout, D., Van Steenberge, G.

    Published in IEEE photonics journal (01-02-2021)
    “…Recent advancements in photonic-electronic integration push towards denser multichannel fiber to silicon photonic chip coupling solutions. However, current…”
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    Journal Article
  2. 2

    Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer by Kaur, K. S., Missinne, J., Van Steenberge, G.

    Published in Applied physics letters (10-02-2014)
    “…This letter reports the use of the Laser-Induced Forward Transfer (LIFT) technique for the fabrication of indium micro-bumps for the flip-chip (FC) bonding of…”
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    Journal Article
  3. 3

    Fabrication and Characterization of High-Optical-Quality-Factor Hybrid Polymer Microring Resonators Operating at Very Near Infrared Wavelengths by Morarescu, R., Pal, P. K., Beneitez, N. T., Missinne, J., Steenberge, G. V., Bienstman, P., Morthier, G.

    Published in IEEE photonics journal (01-04-2016)
    “…In this paper, we present a new fabrication method for large-area hybrid polymer microring resonators using a rib waveguide configuration with a minimum…”
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    Journal Article
  4. 4

    UNFOLDING LEONARDO DA VINCI’S GLOBE (AD 1504) TO REVEAL ITS HISTORICAL WORLD MAP by Verhoeven, G. J., Missinne, S. J.

    “…This paper reports in detail on the image-based modelling and unwrapping approach used to create a two-dimensional projected map of an astonishing ostrich egg…”
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    Journal Article
  5. 5

    Interfacing silicon photonics for CPO by Van Steenberge, G., Van Asch, J., Geudens, V., De Baere, T., De Moerlooze, N., Missinne, J., Podpod, A., Lepage, G., Golshani, N., Magdziak, R., Sar, H., Bipul, S., Bode, D., Ban, Y., Ferraro, F., van Campenhout, J.

    “…We report the development of high-yield and scalable optical coupling interfaces for CPO. Two concepts are discussed, a polymer waveguide based optical…”
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    Conference Proceeding
  6. 6

    The oldest anatomical handmade skull of the world c. 1508: ‘The ugliness of growing old’ attributed to Leonardo da Vinci by Missinne, Stefaan J.

    Published in Wiener medizinische Wochenschrift (01-06-2014)
    “…Summary The author discusses a previously unknown early sixteenth-century renaissance handmade anatomical miniature skull. The small, naturalistic skull made…”
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    Journal Article
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    Assembly of optoelectronics for efficient chip-to-waveguide coupling by Bosman, E., Kaur, K. S., Missinne, J., Van Hoe, B., Van Steenberge, G.

    “…This paper presents two solutions to achieve efficient optical coupling between vertical cavity surface emitting lasers and planar optical waveguides, by…”
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    Conference Proceeding
  10. 10

    Flexible Shear Sensor Based on Embedded Optoelectronic Components by Missinne, J, Bosman, E, Van Hoe, B, Van Steenberge, G, Kalathimekkad, S, Van Daele, P, Vanfleteren, J

    Published in IEEE photonics technology letters (15-06-2011)
    “…Tactile shear stresses play an important role in the medical field and robotics. To monitor these stresses in situ, there is a need for unobtrusive flexible…”
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    Journal Article
  11. 11

    Highly Reliable Flexible Active Optical Links by Bosman, E., Van Steenberge, G., Van Hoe, B., Missinne, J., Vanfleteren, J., Van Daele, P.

    Published in IEEE photonics technology letters (01-03-2010)
    “…We present a process to embed commercially available optical material layers into a flexible foil. Patterning of the embedded layers results in highly…”
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    Journal Article
  12. 12

    Compact coupling and packaging concepts for flexible and stretchable polymer optical interconnects by Missinne, J., Van Hoe, B., Bosman, E., Kalathimekkad, S., Van Steenberge, G., Van Daele, P.

    Published in 2012 Optical Interconnects Conference (01-05-2012)
    “…We present the design and fabrication of a complete optical interconnection scheme including the optoelectronic package, containing driving Vertical Cavity…”
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    Conference Proceeding
  13. 13

    Ultrathin Optoelectronic Device Packaging in Flexible Carriers by Bosman, E, Missinne, J, Van Hoe, B, Van Steenberge, G, Kalathimekkad, S, Van Erps, J, Milenkov, I, Panajotov, K, Van Gijseghem, T, Dubruel, P, Thienpont, H, Daele, P

    “…This paper presents the development of an advanced packaging technique for commercially available optoelectronic devices. Vertical cavity surface emitting…”
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    Journal Article
  14. 14

    Ultra Small Integrated Optical Fiber Sensing System by Van Hoe, Bram, Lee, Graham, Bosman, Erwin, Missinne, Jeroen, Kalathimekkad, Sandeep, Maskery, Oliver, Webb, David J., Sugden, Kate, Van Daele, Peter, Van Steenberge, Geert

    Published in Sensors (Basel, Switzerland) (01-09-2012)
    “…This paper introduces a revolutionary way to interrogate optical fiber sensors based on fiber Bragg gratings (FBGs) and to integrate the necessary driving…”
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    Journal Article
  15. 15

    Photonic Incremental Pressure Sensor Based on Optical Feedback in a Polymer Embedded VCSEL by Van Hoe, B., Bosman, E., Missinne, J., Kalathimekkad, S., Melpignano, G., De Geyter, T., Godier, G., Van Daele, P., Van Steenberge, G.

    Published in IEEE photonics technology letters (01-07-2012)
    “…A highly accurate integrated incremental pressure sensor is presented based on optical feedback in a vertical-cavity surface-emitting laser (VCSEL). This laser…”
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    Journal Article
  16. 16

    Expanded-Beam Through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics by Mangal, N., Missinne, J., Roelkens, G., Van Campenhout, J., Van Steenberge, G., Snyder, B.

    “…We demonstrate an alignment tolerant through-substrate coupling interface by combining an optimized downward-directionality grating on a silicon photonic chip…”
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    Conference Proceeding
  17. 17

    Packaging silicon photonics with polymer waveguides for 3D electro-optical integration by Mangal, N., Missinne, J., Van Steenberge, G., Van Campenhout, J., Snyder, B.

    Published in 2017 IEEE Photonics Conference (IPC) (01-10-2017)
    “…We have demonstrated packaging of a silicon photonic chip with polymer multimode waveguides on a package substrate in a face-up electro-optic 3D integration…”
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    Conference Proceeding
  18. 18

    Embedded multiplexed polymer optical fiber sensor for esophageal manometry by Van Hoe, B., Bosman, E., Missinne, J., Van Steenberge, G., Van Daele, P., Wei Zhang, Johnson, I., Sugden, K., Webb, D. J., Kalli, K.

    Published in 2011 IEEE SENSORS Proceedings (01-10-2011)
    “…There is a growing interest for esophageal measurements which can provide important and reliable data when diagnosing the motor function of the sphincters and…”
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    Conference Proceeding
  19. 19

    Integration of Ball Lens in Through-Package Via to Enable Photonic Chip-to-Board Coupling by Mangal, Nivesh, Missinne, Jeroen, Van Campenhout, Joris, Van Steenberge, Geert, Snyder, Brad

    “…Optical interconnects offer a promising solution to achieve a larger bandwidth distance product, interconnect density and power efficiency compared to their…”
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    Conference Proceeding
  20. 20

    Chip-Level Interconnections Realized Via the Laser-Induced Forward Transfer Technique by Kaur, K.S., Missinne, J., Van Steenberge, G.

    “…In this paper, successful flip-chip bonding and DC characterization of single photodiode and VCSEL chips via Laser-Induced Forward Transfer (LIFT) printed…”
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    Conference Proceeding