Search Results - "Misrak, Abel"

Investigation of the Impact of Material Models on Reliability Assessment of Electronic Packages by Misrak, Abel

“…Drop testing, thermal cycling, power cycling, etc. are some of the tests used to assess the reliability of new electronic products. However, performing…”
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Structural integrity optimization of 3D TSV package by analyzing crack behavior at TSV and BEOL by Rahangdale, Unique, Rajmane, Pavan, Doiphode, Aniruddha, Misrak, Abel

“…New electronic devices with small size and low power consumption are in demand in recent years. Miniaturization and complex product are required in modern…”
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Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling by Rahangdale, Unique, Srinivas, Rahul, Krishnamurthy, S., Rajmane, Pavan, Misrak, Abel, Sakib, A. R., Agonafer, Dereje, Lohia, Alok, Kummerl, Steven, Nguyen, Luu T.

“…QFN packages gained popularity among the industry due to its low cost, compact size, and excellent thermal electrical performance. Although PCBs are widely…”
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Impact of Viscoelastic Properties of Low Loss Printed Circuit Boards (PCBs) on Reliability of WCSP Packages Under Drop Test by Lakshminarayana, Akshay, Misrak, Abel, Bhandari, Rabin, Chauhan, Tushar, Raufur Chowdhury, A S M, Agonafer, Dereje

“…Reliability of electronic packages is a major concern as different failure modes are induced due to factors such as temperature cycling, mechanical stresses,…”
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Damage progression study of 3D TSV package during reflow, thermal shocks and thermal cycling by Rahangdale, Unique, Rajmane, Pavan, Doiphode, Aniruddha, Sakib, A. R., Misrak, Abel, Lohia, Alok, Agonafer, Dereje

“…The increasing demand for lighter, thinner and flexible electronic devices are resulting in complexity in design. The 2D or planner devices miniaturization is…”
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Mechanical characterization of RCC and FR4 laminated PCBs and assessment of their board level reliability by Rahangdale, Unique, Sakib, A. R., Chaudhari, Mugdha, Misrak, Abel, Dave, Chaitanya, Agonafer, Dereje, Lohia, Alok, Kummerl, Steven, Nguyen, Luu T.

“…The role of electronic packaging is becoming more important and now constitute a much bigger percentage of the development of package with high evolution due…”
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Solder ball reliability assessment of WLCSP - Power cycling versus thermal cycling by Rahangdale, Unique, Conjeevaram, B., Doiphode, Aniruddha, Rajmane, Pavan, Misrak, Abel, Sakib, A. R., Agonafer, Dereje, Nguyen, Luu T., Lohia, Alok, Kummerl, Steven

“…Failure analysis and its effects are major reliability concerns in electronic packaging. More accurate fatigue life prediction can be obtained after the…”
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Comparison of the effect of elastic and viscoelastic modeling of PCBs on the assessment of board level reliability by Misrak, Abel, Anaskure, Avinash, Sakib, A R Nazmus, Rahangdale, Unique, Lohia, Alok, Agonafer, Dereje

“…The assessment of board level solder joint reliability during thermal cycling is very important for electronic packages. During thermal cycling, the mismatch…”
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