Search Results - "Ming Wai Ng"

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    The Shintoization of Mazu in Tokugawa Japan by Ng, Wai-ming

    Published in Japanese journal of religious studies (01-01-2020)
    “…Mazu was a Chinese sea goddess worshiped by fishermen, villagers, maritime merchants, and local officials in the Sinic world including Japan, Korea, Vietnam,…”
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    Journal Article
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    Di- and tri-nuclear ruthenium nitrosyl complexes containing thiolate ligands by Chan, Ka-Wang, Ng, Wai-Ming, Cheung, Wai-Man, Lai, Chun-Sing, Sung, Herman H.Y., Williams, Ian D., Leung, Wa-Hung

    Published in Journal of organometallic chemistry (15-06-2016)
    “…Treatment of Ru(NO)Cl3 with NaSC6F4H (C6F4HSH = 2,3,5,6-tetrafluorothiophenol) afforded the hydroxo-bridged dimer Na(H2O)2[Ru(NO)(SC6HF4)2]2(μ-SC6HF4)2(μ-OH)…”
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    Journal Article
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    The Yijing Principles in the Japanese Creation Myth: A Study of the Jindai-No-Maki (‘Chapters on the Age of the Gods’) in the Nihon Shoki (‘The Chronicles Of Japan’) by Ng, Benjamin Wai-ming

    Published in Literature & theology (05-08-2023)
    “…Abstract The Yijing (‘Classic of Changes’) is an important text in Daoist and Confucian traditions in China. It also served as a building block of ancient…”
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    Journal Article
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    The Yin-Yang-Wu-Hsing doctrine in the textual tradition of Tokugawa Japanese Agriculture by Ng, Wai-Ming

    Published in Asian philosophy (01-07-1998)
    “…Japanese agricultural scholarship reached its peak in the Tokugawa period (1603-1868). Most of its representative works were imbued with the Chinese…”
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    Journal Article
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    Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding by Yu Hin Chan, Jang-Kyo Kim, Deming Liu, Liu, P.C.K., Yiu-Ming Cheung, Ming Wai Ng

    Published in IEEE transactions on advanced packaging (01-11-2005)
    “…The wire bondability of Au-Ni-Cu bond pads with different Au plating schemes, including electrolytic and immersion plates, are evaluated after plasma…”
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    Journal Article
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    Effects of bonding frequency on Au wedge wire bondability by Chan, Yu Hin, Kim, Jang-Kyo, Liu, Deming, Liu, Peter C. K., Cheung, Yiu Ming, Ng, Ming Wai

    “…This paper studies the effect of bonding frequency on bondability of Au wire on a PCB bond pad. The wire bonding was performed at two different frequencies,…”
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    Journal Article
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    Comparative performance of gold wire bonding on rigid and flexible substrates by YU HIN CHAN, KIM, Jang-Kyo, DEMING LIU, LIU, Peter C. K, YIU MING CHEUNG, MING WAI NG

    “…This paper reports comparative performance of wire bondability of electrolytically plated Au/Ni/Cu bond pads on rigid FR-4 and bismaleimide trazine (BT) PCBs,…”
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    Journal Article
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    Heterometallic iron(IV) μ-nitrido complexes supported by a tetradentate Schiff base ligand by Ng, Rain, Ng, Wai-Ming, Cheung, Wai-Man, Sung, Herman H.-Y., Williams, Ian D., Leung, Wa-Hung

    Published in Journal of organometallic chemistry (15-05-2022)
    “…•A heterometallic Fe(IV)-N-Ru(IV) chloride complex with a schiff base ligand has been synthesized.•Salt metathesis of the Fe(IV)-N-Ru(IV) chloride complex with…”
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    Journal Article
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    Process windows for low-temperature Au wire bonding by YU HIN CHAN, KIM, Jang-Kyo, DEMING LIU, LIU, Peter C. K, YIU MING CHEUNG, MING WAI NG

    Published in Journal of electronic materials (01-02-2004)
    “…The process windows are presented for low-temperature Au wire bonding on Au/Ni/Cu bond pads of varying Au-layer thicknesses metallized on an organic FR-4…”
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    Journal Article
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    Smart ultrasonic transducer for wire-bonding applications by Chu, Paul Wing-Po, Li, Hing-Leung, Chan, Helen Lai-Wa, Ng, Kelvin Ming-Wai, Liu, Peter Chou-Kee

    Published in Materials chemistry and physics (28-04-2002)
    “…A sensor integrated in a smart ultrasonic transducer was used to monitor the bonding quality during wire-bonding process. The sensor was a lead zirconate…”
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    Journal Article
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    Placement of piezoelectric ceramic sensors in ultrasonic wire-bonding transducers by Chu, Paul Wing-Po, Chong, Chi-Po, Chan, Helen Lai-Wa, Ng, Kelvin Ming-Wai, Liu, Peter Chou-Kee

    Published in Microelectronic engineering (01-04-2003)
    “…Three identical lead zirconate titanate (PZT) sensor rings have been inserted in different locations of an ultrasonic wire bonding transducer driver in order…”
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    Journal Article Conference Proceeding
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    Extensive contact tracing and screening to control the spread of vancomycin-resistant Enterococcus faecium ST414 in Hong Kong by Cheng, Vincent Chi-Chung, Tai, Josepha Wai-Ming, Ng, Modissa Lai-Ming, Chan, Jasper Fuk-Woo, Wong, Sally Cheuk-Ying, Li, Iris Wai-Sum, Chung, Hon-Ping, Lo, Wai-Kei, Yuen, Kwok-Yung, Ho, Pak-Leung

    Published in Chinese medical journal (05-10-2012)
    “…Background Proactive infection control management is crucial in preventing the introduction of multiple drug resistant organisms in the healthcare setting. In…”
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    Journal Article
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    Improvements in Au wire bondability of rigid and flexible substrates using plasma cleaning by Yu Hin Chan, Jang-Kyo Kim, Deming Liu, Peter Chou Kee Liu, Yiu Ming Cheung, Ming Wai Ng

    “…Thermosonic Au wire bonding is the most widely used interconnection technology in the BGA packages. Compare with Au ball bonding, the lower wire loop and finer…”
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    Conference Proceeding
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    Japanese Popular Music in Singapore and the Hybridization of Asian Music by Ng, Benjamin Wai-ming

    Published in Asian music (01-09-2002)
    “…The boom of Japanese popular music (commonly referred to as J-pop since the early 1990s) in Asia in the late 1990s and early 2000s is one of the most important…”
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    Journal Article
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    The "I Ching" in Late-Chosŏn Thought by Ng, Wai-ming

    Published in Korean studies (01-01-2000)
    “…The I ching (Book of changes) played an important role in the development of Korean thought and culture. This research examines the impact of the I ching on…”
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    Journal Article