Search Results - "Meiying Su"

Pharmacokinetics, tissue distribution and excretion study of trans-resveratrol-3-O-glucoside and its two metabolites in rats by Su, Meiying, Dong, Chao, Wan, Jiyun, Zhou, Maojin

“…Trans-resveratrol-3-O-glucoside (TRG), isolated from the Chinese traditional herbal medicine Huzhang, has been shown to have a wide range of pharmacological…”
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Review of Packaging Schemes for Power Module by Hou, Fengze, Wang, Wenbo, Cao, Liqiang, Li, Jun, Su, Meiying, Lin, Tingyu, Zhang, Guoqi, Ferreira, Braham

“…SiC devices are promising for outperforming Si counterparts in high-frequency applications due to its superior material properties. Conventional wirebonded…”
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Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process by Chen, Chuan, Su, Meiying, Ma, Rui, Zhou, Yunyan, Li, Jun, Cao, Liqiang

“…This paper focuses on characterizing the evolution of warpage, effects of epoxy molding compound (EMC), and effects of carrier 2 (the second carrier in the…”
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Active‐ion‐gated room temperature acetone gas sensing of ZnO nanowires array by Guo, Junmeng, Gan, Jiahui, Ruan, Haoran, Yuan, Xiaobo, Kong, Chuiyun, Liu, Yang, Su, Meiying, Liu, Yabing, Liu, Wei, Zhang, Bao, Zhang, Yongle, Cheng, Gang, Du, Zuliang

“…Reducing the high operation temperature of gas sensor to room temperature (RT) have attracted intense interests for its distinct preponderances, including…”
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Properties and electric characterizations of tetraethyl orthosilicate-based plasma enhanced chemical vapor deposition oxide film deposited at 400°C for through silicon via application by Su, Meiying, Yu, Daquan, Liu, Yijun, Wan, Lixi, Song, Chongshen, Dai, Fengwei, Xue, Kai, Jing, Xiangmeng, Guidotti, Daniel

“…The dielectric via liner of through silicon vias was deposited at 400°C using a tetraethyl orthosilicate (TEOS)-based plasma enhanced chemical vapor deposition…”
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The Characteristics of Steamed Bread from Reconstituted Whole Wheat Flour (WWF) of Different Hard Wheat Classes with Different Bran Particle Size Distributions by Huang, Yuching, Mense, Andrew L, Deng, Lingzhu, Su, Meiying, Shih, Kuenho, Bock, Jayne E

“…The purpose of this study was to investigate the effects of reconstituted whole wheat flour (WWF) particle size on flour characteristics and northern-type…”
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Non-wet Simulation and risk prediction of 2.5D Package by Huang, Qianjin, Xu, Cheng, Su, Meiying, Dai, Fengwei, Sun, Peng, Cao, Liqiang

“…As one of the most popular multi-chip integration technologies, 2.5D package is of great significance in applications such as artificial intelligence, cloud…”
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Formaldehyde gas sensor based on SnO2/In2O3 hetero-nanofibers by a modified double jets electrospinning process by Du, Haiying, Wang, Jing, Su, Meiying, Yao, Pengjun, Zheng, Yangong, Yu, Naisen

“…SnO2/In2O3 hetero-nanofibers composite was synthesized by using a modified electrospinning system with double jets of positive and negative polarity electric…”
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Design, integration and performance analysis of a lid-integral microchannel cooling module for high-power chip by Chen, Chuan, Hou, Fengze, Ma, Rui, Su, Meiying, Li, Jun, Cao, Liqiang

“…•An LSMCM for a large-sized and high-power chip is fabricated.•The non-uniformity of flow velocity is 8% in the heat sink when the flow rate is 1 L/min.•The…”
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Review of Die-Attach Materials for SiC High-Temperature Packaging by Hou, Fengze, Sun, Zhanxing, Su, Meiying, Fan, Jiajie, You, Xiangan, Li, Jun, Wang, Qidong, Cao, Liqiang, Zhang, Guoqi

“…Silicon carbide (SiC) devices have shown definite advantages over Si counterparts in high-temperature, high-voltage, and high-frequency applications. To fully…”
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LncRNA DIRC1 is a novel prognostic biomarker and correlated with immune infiltrates in stomach adenocarcinoma by Lin, Yuning, Zhang, Zhongying, Li, Ying, Chen, Yongquan, Su, Meiying, Zhao, Wenzhen

“…The potential application value of Long non-coding RNA disrupted in renal carcinoma 1 (DIRC1) has not yet been explored, the purpose of this study was to…”
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Short implants (≤6 mm) versus longer implants with sinus floor elevation in atrophic posterior maxilla: a systematic review and meta-analysis by Yan, Qi, Wu, Xinyu, Su, Meiying, Hua, Fang, Shi, Bin

“…ObjectivesTo compare the use of short implants (≤6 mm) in atrophic posterior maxilla versus longer implants (≥10 mm) with sinus floor elevation.DesignA…”
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In Situ Local Band Engineering of Monolayer Graphene Using Triboelectric Plasma by Ruan, Haoran, Guo, Junmeng, Zhang, Song, Gao, Yanyuan, Shang, Wanyu, Liu, Yang, Su, Meiying, Liu, Yabing, Wang, Heng, Xie, Tianen, Cheng, Gang, Du, Zuliang

“…Graphene, a promising material with excellent properties, suffers from a major limitation in electronics due to its zero bandgap. The gas molecules adsorption…”
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Case-embedded cooling for high heat flux microwave multi-chip array by Song, Yunqian, Fu, Rong, Chen, Chuan, Wang, Qidong, Su, Meiying, Hou, Fengze, Zhang, Xiaobin, Li, Jun, Cao, Liqiang

“…•A case-embedded cooling is developed for microwave multi-chip module.•An analytical model is proposed to calculate thermal resistance.•The application range…”
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Simulation and Experimental Verification of Moisture Diffusion in Embedded Component Packages by Shi, Binjie, Su, Meiying, Ma, Rui, Chen, Chuan, You, Xiangan, Ding, Fei, Wang, Qidong, Cao, Liqiang

“…This study investigated moisture diffusion and moisture concentration distribution in embedded component packages (ECPs). Three polymeric materials, such as…”
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A flexible PI/graphene heterojunction optoelectronic device modulated by TENG and UV light for neuromorphic vision system by Guo, Junmeng, Yuan, Xiaobo, Ruan, Haoran, Duan, Yingfeng, Liu, Yang, Kong, Chuiyun, Liu, Yabing, Su, Meiying, Xie, Tianen, Wang, Heng, Xuan, Ningning, Liu, Wei, Yang, Feng, Zhang, Yongle, Cheng, Gang, Du, Zuliang

“…Artificial neural visual electronic devices have attracted great research interest in the fields of low-power and high-efficiency pattern recognition. However,…”
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Selection and Characterization of Photosensitive Polyimide for Fan-Out Wafer-Level Packaging by Gao, Rongwei, Ma, Rui, Li, Jun, Su, Meiying, Hou, Fengze, Cao, Liqiang

“…Fan-out wafer-level packaging (FOWLP) is one of the most popular microelectronics packaging technologies. Redistribution layers (RDLs) are employed to expand…”
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Thermal characterization of a novel 3D stacked package structure by CFD simulation by Cheng Chen, Delong Qiu, Fengze Hou, Fengman Liu, Meiying Su, Qidong Wang, Liqiang Cao, Lixi Wan

“…In this paper, a novel 3D stacked package structure with horizontal fins is designed to solve the heat dissipation issue. In order to verify the thermal…”
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Development of Y3+ and Mg2+-doped zirconia thick film humidity sensors by Su, Meiying, Wang, Jing, Hao, Yuwen

“…a- Y3+ doped and Mg2+ doped zirconia thick film humidity sensors were developed. a- The sensors exhibited high sensitivity, good linearity and small…”
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Heat transfer performance study of fluid rotating microchannel heat sink by Fan, Yu, Chen, Chuan, Fu, Rong, Wang, Qidong, Cao, Liqiang, Chen, Xinhua, Su, Meiying, Zhou, Yikang, Bu, Weihai, Zheng, Kai, Kang, Jin

“…The study presents a novel fluid rotating microchannel heat sink (FR-MC) and reports its heat transfer performance. The FR-MC features two cross ribs…”
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