Search Results - "Meier, P.C.H."

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  1. 1

    High-Speed Flex-Circuit Chip-to-Chip Interconnects by Braunisch, H., Jaussi, J.E., Mix, J.A., Trobough, M.B., Horine, B.D., Prokofiev, V., Daoqiang Lu, Baskaran, R., Meier, P.C.H., Dong-Ho Han, Mallory, K.E., Leddige, M.W.

    Published in IEEE transactions on advanced packaging (01-02-2008)
    “…High-speed chip-to-chip interconnect utilizing flex-circuit technology is investigated for extending the lifetime of copper-based system-level channels. Proper…”
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    Journal Article
  2. 2

    Flex-circuit chip-to-chip interconnects by Braunisch, H., Jaussi, J.E., Mix, J.A., Trobough, M.B., Horine, B.D., Prokofiev, V., Daoqiang Lu, Baskaran, R., Meier, P.C.H., Dong-Ho Han, Mallory, K.E., Leddige, M.W.

    “…High-speed chip-to-chip interconnect utilizing flex-circuit technology is investigated for extending the lifetime of copper-based system-level channels. Proper…”
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    Conference Proceeding
  3. 3

    Exploring multiplier architecture and layout for low power by Meier, P.C.H., Rutenbar, R.A., Carley, L.R.

    “…Multiplication represents a fundamental building block in all DSP tasks. Due to the large latency inherent in multiplication, schemes have been devised to…”
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    Conference Proceeding
  4. 4

    Inverse polarity techniques for high-speed/low-power multipliers by Meier, Pascal C. H., Rutenbar, Rob A., Carley, L. Richard

    “…Various high-speed techniques have been developed for multipliers, but with the increasing popularity of mobile computing, a recent goal has been to minimize…”
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    Conference Proceeding