Search Results - "Matsuoka, Fumitomo"
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Accurate Measurement of Silicide Specific Contact Resistivity by Cross Bridge Kelvin Resistor for 28 nm Complementary Metal--Oxide--Semiconductor Technology and Beyond
Published in Japanese Journal of Applied Physics (01-04-2011)“…In scaling down the device feature size, a reduction in parasitic resistance is inevitable in realizing a high-performance complimentary…”
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Optimization of Stress Memorization Technique for 45 nm Complementary Metal–Oxide–Semiconductor Technology
Published in Japanese Journal of Applied Physics (01-03-2009)Get full text
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The Impact of Technology Scaling for RF Complementary Metal–Oxide–Semiconductor
Published in Japanese Journal of Applied Physics (01-01-2009)Get full text
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Study of Unique ESD Tolerance Dependence on Backgate Ratio for RESURF LDMOS with Rated Voltage Variation
Published in 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) (30-05-2021)“…This paper describes that an unique ESD tolerance dependence on a backgate ratio of fully isolated RESURF LDMOS for various cases of rated voltage. For the…”
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Conference Proceeding -
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Investigation of the Breakdown Voltage Degradation under Hot-Carrier Injection in STI-based PchLDMOS Transistors
Published in 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01-09-2020)“…Hot-carrier injection causes characteristics change of semiconductor devices. In this work, off-state breakdown voltage (BVdss) degradation of shallow trench…”
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Investigating the Highly Tolerant LDMOS Cell Array Design against the Negative Carrier Injection and the ESD Events
Published in 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01-09-2020)“…Optimum LDMOS array layout design is proposed which is tolerant against not only the negative carrier injection but also the ESD events. Both are indispensable…”
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Hot-carrier induced off-state leakage current increase of LDMOS and approach to overcome the phenomenon
Published in 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01-05-2018)“…We found and reported the unique drastic Ioff increase of LDMOS caused by HC induced trapped charge in the STI under the off-state condition. In this paper, we…”
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Conference Proceeding -
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HBM robustness optimization of fully isolated Nch-LDMOS for negative input voltage using unique index parameter
Published in 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD) (01-05-2017)“…To overcome the trade-off between breakdown voltage to negative bias and HBM robustness in fully isolated Nch-LDMOS, we found and utilized a new unique…”
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Counter-Doped Surface Channel Metal-Oxide-Semiconductor Field-Effect Transistor with High Current Drivability and Steep Subthreshold Slope
Published in Japanese Journal of Applied Physics (01-10-1998)“…A metal-oxide-semiconductor field-effect transistor (MOSFET) with a novel channel structure called a counter-doped surface channel (CDSC) is proposed. A unique…”
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Design Method and Mechanism Study of LDMOS to Conquer Stress Induced Degradation of Leakage Current and HTRB Reliability
Published in 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01-05-2019)“…8V NchLDMOS, which has an enough tolerance against both a leakage current (Idss) increase and high temperature reverse bias (HTRB) degradation is proposed…”
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Novel procedure to improve LDMOS ESD characteristics by optimizing drain structure
Published in 2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01-06-2016)“…Novel procedure to realize a high ESD robustness with small variation for 40V p-ch LDMOS is proposed. By optimizing the drain structure, current flow path…”
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Supply and threshold-Voltage trends for scaled logic and SRAM MOSFETs
Published in IEEE transactions on electron devices (01-06-2006)“…The authors show new guidelines for V/sub dd/ and threshold voltage (V/sub th/) scaling for both the logic blocks and the high-density SRAM cells from low…”
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Layout Dependence Modeling for 45-nm CMOS With Stress-Enhanced Technique
Published in IEEE transactions on electron devices (01-09-2009)“…Layout dependences for stress-enhanced MOSFETs including contact positioning, the second neighboring poly effect, and bent diffusion are modeled in 45-nm CMOS…”
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Low-resistivity poly-metal gate electrode durable for high-temperature processing
Published in IEEE transactions on electron devices (01-11-1996)“…A new low-resistivity poly-metal gate structure, W/WSiN/poly-Si, is proposed, A uniform ultrathin (<1 nm) WSiN barrier layer was formed by annealing a W(100…”
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Increase of parasitic resistance in shallow p super(+) extension by SiN sidewall process and its improvement by Ge preamorphization for sub-0.25- mu m pMOSFET's
Published in IEEE transactions on electron devices (01-01-1999)“…Anomalously high parasitic resistance is observed when SiN gate sidewall spacer is incorporated into sub-0.25- mu m pMOSFET's. The parasitic resistance in p…”
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Dual-polycide gate technology using regrowth amorphous-Si to suppress lateral dopant diffusion
Published in IEEE transactions on electron devices (01-09-1997)“…Process techniques for dual-polycide gate CMOS have been developed. The origin of lateral dopant diffusion is analyzed, and an enlarged-grain dual-polycide…”
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Analysis of hot-carrier-induced degradation mode on pMOSFET's
Published in IEEE transactions on electron devices (01-06-1990)“…Hot-carrier-induced degradation surface-channel (p/sup +/ polysilicon gate) and buried-channel (n/sup +/ polysilicon gate) pMOSFETs is discussed. In the…”
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Drain structure optimization for highly reliable deep submicrometer n-channel MOSFET
Published in IEEE transactions on electron devices (01-03-1994)“…A guideline for n/sup /spl minus// fully gate overlapped (FOLD) structure design optimization has been studied. From the viewpoint of reliability, the greatest…”
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Analysis on gate-oxide thickness dependence of hot-carrier-induced degradation in thin-gate oxide nMOSFET's
Published in IEEE transactions on electron devices (01-06-1990)“…The analysis indicates that a thinner gate oxide nMOSFET shows smaller degradation. Mechanisms for the smaller degradation were analyzed using a simple…”
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