Search Results - "Masuda, Takatoshi"

Warpage Reduction and Thermal Stress Study of Dicing Process in Wafer-to-Wafer Bonding Fabrication by Feng, Wei, Shimamoto, Haruo, Kawagoe, Tsuyoshi, Honma, Ichirou, Yamasaki, Masato, Okutsu, Fumitake, Masuda, Takatoshi, Kikuchi, Katsuya

“…We successfully study the warpage after wafer-to-wafer (W2W) bonding by the experiments and the full wafer model simulation. Furthermore, the effect of the…”
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Wafer-to-Wafer Bonding Fabrication Process-Induced Wafer Warpage by Feng, Wei, Shimamoto, Haruo, Kawagoe, Tsuyoshi, Honma, Ichirou, Yamasaki, Masato, Okutsu, Fumitake, Masuda, Takatoshi, Kikuchi, Katsuya

“…Wafer warpage affects the resolution of photolithography, process alignment, and wafer bonding, which leads to the degradation of the device's yield,…”
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Study of wafer warpage reduction by dicing street by Feng, Wei, Shimamoto, Haruo, Kawagoe, Tsuyoshi, Honma, Ichirou, Yamasaki, Masato, Okutsu, Fumitake, Masuda, Takatoshi, Kikuchi, Katsuya

“…Wafer warpage occurs during the fabrication process, which induces many issues such as wafer handling, lithography alignment, device reliability. The…”
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Multi Die Stacked Structure Fabricated by WoW Bonding by Shimamoto, Haruo, Araga, Yuuki, Fujino, Masahisa, Watanabe, Naoya, Takahashi, Kenji, Kikuchi, Katsuya, Kawagoe, Tsuyoshi, Homma, Ichiro, Masuda, Takatoshi

“…To achieve 2-die stacking process, fusion bonding technology was applied for Wafer on Wafer (WoW) by each oxide film, and Through Silicon Via (TSV) was used to…”
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