Search Results - "Marinis, T.F."
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Design and characterization of wirebonds for use in high shock environments
Published in 2009 59th Electronic Components and Technology Conference (01-05-2009)“…MEMS inertial sensors, packaged in hermetic chip carriers, utilize free standing wirebonds to connect to the package I/O pads. Considerable care is taken in…”
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Conference Proceeding
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Development of packaging for MEMS inertial sensors
Published in PLANS 2004. Position Location and Navigation Symposium (IEEE Cat. No.04CH37556) (2004)“…Development of MEMS inertial sensors and their packaging for high performance applications requires a balanced approach combining analyses with testing and…”
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Conference Proceeding -
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Vacuum sealed MEMS package with an optical window
Published in 2008 58th Electronic Components and Technology Conference (01-05-2008)“…A vacuum sealed package with an optical window is a useful diagnostic tool for MEMS devices as well as a critical component of optical devices, such as imaging…”
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Conference Proceeding -
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Isolation of MEMS devices from package stresses by use of compliant metal interposers
Published in 56th Electronic Components and Technology Conference 2006 (2006)“…Many classes of MEMS devices, such as those with resonant structures, capacitive readouts, and diaphragm elements, are sensitive to stresses that are exerted…”
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Conference Proceeding -
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Wafer level vacuum packaging of MEMS sensors
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)“…A process has been developed for wafer level vacuum packaging MEMS sensors, which are fabricated from etched, single crystal silicon structures, anodically…”
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Conference Proceeding -
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Time-Lapse Measurements of Stress Relaxation in MEMS Sensor Die Bonds
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01-05-2007)“…Thermal compression gold bumps have been used to attach high-precision MEMS inertial sensors within hermetic ceramic packages. The bonds can be made at…”
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Conference Proceeding -
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Gold bump attachment-of MEM sensor die using thermocompression bonding
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)Get full text
Conference Proceeding -
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Molded hybrid IC packages
Published in Proceedings., 39th Electronic Components Conference (1989)“…AT&T's new system products will incorporate hybrid ICs with significantly more I/O connections than current designs, predominantly in surface-mount package…”
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Conference Proceeding -
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Molded hybrid IC packages
Published in IEEE transactions on components, hybrids, and manufacturing technology (01-12-1989)“…A family of plastic molded packages that conform to JEDEC standards for hybrid IC applications is being developed by providing a number of benefits. System…”
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Journal Article Conference Proceeding