Search Results - "Mantysalo, M."

Integration of Supercapacitors to Trigger In-Situ Electropolymerization for Irreversible Visual Indicators by Howard, E. L., Pourkheirollah, H., Pinheiro, C., Laia, C. A. T., Parola, A. J., Mantysalo, M., Lupo, D.

“…Printed supercapacitors (SCs) are demonstrated to activate 1\ \mathrm{x} \ 1 cm2 Irreversible Visual Indicators (IVIs) based on four different monomer systems:…”
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Extraction and filtering in ultrasonic field: finite element modelling and simulation of the processes by Mantysalo, M, Mantysalo, E

“…In this research, the use of powerful sonification is studied in making the extraction of tannins more efficient. A combined extraction–filtration system using…”
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Molded Substrates for Inkjet Printed Modules by Miettinen, J., Kaija, K., Mantysalo, M., Mansikkamaki, P., Kuchiki, M., Tsubouchi, M., Ronkka, R., Hashizume, K., Kamigori, A.

“…Ever increasing demand for high-performance, miniaturized, low-cost, and more environmentally conscious targets set high requirements for electronics packaging…”
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Nanocellulose films as substrates for printed electronics by Pammo, A., Christophliemk, H., Keskinen, J., Bjorkqvist, T., Siljander, S., Mantysalo, M., Tuukkanen, S.

“…Microfibrillated cellulose (MFC) was fabricated from cellulose pulp using in-house mechanical fibrillation equipment. Subsequently, freestanding MFC films were…”
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Oven Sintering Process Optimization for Inkjet-Printed Ag Nanoparticle Ink by Halonen, E., Viiru, T., Ostman, K., Cabezas, A. L., Mantysalo, M.

“…This paper focuses on optimizing the oven sintering time and temperature for inkjet-printed silver nanoparticle ink on a polyimide substrate. Two basic aspects…”
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RF Design for Inkjet Technology: Antenna Geometries and Layer Thickness Optimization by Pynttari, V., Halonen, E., Sillanpaa, H., Mantysalo, M., Makinen, R.

“…The suitability of local conductive print-layer thickness variation for RF applications is demonstrated on flexible substrates. First, the concept is subjected…”
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System design issues for 3D system-in-package (SiP) by Miettinen, J., Mantysalo, M., Kaija, K., Ristolainen, E.O.

“…Development in electronics is driven by device and market needs. This paper focuses on system design issues for three-dimensional packaging technology and…”
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Heterogeneous Integration of Bio-Sensing System-on-Chip and Printed Electronics by Li Xie, Geng Yang, Mantysalo, M., Lin-Lin Xu, Jonsson, F., Li-Rong Zheng

“…In this paper, we present a heterogeneous integration platform for bio-sensing applications, which seamlessly integrates low-power silicon-based circuits with…”
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Modeling and analyzing vertical interconnections by Mantysalo, M., Ristolainen, E.O.

“…Continual interest in miniaturization is driving electronic packaging toward three-dimensional (3-D) structures and system integration. Utilization of a third…”
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Inkjet-Printed RF Structures on BST-Polymer Composites: An Application of a Monopole Antenna for 2.4 GHz Wireless Local Area Network Operation by Palukuru, Vamsi K., Sanoda, Kensaku, Pynttäri, Vesa, Hu, Tao, Mäkinen, Riku, Mäntysalo, Matti, Hagberg, Juha, Jantunen, Heli

“…In this study, 0–3 ceramic–polymer composite substrates are utilized in RF applications in combination with inkjet printing technology. The substrates were…”
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Ultra high-frequency characterization of high-density 3D module by Mantysalo, M., Tanskanen, J., Ristolainen, E.O.

“…With three-dimensional (3D) packaging technology it is possible to achieve a much smaller package size and weight and a higher integration rate than with…”
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Drying-Mediated Self-Assembly of Graphene for Inkjet Printing of High-Rate Micro-supercapacitors by Sollami Delekta, Szymon, Laurila, Mika-Matti, Mäntysalo, Matti, Li, Jiantong

“…Highlights Based on the drying-mediated self-assembly behavior of passivated graphene, a new kind of 2D micro-flake inks is developed to directly print…”
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Highly Flexible Environmentally friendly Printed Supercapacitors by Kraft, T. M., Kujala, M., Railanmaa, A., Lehtimaki, S., Kololuoma, T., Keskinen, J., Lupo, D., Mantvsalo, M.

“…In this study, we propose a highly flexible environmentally friendly supercapacitor suitable for low-power Internet-of- Everything applications and the effect…”
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A system-on-chip and paper-based inkjet printed electrodes for a hybrid wearable bio-sensing system by Li Xie, Geng Yang, Mantysalo, M., Jonsson, F., Li-Rong Zheng

“…This paper presents a hybrid wearable bio-sensing system, which combines traditional small-area low-power and high-performance System-on-Chip (SoC), flexible…”
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Inkjet printed flexible user interface module by Koskinen, S., Pykari, L., Mantysalo, M.

“…Environmental aspects and the trend towards sustainable development in the electronics industry are very strong business drivers in selecting technologies for…”
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System integration of smart packages using printed electronics by Mantysalo, M., Li Xie, Jonsson, F., Yi Feng, Cabezas, A. L., Li-Rong Zheng

“…The last decade has shown enormous interest in additive and printed electronics manufacturing technologies, especially in intelligent packaging. Scientists and…”
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Influence of dietary protein level and the amino acids methionine and lysine on leather properties of blue fox (Alopex lagopus) pelts by Dahlman, Tuula, Mäntysalo, Marja, Rasmussen, Palle V, Skovløkke, L L

“…The influence of dietary protein, methionine, and lysine on leather quality in blue fox pelts was studied. The pelt material originated from animals in two…”
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Dynamic bending test analysis of inkjet-printed conductors on flexible substrates by Halonen, E., Halme, A., Karinsalo, T., Iso-Ketola, P., Mantysalo, M., Makinen, R.

“…The need to optimize space in electronic devices has made flexible electronics an attractive option for manufacturing electronics. Techniques to fabricate…”
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Capability of inkjet technology in electronics manufacturing by Mantysalo, M., Pekkanen, V., Kaija, K., Niittynen, J., Koskinen, S., Halonen, E., Mansikkamaki, P., Hameenoja, O.

“…The past decade has seen a growing interest in additive manufacturing and printable electronics. The main markets are expected to be among low-cost mass…”
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The effect of sintering profile and printed layer variations with inkjet-printed large-area applications by Pynttari, V., Halonen, E., Mantysalo, M., Makinen, R.

“…Inkjet-printed conductors with large areas and increased layer thickness may cause challenges with the materials applied. The possibly required increased…”
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