Search Results - "Mannan, S"
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Microstructure evolution during 300°C storage of sintered Ag nanoparticles on Ag and Au substrates
Published in Journal of alloys and compounds (25-12-2014)“…•Shear strength of pressure-free sintered Ag found to increase during ageing at 300°C on Ag substrate.•Rapid collapse of void number density after 24h ageing…”
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2
Effect of hot corrosion on low cycle fatigue behavior of superalloy IN718
Published in International journal of fatigue (01-02-2014)“…•LCF behavior of the alloy 718, with salt coating, showed drastic reduction in fatigue life at 650°C.•Combined effect of cyclic stress and salts broken the…”
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3
Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates
Published in Journal of alloys and compounds (15-01-2012)“…► Systematic investigation on the Sn–3.8Ag–0.7Cu (SAC) solder alloy with Zn addition on Cu and Ni–P (ENIG) substrates. ► Intermetallic compounds (IMCs) growth…”
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Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys
Published in Journal of electronic materials (01-05-2019)“…In this study, Sn-Zn solder samples containing 2 to 12 wt.% Zn were fabricated and reflowed into a Cu substrate. The microstructure of solder samples was…”
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5
Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects
Published in Acta materialia (01-06-2006)“…This paper reports on the interfacial reaction kinetics between molten Sn–58Bi solder and Cu substrates for extended temporal scales. Also studied are the…”
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6
Chronic stress, depression and personality type in patients with myasthenia gravis
Published in European journal of neurology (01-01-2020)“…Background and purpose Stress is a known risk factor for the onset and modulation of disease activity in autoimmune disorders. The aim of this cross‐sectional…”
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Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods
Published in Scientific reports (21-04-2021)“…With the ever-reducing sizes of electronic devices, the problem of electromigration (EM) has become relevant and requires attention. However, only the EM…”
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Defining symptoms of malaria in India in an era of asymptomatic infections
Published in Malaria journal (06-07-2020)“…Malaria is a major public health problem in India. Data from surveys totaling 3031 participants at three sites revealed a high proportion of asymptomatic…”
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Saccadic visual search training: a treatment for patients with homonymous hemianopia
Published in Journal of neurology, neurosurgery and psychiatry (01-10-2004)“…Objectives: We describe a novel rehabilitation tool for patients with homonymous hemianopia based on a visual search (VS) paradigm that is portable,…”
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10
Diagnosis of gestational diabetes during the pandemic: what is the risk of falling through the net?
Published in Diabetic medicine (01-10-2020)Get full text
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11
Low cycle fatigue behavior and microstructural evolution of modified 9Cr–1Mo ferritic steel
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15-11-2006)“…In the present paper, influence of hold time on the high temperature low cycle fatigue (LCF) behavior of modified 9Cr–1Mo ferritic steel in the normalized and…”
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Microstructure and mechanical properties of Inconel 625 superalloy
Published in Journal of nuclear materials (01-02-2001)“…The service-exposed (∼60 000 h/873 K) Alloy 625 ammonia cracker tubes showed higher strength and lower ductility compared to the virgin material in the…”
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13
High-temperature low cycle fatigue, creep–fatigue and thermomechanical fatigue of steels and their welds
Published in International journal of mechanical sciences (01-02-2006)“…High-temperature low cycle fatigue (LCF) is influenced by various time-dependent processes such as creep, oxidation, phase transformations and dynamic strain…”
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14
Influence of hot corrosion on low cycle fatigue behavior of nickel base superalloy SU 263
Published in International journal of fatigue (01-06-2013)“…► LCF life is reduced for all values of Δεt/2 in HC atmosphere compared to air. ► The hot salt deposit sporadically destroys the protective chromium oxide…”
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15
In situ observation of fatigue crack retardation in banded ferrite–pearlite microstructure due to crack branching
Published in Scripta materialia (01-06-2006)“…This paper reports the results of in situ observation of fatigue crack growth in a ferrite–pearlite steel. Stress intensity factor range (Δ K)…”
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16
Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates
Published in Journal of electronic materials (01-12-2010)“…In this study we consider the effect of separately adding 0.5 wt.% to 1.5 wt.% Zn or 0.5 wt.% to 2 wt.% Al to the eutectic Sn-3.5Ag lead-free solder alloy to…”
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Characterization of microstructures across the heat-affected zone of the modified 9Cr-1mo weld joint to understand its role in promoting type IV cracking
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (2007)“…In the postweld heat-treated (PWHT) fusion welded modified 9Cr-1Mo steel joint, a soft zone was identified at the outer edge of the heat-affected zone (HAZ) of…”
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18
Assessing the date of the global oil peak: The need to use 2P reserves
Published in Energy policy (01-12-2007)“…Combining geological knowledge with proved plus probable (‘2P’) oil discovery data indicates that over 60 countries are now past their resource-limited peak of…”
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Optimisation of cold and warm workability of commercially pure titanium using dynamic materials model (DMM) instability maps
Published in Journal of materials processing technology (20-06-2008)“…The deformation characteristics of commercially pure titanium under compression in the temperature range from 303 K to 573 K (30–300 °C) and at strain rates…”
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Electromigration in Sn–Ag solder thin films under high current density
Published in Thin solid films (28-08-2014)“…The electro-migration behavior of a Sn–Ag solder thin film stripe that is deposited on a glass substrate has been investigated under a high current density in…”
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