Search Results - "Mangiagalli, P."

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  1. 1

    Role of Preload in Adhesion of Rough Surfaces by Dorogin, L, Tiwari, A, Rotella, C, Mangiagalli, P, Persson, B N J

    Published in Physical review letters (09-06-2017)
    “…Adhesion between glass and bromobutyl and polydimethylsiloxane elastomers is investigated. We show that viscoelastic energy dissipation close to the opening…”
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    Journal Article
  2. 2

    Air, Helium and Water Leakage in Rubber O-ring Seals with Application to Syringes by Huon, C., Tiwari, A., Rotella, C., Mangiagalli, P., Persson, B. N. J.

    Published in Tribology letters (01-06-2022)
    “…We study the leakage of fluids (liquids or gases) in syringes with glass barrel, steel plunger and rubber O-ring stopper. The leakrate depends on the…”
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    Journal Article
  3. 3

    Lubricated sliding friction: Role of interfacial fluid slip and surface roughness by Rotella, C., Persson, B. N. J., Scaraggi, M., Mangiagalli, P.

    “… We derive approximate mean field equations for the fluid flow between elastic solids with randomly rough surfaces including interfacial fluid slip and shear…”
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    Journal Article
  4. 4

    Elastic contact mechanics: Percolation of the contact area and fluid squeeze-out by Persson, B. N. J., Prodanov, N., Krick, B. A., Rodriguez, N., Mulakaluri, N., Sawyer, W. G., Mangiagalli, P.

    “…The dynamics of fluid flow at the interface between elastic solids with rough surfaces depends sensitively on the area of real contact, in particular close to…”
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    Journal Article
  5. 5

    Role of hydrophobicity on interfacial fluid flow: Theory and some applications by Lorenz, B., Rodriguez, N., Mangiagalli, P., Persson, B. N. J.

    “…The fluid flow through a seal interface depends on the percolating non-contact channels morphology, size and length, and on the interfacial surface energies…”
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    Journal Article
  6. 6

    Plasma etching of HfO2 at elevated temperatures in chlorine-based chemistry by Hélot, M., Chevolleau, T., Vallier, L., Joubert, O., Blanquet, E., Pisch, A., Mangiagalli, P., Lill, T.

    “…Plasma etching of HfO2 at an elevated temperature is investigated in chlorine-based plasmas. Thermodynamic studies are performed in order to determine the most…”
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    Journal Article
  7. 7

    An industrial SR TXRF facility at ESRF by Comin, F, Navizet, M, Mangiagalli, P, Apostolo, G

    “…A TXRF industrial facility for the mapping of trace impurities on the surface of 300 mm Silicon wafers is presently under construction at the ESRF, European…”
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    Journal Article
  8. 8

    Novel dielectric capping layer approach for advanced copper interconnects using chemical grafting by Bispo, I., Couturier, B., Haumesser, P.H., Mangiagalli, P., Monchoix, H., Passemard, G., Peyne, C., Roy, S., Thieriet, N., Rabinzohn, P., Bureau, C.

    Published in Microelectronic engineering (01-11-2006)
    “…Due to its low bulk resistivity copper has become the material of choice for ULSI interconnects. However its high diffusivity in dielectrics and weak chemical…”
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    Journal Article Conference Proceeding
  9. 9

    A comparative study of induced damage after irradiation with swift heavy ions, neutrons and electrons in low doped silicon by Mangiagalli, P, Levalois, M, Marie, P

    “…A systematic study has been performed, investigating the radiation damage in high purity low doped silicon. During this study we irradiated bulk silicon…”
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    Journal Article
  10. 10

    Swift heavy ion radiation damage on high resistivity silicon by Mangiagalli, P., Levalois, M., Marie, P., Rancoita, P.G., Rattaggi, M.

    “…Silicon radiation damage was investigated after irradiation with 6.7 MeV/a 36 Ar up to a fluence of 10 14 ions/cm 2. Hall effect, DLTS, PL and IR absorption…”
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    Journal Article
  11. 11

    An industrial SR-TXRF facility at ESRF by Comin, F, Mangiagalli, P, Navizet, M, Apostolo, G

    Published in Microelectronic engineering (01-07-1999)
    “…A TXRF industrial facility for the mapping of trace impurities on the surface of 300-mm Silicon wafers is presently in the construction phase and will start…”
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    Journal Article
  12. 12

    DnaK Prevents Human Insulin Amyloid Fiber Formation on Hydrophobic Surfaces by Ballet, Thomas, Brukert, Franz, Mangiagalli, Paolo, Bureau, Christophe, Boulangé, Laurence, Nault, Laurent, Perret, Thomas, Weidenhaupt, Marianne

    Published in Biochemistry (Easton) (20-03-2012)
    “…We have developed a multiwell-based protein aggregation assay to study the kinetics of insulin adsorption and aggregation on hydrophobic surfaces and to…”
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    Journal Article
  13. 13

    Viscoelastic crack propagation: review of theories and applications by Rodriguez, N, Mangiagalli, P, Persson, B. N. J

    Published 10-09-2020
    “…We review a theory of crack propagation in viscoelastic solids. We consider both cracks in infinite systems and in finite sized systems. As applications of the…”
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    Journal Article
  14. 14

    Air, helium and water leakage in rubber O-ring seals with application to syringes by Huon, C, Tiwari, A, Rotella, C, Mangiagalli, P, Persson, B. N. J

    Published 20-10-2021
    “…We study the leakage of fluids (liquids or gases) in syringes with glass barrel, steel plunger and rubber O-ring stopper. The leakrate depends on the…”
    Get full text
    Journal Article
  15. 15

    Plasma etching of Hf O 2 at elevated temperatures in chlorine-based chemistry by Hélot, M., Chevolleau, T., Vallier, L., Joubert, O., Blanquet, E., Pisch, A., Mangiagalli, P., Lill, T.

    “…Plasma etching of Hf O 2 at an elevated temperature is investigated in chlorine-based plasmas. Thermodynamic studies are performed in order to determine the…”
    Get full text
    Journal Article
  16. 16

    Etching mechanisms of low-k SiOCH and selectivity to SiCH and SiO 2 in fluorocarbon based plasmas by Posseme, N., Chevolleau, T., Joubert, O., Vallier, L., Mangiagalli, P.

    “…This study is dedicated to an analysis of the etch mechanisms of SiOCH, SiO 2 and SiCH in fluorocarbon plasmas. The etching of these materials is performed on…”
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    Journal Article
  17. 17

    Dual damascene trench depth control by Irm/spl trade/: a novel interferometric endpoint system by Mangiagalli, P., Chevolleau, T., Posseme, N., Frum, C., Sabnani, L., Sui, Z., Assous, M.

    “…Etching dielectric trenches on the wafer for copper interconnect without using a middle etch stop layer is becoming part of mainstream wafer fabrication…”
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    Conference Proceeding
  18. 18

    An evaluation of electrografted copper seed layers for enhanced metallization of deep TSV structures by Ledain, S., Bunel, C., Mangiagalli, P., Carles, A., Frederich, N., Delbos, E., Omnes, L., Etcheberry, A.

    “…In this paper, we present an evaluation of electrografted seed layers as an alternative metallization route to usual PVD liners for deep Through Silicon Vias…”
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    Conference Proceeding
  19. 19

    Cranial defects repair by replacing bone flaps by Crotti, F M, Mangiagalli, E P

    Published in Journal of neurosurgical sciences (01-10-1979)
    “…The Authors, after few historical remarks, discuss the indications and the contra-indications for cranioplasty. Although, in the last 30 years, various…”
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    Journal Article
  20. 20

    Supracondyloid process and anomalous insertion of pronator teres as sources of median nerve neuralgia by Crotti, F M, Mangiagalli, E P, Rampini, P

    Published in Journal of neurosurgical sciences (01-01-1981)
    “…A case of median nerve entrapment at the elbow between the supracondyloid process and the anomalous origin of the pronator teres on it is presented. The…”
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    Journal Article