Search Results - "Majumdar, B. S."

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  1. 1

    Texture development and strain hysteresis in a NiTi shape-memory alloy during thermal cycling under load by Ye, B., Majumdar, B.S., Dutta, I.

    Published in Acta materialia (01-05-2009)
    “…Thermal cycling experiments were conducted on a NiTi shape-memory alloy at different constant applied stresses below the yield strength of the martensite. The…”
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    Journal Article
  2. 2

    Chemo‐mechanical Alterations Induced From CO2 Injection in Carbonate‐Cemented Sandstone: An Experimental Study at 71 °C and 29 MPa by Wu, Z., Luhmann, A. J., Rinehart, A. J., Mozley, P. S., Dewers, T. A., Heath, J. E., Majumdar, BS.

    “…Carbon capture, utilization, and storage may lead to mechanical degradation of the subsurface reservoir from fluid‐rock interaction, which could lead to…”
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    Journal Article
  3. 3

    Microstress evolution during in situ loading of a superalloy containing high volume fraction of γ ′ phase by Ma, S., Rangaswamy, P., Majumdar, B.S.

    Published in Scripta materialia (01-03-2003)
    “…Pulsed neutron diffraction under in situ mechanical loading was used to monitor microstrain evolution in individual phases of a polycrystalline γ/γ ′…”
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    Journal Article
  4. 4

    Application of the Raman technique to measure stress states in individual Si particles in a cast Al–Si alloy by Harris, Stephen J., O’Neill, Ann, Boileau, James, Donlon, William, Su, Xuming, Majumdar, B.S.

    Published in Acta materialia (01-03-2007)
    “…While Raman spectroscopy is often used to measure stresses, the analyses are almost always limited to cases with simple stress states (uniaxial, equibiaxial)…”
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    Journal Article
  5. 5

    A molecular dynamics evaluation of the effect of dopant addition on grain boundary diffusion in tin: Implication for whisker growth by Banerjee, S., Dutta, I., Majumdar, B.S.

    “…Addition of lead dopant has been known to be an effective way of mitigating whisker growth in tin. However, the toxic nature of lead has necessitated a search…”
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  6. 6

    Thermomechanical response of a lead-free solder reinforced with a shape memory alloy by Wang, Z.X., Dutta, I., Majumdar, B.S.

    Published in Scripta materialia (01-02-2006)
    “…In order to improve solder joint life, we have experimented with a lead-free solder reinforced with a NiTi shape memory alloy (SMA). Concept viability was…”
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    Journal Article
  7. 7

    Eliminating Whisker Growth by Indium Addition in Electroplated Sn on Copper Substrate by Das Mahapatra, S., Majumdar, B. S., Dutta, I., Bhassyvasantha, S.

    Published in Journal of electronic materials (01-07-2017)
    “…Whisker growth from Sn coatings is a reliability concern in electronic packages, until recently mitigated by Pb addition. Recently, it was demonstrated that…”
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  8. 8

    Laminated particulate-reinforced aluminum composites with improved toughness by Miracle, D.B., Pandey, A.B., Majumdar, B.S.

    Published in Acta materialia (08-02-2001)
    “…An architectural approach for toughening discontinuously reinforced aluminum (DRA) alloys is described. It is based upon exploiting the higher apparent…”
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    Journal Article
  9. 9

    Influence of Indium Addition on Whisker Mitigation in Electroplated Tin Coatings on Copper Substrates by Meinshausen, L., Bhassyvasantha, S., Majumdar, B. S., Dutta, I.

    Published in Journal of electronic materials (01-01-2016)
    “…Among many factors that influence whisker nucleation and growth in electroplated tin, it is now well established that small additions of Pb leads to whisker…”
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    Journal Article
  10. 10

    Development of a novel adaptive lead-free solder containing reinforcements displaying the shape-memory effect by DUTTA, I, MAJUMDAR, B. S, PAN, D, HORTON, W. S, WRIGHT, W, WANG, Z. X

    Published in Journal of electronic materials (01-04-2004)
    “…Microelectronic solder joints are typically exposed to aggressive thermomechanical cycling (TMC) conditions during service. During TMC, strain localization…”
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    Journal Article
  11. 11

    Thermal cycle response of a lead-free solder reinforced with adaptive shape memory alloy by Wang, Z.X., Dutta, I., Majumdar, B.S.

    “…Shape memory alloy (SMA) discontinuous reinforcements in a solder matrix have the potential to reduce inelastic strains and improve thermo-mechanical fatigue…”
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    Journal Article
  12. 12

    Role of shape-memory alloy reinforcements on strain evolution in lead- free solder joints by DUTTA, I, PAN, D, MA, S, MAJUMDAR, B. S, HARRIS, S

    Published in Journal of electronic materials (01-10-2006)
    “…Microelectronic solder joints are exposed to aggressive thermomechanical cycling (TMC) during service, resulting in strain localization near solder/bond-pad…”
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  13. 13

    Whisker Mitigation Mechanisms in Indium-Doped Tin Thin Films: Role of the Surface by Bhassyvasantha, S., Fredj, N., Mahapatra, S. D., Jennings, W., Dutta, I., Majumdar, B. S.

    Published in Journal of electronic materials (01-10-2018)
    “…The effect of indium doping on whisker mitigation in tin electroplated on copper has been investigated. Whisker growth studies show that indium addition to Sn…”
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    Journal Article
  14. 14

    Deformation and fracture of a particle-reinforced aluminum alloy composite: Part I. Experiments by Pandey, A. B., Majumdar, B. S., Miracle, D. B.

    “…Mechanical tests were performed on a powder-metallurgically processed 7093/SiC/15p discontinuously reinforced aluminum (DRA) composite in different…”
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    Journal Article
  15. 15

    Tribology of single crystal nickel: Interplay of crystallography, microstructural evolution, and friction by Prasad, S.V., Michael, J.R., Battaile, C.C., Majumdar, B.S., Kotula, P.G.

    Published in Wear (15-10-2020)
    “…This paper describes the evolution of friction-induced microstructures underneath the wear surfaces of nickel single crystals, and their role in influencing…”
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  16. 16

    Recent Advances in Mitigation of Whiskers from Electroplated Tin by Majumdar, B. S., Dutta, I., Bhassyvasantha, S., Das Mahapatra, S.

    Published in JOM (1989) (01-02-2020)
    “…Tin whiskers pose an electrical reliability risk in the form of potential short circuits. This problem was solved in the past by adding a few percent of Pb…”
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  17. 17

    Magnetocaloric response of non-stoichiometric Ni2MnGa alloys and the influence of crystallographic texture by McLeod, M.V., Giri, A.K., Paterson, B.A., Dennis, C.L., Zhou, L., Vogel, S.C., Gourdon, O., Reiche, H.M., Cho, K.C., Sohn, Y.H., Shull, R.D., Majumdar, B.S.

    Published in Acta materialia (15-09-2015)
    “…The picture portrays the influence of martensite texture on the magnetocaloric effect of alloy x=0.16, which exhibited the best coincidence of structural and…”
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  18. 18

    Interface effects on crack deflection and bridging during fatigue crack growth of titanium matrix composites by Warrier, S.G., Majumdar, B.S., Miracle, D.B.

    Published in Acta materialia (01-12-1997)
    “…The effect of the interface on the crack deflection and crack bridging behavior of continuous fiber-reinforced titanium matrix composites has been investigated…”
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  19. 19

    Chemo‐mechanical Alterations Induced From CO 2 Injection in Carbonate‐Cemented Sandstone: An Experimental Study at 71 °C and 29 MPa by Wu, Z., Luhmann, A. J., Rinehart, A. J., Mozley, P. S., Dewers, T. A., Heath, J. E., Majumdar, BS.

    “…Carbon capture, utilization, and storage may lead to mechanical degradation of the subsurface reservoir from fluid‐rock interaction, which could lead to…”
    Get full text
    Journal Article
  20. 20

    Effect of aluminum particles on the fracture toughness of a 7093/SiC/15p composite by Pandey, A.B., Majumdar, B.S., Miracle, D.B.

    “…The effects of Al-particles on the toughness of a discontinuously reinforced aluminum (DRA) alloy composite were studied in this investigation. A powder…”
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    Journal Article Conference Proceeding