Search Results - "Magis, Thomas"
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1S1R Optimization for High‐Frequency Inference on Binarized Spiking Neural Networks
Published in Advanced electronic materials (01-08-2022)“…Single memristor crossbar arrays are a very promising approach to reduce the power consumption of deep learning accelerators. In parallel, the emerging…”
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Journal Article -
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Through silicon via process characterization by integrated inspection/metrology solutions in visible and infrared domain
Published in 2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01-05-2015)“…In this paper, we present an integrated in-line solution, combining automatic visual inspection/classification with unique 2D/3D measurement technologies,…”
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Conference Proceeding -
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Electrical Performance of Self-Assembly Applied to Die-to-Wafer Hybrid Bonding
Published in 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (11-09-2024)“…Self-assembly process is a promising solution to improve throughput of Die-to-Wafer direct hybrid bonding process while maintaining fine alignment. This paper…”
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Conference Proceeding -
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1S1R Sub-Threshold Operation in Crossbar Arrays for Neural Networks Hardware Implementation
Published in 2023 30th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) (29-06-2023)“…This paper presents an outlook of Crossbar memory array capabilities while operated in the sub-threshold regime. By means of experimental data obtained on a…”
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Conference Proceeding -
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Design and fabrication of an ultra-thin silicon vapor chamber for compact electronic cooling
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01-06-2020)“…This paper presents the design and the fabrication of an ultra-thin vapor chamber exclusively composed of silicon, aimed to be integrated in microelectronic…”
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Conference Proceeding -
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Phase-Change Memory: Performance, Roles and Challenges
Published in 2018 IEEE International Memory Workshop (IMW) (01-05-2018)“…In this paper we analyze recent progress in Phase- Change Memory (PCM) technology targeting both Storage Class Memory and embedded applications. The challenge…”
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Conference Proceeding -
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Silicon embedded line integration for high end passive silicon interposer
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01-09-2013)“…As standard organic substrate packages and wire bonding are reaching their limits in term of wiring density and integration capacity, silicon interposer…”
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Conference Proceeding