Synchrotron tests of 3D Medipix2 and TimePix X-ray detectors
In this article we report on the use micro-focus synchrotron X-ray radiation and pion beams to compare the detection efficiencies and charge sharing properties of novel 3D detectors to that of the current planar technology. Detector substrates are bump-bonded to the Medipx2 and Timepix chips. 55¿m s...
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Published in: | 2009 IEEE Nuclear Science Symposium Conference Record (NSS/MIC) pp. 2145 - 2150 |
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Main Authors: | , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , |
Format: | Conference Proceeding |
Language: | English |
Published: |
IEEE
01-10-2009
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Subjects: | |
Online Access: | Get full text |
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Summary: | In this article we report on the use micro-focus synchrotron X-ray radiation and pion beams to compare the detection efficiencies and charge sharing properties of novel 3D detectors to that of the current planar technology. Detector substrates are bump-bonded to the Medipx2 and Timepix chips. 55¿m square pixel maps of the detection efficiencies have been produced using X-ray and MIP beams. For X-rays, a drop of 3-4% detection efficiency over the pixel area was found due to the central electrode. The corner electrodes show no degradation in efficiency compared to that of the planar device. For MIPs a drop of 0.5% in efficiency due to the central electrode was observed. Evidence of a considerable reduction in charge sharing in the 3D detectors compared to the planar devices is also shown. |
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ISBN: | 9781424439614 1424439612 |
ISSN: | 1082-3654 2577-0829 |
DOI: | 10.1109/NSSMIC.2009.5402093 |