Search Results - "Mackowiak, Piotr"

A Converse of the Banach Contraction Principle for Partial Metric Spaces and the Continuum Hypothesis by Maćkowiak, Piotr

“…A version of the Bessaga inverse of the Banach contraction principle for partial metric spaces is presented. Equivalence of that version and the continuum…”
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On the continuity of superposition operators in the space of functions of bounded variation by Maćkowiak, Piotr

“…In the paper we present results on the continuity of nonlinear superposition operators acting in the space of functions of bounded variation in the sense of…”
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On the recursive and explicit form of the general J.C.P. Miller formula with applications by Bugajewski, Dariusz, Bugajewski, Dawid, Gan, Xiao-Xiong, Maćkowiak, Piotr

“…The famous J.C.P. Miller formula provides a recurrence algorithm for the composition Ba∘f, where Ba is the formal binomial series and f is a formal power…”
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The existence of equilibrium in a simple exchange model by Maćkowiak, Piotr

“…This paper gives a new proof of the existence of equilibrium in a simple model of an exchange economy. We first formulate and prove a simple combinatorial…”
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On knife-edge conditions with unbounded growth by Bugajewski, Dariusz, Maćkowiak, Piotr

“…•We give a formal definition of a knife-edge property.•We clarify and correct the existing results on knife-edge conditions in models of economic growth.•We…”
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Development and Characterization of a Novel Low-Cost Water-Level and Water Quality Monitoring Sensor by Using Enhanced Screen Printing Technology with PEDOT:PSS by Wang, Bei, Baeuscher, Manuel, Hu, Xiaodong, Woehrmann, Markus, Becker, Katharina, Juergensen, Nils, Hubl, Moritz, Mackowiak, Piotr, Schneider-Ramelow, Martin, Lang, Klaus-Dieter, Ngo, Ha-Duong

“…A novel capacitive sensor for measuring the water-level and monitoring the water quality has been developed in this work by using an enhanced screen printing…”
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Design and Application of a High-G Piezoresistive Acceleration Sensor for High-Impact Application by Hu, Xiaodong, Mackowiak, Piotr, Bäuscher, Manuel, Ehrmann, Oswin, Lang, Klaus-Dieter, Schneider-Ramelow, Martin, Linke, Stefan, Ngo, Ha-Duong

“…In this paper, we present our work developing a family of silicon-on-insulator (SOI)⁻based high-g micro-electro-mechanical systems (MEMS) piezoresistive…”
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A WSi⁻WSiN⁻Pt Metallization Scheme for Silicon Carbide-Based High Temperature Microsystems by Ngo, Ha-Duong, Mukhopadhyay, Biswajit, Mackowiak, Piotr, Kröhnert, Kevin, Ehrmann, Oswin, Lang, Klaus-Dieter

“…In this paper, we present and discuss our new WSi⁻WSiN⁻Pt metallization scheme for SiC-based microsystems for applications in harsh environments…”
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The existence of equilibrium without fixed-point arguments by Mackowiak, Piotr

“…This paper gives a proof of the existence of general equilibrium without the use of a fixed point theorem. Unlike other results of this type, the conditions we…”
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Some Remarks on Lower Hemicontinuity of Convex Multivalued Mappings by Mackowiak, Piotr

“…For a multifunction a condition sufficient for lower hemicontinuity is presented. It is shown that under convexity of graph it is possible for a multifunction…”
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A counterexample to Ljamin's theorem by Piotr Maćkowiak

“…One of the well-known results ensuring that a nonautonomous superposition operator maps the set of functions of one variable of bounded variation in the sense…”
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A combinatorial lemma and its applications by Mackowiak, Piotr

“…In this paper, we present a generalization of a combinatorial lemma we stated and proved in a recent work. Then we apply the generalized lemma to prove:…”
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High-Yield Large-Scale Suspended Graphene Membranes over Closed Cavities for Sensor Applications by Lukas, Sebastian, Esteki, Ardeshir, Rademacher, Nico, Jangra, Vikas, Gross, Michael, Wang, Zhenxing, Ngo, Ha-Duong, Bäuscher, Manuel, Mackowiak, Piotr, Höppner, Katrin, Wehenkel, Dominique J., van Rijn, Richard, Lemme, Max C.

“…Suspended membranes of monatomic graphene exhibit great potential for applications in electronic and nanoelectromechanical devices. In this work, a “hot and…”
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Investigation and Modeling of Etching Through Silicon Carbide Vias (TSiCV) for SiC Interposer and Deep SiC Etching for Harsh Environment MEMS by DoE by Mackowiak, Piotr, Erbacher, Kolja, Schiffer, Michael, Manier, Charles-Alix, Topper, Michael, Ngo, Ha-Duong, Schneider-Ramelow, Martin, Lang, Klaus-Dieter

“…This article presents prime results on process development and optimization of dry etching of silicon carbide (SiC) for via formation and deep etching for…”
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Piezoresistive 4H-Silicon Carbide (SiC) pressure sensor by Mackowiak, Piotr, Erbacher, Kolja, Baeuscher, Manuel, Schiffer, Michael, Lang, Klaus-Dieter, Schneider-Ramelow, Martin, Ngo, Ha-Duong

“…A novel 4H SiC piezoresistive pressure sensor has been fabricated using a high temperature metallization system. The sensor has been fabricated using 100 mm…”
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A Novel Low Cost Wireless Incontinence Sensor System (Screen-Printed Flexible Sensor System) for Wireless Urine Detection in Incontinence Materials by Ha-Duong Ngo, Thanh Hai Hoang, Manuel Baeuscher, Bei Wang, Piotr Mackowiak, Nils Grabbert, Thomas Weiland, Oswin Ehrmann, Klaus-Dieter Lang, Martin Schneider-Ramelow, Jens Grudno

“…In this paper we present a printed, fast, high-sensitive and cheap wireless incontinence sensor [...]…”
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Fabrication and Characterization of Nanoporous Gold (NPG) Interconnects for Wafer Level Packaging by Dietrich, Lothar, Oppermann, Hermann, Lopper, Christina, Mackowiak, Piotr

“…A novel bumping and bonding technology using sponge-like gold depots with nanometer-scale skeleton construction has been developed and verified. The nanoporous…”
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RF Modelling of for Through SiC Vias and Fabrication of SiC based Interposer by Mackowiak, Piotr, Koszegi, Julia-Marie, Schiffer, Michael, Schneider-Ramelow, Martin

“…In this paper we will analyze the parameter space given by an innovative manufacturing technology of Through SiC Vias (TSiCV) with respect to its impact on the…”
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SiC Fan-out Wafer Level Package for High Power Application by Mackowiak, Piotr, Wittler, Olaf, Braun, Tanja, Erbacher, Kolia, Schiffer, Michael, Schneider-Ramelow, Martin

“…The thermal concept of the electronic package for high power devices needs to address the increased temperature of operation and the need to insure the head…”
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Potentials of a SiC Fan-out Wafer Level Package for High Power Application by Mackowiak, Piotr, Wittler, Olaf, Braun, Tanja, Conrad, Janine, Schiffer, Michael, Schneider-Ramelow, Martin

“…This paper describes the research on the development of a SiC Fan-out Wafer level Package for high power application. Electronic Packaging for High Power…”
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