Search Results - "MEHRAN MEHREGANY"

A SiC MEMS Resonant Strain Sensor for Harsh Environment Applications by Azevedo, R.G., Jones, D.G., Jog, A.V., Jamshidi, B., Myers, D.R., Li Chen, Xiao-an Fu, Mehregany, M., Wijesundara, M.B.J., Pisano, A.P.

“…In this paper, we present a silicon carbide MEMS resonant strain sensor for harsh environment applications. The sensor is a balanced-mass double-ended tuning…”
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Extreme temperature 6H-SiC JFET integrated circuit technology by Neudeck, Philip G., Garverick, Steven L., Spry, David J., Chen, Liang-Yu, Beheim, Glenn M., Krasowski, Michael J., Mehregany, Mehran

“…Extreme temperature semiconductor integrated circuits (ICs) are being developed for use in the hot sections of aircraft engines and other harsh‐environment…”
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SiC MEMS: opportunities and challenges for applications in harsh environments by Mehregany, Mehran, Zorman, Christian A

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550 ^\hbox Integrated Logic Circuits using 6H-SiC JFETs by Chia-Wei Soong, Patil, A. C., Garverick, S. L., Xiaoan Fu, Mehregany, M.

“…This letter reports the design, fabrication, and electrical characteristics of inverter, NAND, and NOR logic circuits using 6H-silicon carbide (SiC)…”
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Celebrating the legacy of Wen H. Ko (1923–2017) by Mehregany, Mehran

“…An obituary for Professor Wen H. Ko, who died on Dec 4, 2017, is presented. Ko came to Case Western Reserve University in 1954 as an engineering MS student and…”
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Measurement of residual stress and elastic modulus of polycrystalline 3C-SiC films deposited by low-pressure chemical vapor deposition by Fu, Xiao-an, Dunning, Jeremy L., Zorman, Christian A., Mehregany, Mehran

“…Residual stress and in-plane biaxial modulus of polycrystalline 3C-silicon carbide (poly-SiC) films are studied using bulk and surface micromachined…”
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Fully-monolithic, 600°C differential amplifiers in 6H-SiC JFET IC technology by Patil, A.C., Xiao-an Fu, Mehregany, M., Garverick, S.L.

“…A family of fully-integrated differential amplifiers was designed and fabricated in 6H-SiC, n-channel JFET integrated-circuit technology. A single-stage…”
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Electromechanical computing at 500 degrees C with silicon carbide by Lee, Te-Hao, Bhunia, Swarup, Mehregany, Mehran

“…Logic circuits capable of operating at high temperatures can alleviate expensive heat-sinking and thermal-management requirements of modern electronics and are…”
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A silicon carbide capacitive pressure sensor for in-cylinder pressure measurement by Chen, Li, Mehregany, Mehran

“…This paper reports a research prototype of a low-cost, miniature, mass-producible sensor for measurement of high-pressure at operating temperatures of…”
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Electromechanical Computing at 500°C with Silicon Carbide by Lee, Te-Hao, Bhunia, Swarup, Mehregany, Mehran

“…Logic circuits capable of operating at high temperatures can alleviate expensive heat-sinking and thermal-management requirements of modern electronics and are…”
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Mechanical properties of 3C silicon carbide by Tong, Lijun, Mehregany, Mehran, Matus, Lawrence G.

“…The residual stress and Young's modulus of 3C silicon carbide (SiC) epitaxial films deposited on silicon substrates were measured by load-deflection…”
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Embedded two-phase cooling of high heat flux electronics on silicon carbide (SiC) using thin-film evaporation and an enhanced delivery system (FEEDS) manifold-microchannel cooler by Bae, Daniel G., Mandel, Raphael K., Dessiatoun, Serguei V., Rajgopal, Srihari, Roberts, Samantha P., Mehregany, Mehran, Ohadi, Michael M.

“…This work presents experimental results of a two-phase, embedded cooling system for high heat flux electronics on silicon carbide (SiC) substrates. The system…”
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Surface-micromachined RF MEMs switches on GaAs substrates by Hyman, Daniel, Lam, Juan, Warneke, Brett, Schmitz, Adele, Hsu, T. Y., Brown, Julia, Schaffner, James, Walston, Andy, Loo, Robert Y., Mehregany, Mehran, Lee, Jae

“…This paper reports on the development of a broadband, low insertion loss, ohmic‐contact MEMs switch for microwave and millimeter‐wave applications. The switch…”
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LAST WORD: PRINCIPLES TO GUIDE LEADERSHIP TRAINING by MEHREGANY, MEHRAN, WNEK, GARY E.

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PRINCIPLES TO GUIDE LEADERSHIP TRAINING by Mehregany, Mehran, Wnek, Gary E

“…Mehregany and Wnek offer three guiding principles for leadership training, drawn from their own career experiences in business, academia, and nonprofit…”
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Thick PECVD silicon dioxide films for MEMS devices by Ho, Shih-Shian, Rajgopal, Srihari, Mehregany, Mehran

“…•5μm-thick TEOS silicon dioxide films were developed for MEMS devices.•Two-way analysis of variance (ANOVA) verifies that the experimental data are valid.•The…”
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Microfabricated structures for the in situ measurement of residual stress, Young's modulus, and ultimate strain of thin films by ALLEN, M. G, MEHRAN MEHREGANY, HOWE, R. T, SENTURIA, S. D

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Pendeo-epitaxial Growth and Characterization of Thin Films of Gallium Nitride and Related Materials on SiC(0001) and Si(111) Substrates by Davis, Robert F., Gehrke, Thomas, Linthicum, Kevin J., Zheleva, Tsvetanka S., Rajagopal, Pradeep, Zorman, Chris A., Mehregany, Mehran

“…Monocrystalline GaN and Al Ga N films have been grown via the pendeo-epitaxy (PE) [ ] technique with and without Si masks on GaN/AlN/6H–SiC(0001) and…”
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Media compatible stainless steel capacitive pressure sensors by Ho, Shih-Shian, Rajgopal, Srihari, Mehregany, Mehran

“…Self-packaged stainless steel (SS) capacitive pressure sensors are developed and studied for their harsh environment performance, i.e., measurements of…”
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Theoretical modeling of microfabricated beams with elastically restrained supports by Qingyuan Meng, Mehregany, M., Mullen, R.L.

“…A mathematical model is developed to analyze the mechanical behavior of step-up supports which typically result from surface micromachining. This model…”
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