Search Results - "Lvov, Boris G"
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1
Exploring disorder correlations in superconducting systems: spectroscopic insights and matrix element effects
Published in Beilstein journal of nanotechnology (12-02-2024)“…Understanding the intricate interplay between disorder and superconductivity has become a key area of research in condensed matter physics, with profound…”
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Journal Article -
2
Anomalous current-voltage characteristics of SFIFS Josephson junctions with weak ferromagnetic interlayers
Published in Beilstein journal of nanotechnology (2020)“…We present a quantitative study of the current-voltage characteristics (CVC) of SFIFS Josephson junctions (S = bulk superconductor, F = metallic ferromagnet, I…”
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Journal Article -
3
Density of states in the presence of spin-dependent scattering in SF bilayers: a numerical and analytical approach
Published in Beilstein journal of nanotechnology (2022)“…We present a quantitative study of the density of states (DOS) in SF bilayers (where S is a bulk superconductor and F is a ferromagnetic metal) in the…”
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Journal Article -
4
Radiation-Induced Fault Simulation of SOI/SOS CMOS LSI’s Using Universal Rad-SPICE MOSFET Model
Published in Journal of electronic testing (01-02-2017)“…The methodology of modeling and simulation of environmentally induced faults in radiation hardened SOI/SOS CMOS IC’s is presented. It is realized at three…”
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Journal Article -
5
Fault simulation in radiation-hardened SOI CMOS VLSIs using universal compact MOSFET model
Published in 2016 17th Latin-American Test Symposium (LATS) (01-04-2016)“…The methodology of modeling and simulation of environmentally induced faults in radiation hardened SOI CMOS ICs is presented. For this purpose, the universal…”
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Conference Proceeding -
6
Hardware-software subsystem for multilevel thermal fault detection and analysis of electronic components
Published in 2016 International Siberian Conference on Control and Communications (SIBCON) (01-05-2016)“…A hardware-software subsystem for multilevel investigation and analysis of thermal behavior and thermal faults in electronic components and systems is…”
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Conference Proceeding Journal Article -
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Welcome message from the technical program committee chairs
Published in 2016 International Siberian Conference on Control and Communications (SIBCON) (01-05-2016)“…Presents the introductory welcome message from the conference proceedings. May include the conference officers' congratulations to all involved with the…”
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Conference Proceeding -
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Reliability of Space Infocommunications Equipment
Published in 2018 IEEE International Conference "Quality Management, Transport and Information Security, Information Technologies" (IT&QM&IS) (01-09-2018)“…The theme of this work is the process of creating modern on-board space radio electronic equipment (REE), which performs the functions of infocommunications…”
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Conference Proceeding -
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Automation of parameter extraction procedure for Si JFET SPICE model in the −200...+110°C temperature range
Published in 2018 Moscow Workshop on Electronic and Networking Technologies (MWENT) (01-03-2018)“…Through the analysis of JFET models with account for temperature effects, the most suitable one was selected as a basis for expanding SPICE modeling…”
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Conference Proceeding -
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Development of compact SPICE-models of IC resistive interconnects with different configurations
Published in 2018 Moscow Workshop on Electronic and Networking Technologies (MWENT) (01-03-2018)“…In case of the modern sizes of chips influence of interconnections is so significant that need interconnections compact electrical model of creation appeared…”
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Conference Proceeding