Search Results - "Lv, Hongfeng"
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1
Hardware Efficient Reciprocal Using Second Order Harmonized Parabolic Synthesis and Squaring Shrunk Method
Published in Elektronika ir elektrotechnika (01-01-2018)“…In applications as in wireless communication, computer graphics and digital signal processing, a massive of complex matrix operations is often performed…”
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2
Signal Detection of Multi-Channel Capillary Electrophoresis Chip Based on CCD
Published in Measurement science review (01-12-2012)“…A kind of multi-channel capillary electrophoresis (CE) chip signal detection system based on CCD was developed. The output signal of the CCD sensor was…”
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3
Study on Thermal Vacuum Outgassing Data of Nonmetallic Sealing Materials for Space Connector
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10-08-2022)“…The aerospace connector is an important connecting element between the components of the aerospace device. Its general structure includes contacts, insulators,…”
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Conference Proceeding -
4
Unique role of sulfonic acid exchange resin on preventing copper and zinc precipitation and enhancing metal removal in electrokinetic remediation
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (01-04-2024)“…[Display omitted] •The new catholyte pH stabilization strategy was established by EKR-SER.•The COMSOL exhibited the metal morphology variation near cathode in…”
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5
Synthesis of ring opening of evodiamine derivatives and evaluation on their biological activity
Published in Chemical biology & drug design (01-04-2022)“…As a main bioactive component extracted from Evodiae fructus, evodiamine has a variety of pharmacological activities. In this paper, evodiamine was chosen as…”
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6
Light-emitting-diode-induced fluorescence detection of fluorescent dyes for capillary electrophoresis microchip with cross-polarization method
Published in Applied optics. Optical technology and biomedical optics (10-04-2012)“…A cross-polarization scheme is presented to filter out the excitation light from the emission spectrum of fluorescent dyes using green light emitting diodes as…”
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7
A scanning laser induced fluorescence detection system for capillary electrophoresis microchip based on optical fiber
Published in Optik (Stuttgart) (01-12-2012)“…In this paper, a scanning laser induced fluorescence detection system for capillary electrophoresis microchip based on single-mode optical fiber has been…”
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8
The Application Verification Method of DC/DC Converter Used in Aviation Environment
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07-08-2024)“…As a key part of aviation system, the reliability of DC/DC converter affects the reliability of the whole system. Nowadays, most domestic aviation system in…”
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Conference Proceeding -
9
Function verification and implementation of block random access memory based on FPGA
Published in Diànzǐ jìshù yīngyòng (01-09-2018)“…Field programmable gate array(FPGA) has a wide application in signal processing, hardware accelerating and chip prototype verification because of its rich…”
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10
Research on Intelligent Detection Method for IC Surface Defects Based on Convolutional Neural Network
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08-08-2023)“…Surface Defects Detection of integrated circuit (IC) is one of the important means to ensure the quality and reliability of components. Nowadays, most…”
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Conference Proceeding -
11
Research on Acceleration Test Model and Parameter Determination Method of Integrated Circuit
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08-08-2023)“…With the development of microelectronics manufacturing technology, the reliability level of electronic components has also increased rapidly. The failure rate…”
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Conference Proceeding -
12
Research on online junction temperature monitoring method for SiC MOSFETs based on high current conduction voltage drop method
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07-08-2024)“…As a typical representative of third-generation semiconductor power devices, silicon carbide (SiC) devices have gradually become the core components of power…”
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Conference Proceeding -
13
Research on quality and reliability of ceramic-to-metal bonding without solder
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10-08-2022)“…The bonding methods of ceramic / metal in vacuum electronic devices can be divided into two ways: with solder and without solder. Among them, the way with…”
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Conference Proceeding -
14
Study of Anti-Sulfuration Methods for Thick Film Chip Resistors
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10-08-2022)“…Due to the widespread use of fossil fuels and the accumulation of sulphur-containing substances in the air year by year, sulfurization failures in electronic…”
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Conference Proceeding -
15
Structural characteristics and performance evaluation of anti-sulfuration resistor
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10-08-2022)“…Thick film resistors are widely used as general components in modern electronic information products. Due to their structural characteristics and the thick…”
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Conference Proceeding -
16
Thermal Reliability Analysis of High-Power Terahertz Traveling Wave Tube
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08-08-2023)“…The terahertz wave, as the least explored and developed electromagnetic wave band by humans, is referred to as the "last gap in exploring the electromagnetic…”
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Conference Proceeding -
17
Research on Scanning Acoustic Image Defects Detection of Integrated Circuits based on YOLOX
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10-08-2022)“…Scanning Acoustic Microscope (SAM) is a very important non-destructive testing tool, which can sensitively detect the morphological features, structural…”
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Conference Proceeding -
18
Research on the performance of SRAM for low temperature operation
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10-08-2022)“…As an important part of VLSI, SRAM has been widely used in the control systems of various deep space exploration detectors and satellites in recent years with…”
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Conference Proceeding -
19
Preparation and microwave properties of \text/\text composites reinforced by mullite fibers
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14-09-2021)“…In this paper, flexible \mathbf{TiO}_{2}/\mathbf{PTFE} composite materials with different mullite fiber content were prepared. The effects of mullite fiber…”
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Conference Proceeding -
20
Lambda and Anti-Lambda Hypernuclei in Relativistic Mean-field Theory
Published 03-05-2011“…International Journal of Modern Physics E 19 (12), 2538-2545 (2010) Several aspects about $\Lambda$-hypernuclei in the relativistic mean field theory,…”
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