Search Results - "Louveau, Olivier"

Impact of patterning and ashing on electrical properties and reliability of interconnects in porous SiOCH ultra low-k dielectric materials by Aimadeddine, Mohamed, Arnal, Vincent, Farcy, Alexis, Guedj, Cyril, Chevolleau, Thierry, Possémé, Nicolas, David, Thibaut, Assous, Myriam, Louveau, Olivier, Volpi, Fabien, Torres, Joaquin

“…In this study, a PECVD porous SiOCH dielectric with k = 2.4 is integrated in a Cu single damascene architecture. The main issue investigated is the low k…”
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Three dimensional chip stacking using a wafer-to-wafer integration by Chatterjee, Ritwik, Zussy, Marc, Roman, Antonio, Louveau, Olivier, Maitrejean, Sylvain, Louis, Didier, Kernevez, Nelly, Sillon, Nicolas, Passemard, Gerard, Pol, Victor, Mathew, Varughese, Fayolle, Murielle, Garcia, Sam, Sparks, Terry, Huang, Zhihong, Leduc, Patrick, Pozder, Scott, Jones, Bob, Acosta, Eddie, Charlet, Barbara, Enot, Thierry, Heitzmann, Michel

“…A three-dimensional (3D) wafer-to-wafer integration technology has been developed using face-to-face dielectric wafer bonding, followed by wafer thinning and…”
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