Investigation of low-temperature sintering of silver paste

Investigations were carried out into thermal effects taking place during drying and sintering of a silver-containing paste used for the production of low-temperature joints in the 'silicon on molybdenum' system for semiconductor devices. The change of the shape and dimensions of the silver...

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Bibliographic Details
Published in:	Welding International Vol. 29; no. 12; pp. 974 - 979
Main Authors:	Lukin, V.I., Rylnikov, V.S., Afanasyev-Khodykin, A.N., Loshchinin, Yu.V.
Format:	Journal Article Trade Publication Article
Language:	English
Published:	Cambridge Taylor & Francis 02-12-2015 Taylor & Francis Ltd
Subjects:	Drying Microhardness Molybdenum Pastes Semiconductor devices Semiconductors Silicon silicon on molybdenum Silver silver paste silvering sintered layer Sintering Temperature
Online Access:	Get full text
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Summary:	Investigations were carried out into thermal effects taking place during drying and sintering of a silver-containing paste used for the production of low-temperature joints in the 'silicon on molybdenum' system for semiconductor devices. The change of the shape and dimensions of the silver particles during drying of the silver-containing paste at different temperatures is studied. The microhardness of the sintered layers, produced in different conditions, is determined.
Bibliography:	ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23
ISSN:	0950-7116 1754-2138
DOI:	10.1080/09507116.2015.1012384