Search Results - "Long, Weifeng"

An Efficient Certificateless Anonymous Signcryption Scheme for WBAN by Long, Weifeng, Deng, Lunzhi, Zeng, Jiwen, Gao, Yan, Lu, Tianxiu

“…A Wireless Body Area Network (WBAN), introduced into the healthcare sector to improve patient care and enhance the efficiency of medical services, also brings…”
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Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging by Li, Yulong, Long, Weifeng, Hu, Xiaowu, Fu, Yanshu

“…In order to accelerate the growth of interfacial intermetallic compound (IMC) layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot…”
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Welding Defect and Mechanical Properties of Nanosecond Laser Cleaning 6005A Aluminum Alloy by Zhang, Yuelai, Yao, Qi, Long, Weifeng, Wang, Chunming, Lin, Ji, Liu, Zehui

“…Nanosecond laser cleaning effectively removes oxide film and dirt from the surface of aluminum body parts for rail transit, as well as improving surface…”
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Reduced order modeling and mistuning identification method for rotating bladed disks under varying speeds by Long, Weifeng, Chen, Yugang

“…•Reduced order modeling approach for rotating bladed disks under varying speeds.•Mistuning identification method for rotating bladed disks with variable…”
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Nonlinear vibration characteristics and damage detection method of blade with breathing fatigue crack by Liu, Yue, Long, Weifeng, Chen, Yugang, Hu, Haifeng

“…•Analysis of nonlinear vibration characteristics of blade simulating actual crack shapes.•Breathing fatigue crack detection method based on nonlinear…”
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Wetting kinetics and spreading phenomena of the precursor film and bulk liquid in the AgCuTi/TC4 system by Liu, Guanpeng, Li, Yulong, Long, Weifeng, Hu, Xiaowu, Cao, Jian, Yan, Ming

“…The reactive wetting of AgCuTi filler metal over a TC4 substrate was conducted using real-time in situ hot stage microscopy. In addition to the commonly…”
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Wetting kinetics and spreading phenomena of Sn-35Bi-1Ag solder on different substrates by Li, Yulong, Wang, Zhiliang, Long, Weifeng, Lei, Min, Hu, Xiaowu

“…Wetting kinetics of Sn-35Bi-1Ag solder on different substrates were investigated at elevated temperatures, within the range of 473–553 K. The randomly polished…”
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