Search Results - "Lombardi, Thomas E."
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Effect of Underfill Formulation on Large-Die, Flip-Chip Organic Package Reliability: A Systematic Study on Compositional and Assembly Process Variations
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01-05-2016)“…Selection of appropriate underfills (or encapsulants) for flip-chip packages is critical to their reliability. In this research article, we present a…”
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Conference Proceeding -
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Finite Element Modeling of C4 Cracking in a Large Die Large Laminate Coreless Flip Chip Package
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01-05-2016)“…BGA substrates made of organic materials are now industry standard as they provide significant advantages over the ceramic dielectric-based predecessors in…”
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Conference Proceeding -
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A systematic exploration of the failure mechanisms in underfilled flip-chip packages
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01-05-2015)“…A study on failure mechanisms in underfilled flip-chip packages is presented here. The flip-chip packages were built after conducting a range of finite element…”
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Conference Proceeding