Search Results - "Loman, J. M."

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    Reliability block diagram simulation techniques applied to the IEEE Std. 493 standard network by Wendai Wang, Loman, J.M., Arno, R.G., Vassiliou, P., Furlong, E.R., Ogden, D.

    Published in IEEE transactions on industry applications (01-05-2004)
    “…This is one of a series of papers discussing the application and accuracy of different analysis techniques supporting the determination of industrial and…”
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    Journal Article
  2. 2

    Spacecraft Hardness Assurance Programs by O'Donnell, H. B., Loman, J. M., Ritter, P., Stahlman, J. R.

    Published in IEEE transactions on nuclear science (01-12-1986)
    “…This paper describes hardness assurance experience gained from several programs including the production of DSCS (Defense Satellite Communications System) III…”
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  3. 3

    Study of the effect of reflow time and temperature on Cu–Sn intermetallic compound layer reliability by Huang, Wei, Loman, James M, Sener, Bülent

    Published in Microelectronics and reliability (01-08-2002)
    “…In terms of various reflow time and temperature, an analysis of Cu–Sn intermetallic compound (IMC) layer reliability is presented in this paper. Temperature…”
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