Search Results - "Loke Chee Keong"
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Effect of free-air-ball palladium distribution on palladium-coated copper wire corrosion resistance
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01-11-2016)“…Since the development of palladium-coated copper wire (CuPd) in recent years, it has been widely used in the electronic industry due to its good performance,…”
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Conference Proceeding -
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Basics of thermosonic bonding of fine alloyed Ag wires
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01-11-2016)“…Alloyed silver (Ag) based bonding wires reveal bondability comparable to Au wires. The present paper discusses on: Axi-symmetrical free air ball (FAB)…”
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Conference Proceeding