High-precision transfer-printing and integration of vertically oriented semiconductor arrays for flexible device fabrication

Flexible electronics utilizing single crystalline semiconductors typically require post-growth processes to assemble and incorporate the crystalline materials onto flexible substrates. Here we present a high-precision transfer-printing method for vertical arrays of single crystalline semiconductor m...

Full description

Saved in:

Bibliographic Details
Published in:	Nano research Vol. 7; no. 7; pp. 998 - 1006
Main Authors:	Triplett, Mark, Nishimura, Hideki, Ombaba, Matthew, Logeeswarren, V. J., Yee, Matthew, Polat, Kazim G., Oh, Jin Y., Fuyuki, Takashi, Léonard, François, Islam, M. Saif
Format:	Journal Article
Language:	English
Published:	Heidelberg Tsinghua University Press 01-07-2014 Springer Nature B.V
Subjects:	Arrays Atomic/Molecular Structure and Spectra Biomedicine Biotechnology Chemistry and Materials Science Condensed Matter Physics Crystal structure Density Devices Fabrication Laboratories Materials Science Nanotechnology Nanowires Polymers Registration Research Article Semiconductors Silicon Tactile Temperature Wire 制造工艺半导体材料印刷方法垂直阵列柔性基板触觉传感器转印高精度 United States > US flexible electronics printable electronics transfer printing nanowires nanoscale devices
Online Access:	Get full text
Tags:	Add Tag No Tags, Be the first to tag this record!

Description
Summary:	Flexible electronics utilizing single crystalline semiconductors typically require post-growth processes to assemble and incorporate the crystalline materials onto flexible substrates. Here we present a high-precision transfer-printing method for vertical arrays of single crystalline semiconductor materials with widely varying aspect ratios and densities enabling the assembly of arrays on flexible substrates in a vertical fashion. Complementary fabrication processes for integrating transferred arrays into flexible devices are also presented and characterized. Robust contacts to transferred silicon wire arrays are demonstrated and shown to be stable under flexing stress down to bending radii of 20 mm. The fabricated devices exhibit a reversible tactile response enabling silicon based, nonpiezoelectric, and flexible tactile sensors. The presented system leads the way towards high-throughput, manufacturable, and scalable fabrication of flexible devices.
Bibliography:	transfer printing,nanowires,flexible electronics,printable electronics,nanoscale devices 11-5974/O4 Flexible electronics utilizing single crystalline semiconductors typically require post-growth processes to assemble and incorporate the crystalline materials onto flexible substrates. Here we present a high-precision transfer-printing method for vertical arrays of single crystalline semiconductor materials with widely varying aspect ratios and densities enabling the assembly of arrays on flexible substrates in a vertical fashion. Complementary fabrication processes for integrating transferred arrays into flexible devices are also presented and characterized. Robust contacts to transferred silicon wire arrays are demonstrated and shown to be stable under flexing stress down to bending radii of 20 mm. The fabricated devices exhibit a reversible tactile response enabling silicon based, nonpiezoelectric, and flexible tactile sensors. The presented system leads the way towards high-throughput, manufacturable, and scalable fabrication of flexible devices. ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23
ISSN:	1998-0124 1998-0000
DOI:	10.1007/s12274-014-0462-7