Search Results - "Lofrano, M"

Towards Complete Recovery of Circuit Degradation by Annealing With On-Chip Heaters by Diaz-Fortuny, J., Saraza-Canflanca, P., Lofrano, M., Bury, E., Degraeve, R., Kaczer, B.

“…This work reports an on-chip heater structure fabricated in the Front End of Line (FEOL) on a versatile ring-oscillator (RO) array utilized to conduct…”
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A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures by Lofrano, M., Vandevelde, B., Gonzalez, M.

“…•Multilevel sub-modeling was used to investigate CPI for 3D stacks with hybrid BEOL.•Positions in the die at edge and the at center of Cu Pillar were…”
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Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters by Ding, Y., Pedreira, O. Varela, Lofrano, M., Zahedmanesh, H., Chavez, T., Farr, H., De Wolf, I., Croes, K.

“…Using a dedicated test structure, the main physical parameters of void formation due to thermomigration (TM) were assessed. Based on physical and electrical…”
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Assessment of critical Co electromigration parameters by Pedreira, O. Varela, Lofrano, M., Zahedmanesh, H., Roussel, Ph. J., van der Veen, M., Simons, V., Chery, E., Ciofi, I., Croes, K.

“…We perform a detailed assessment of the electromigration performance of Co interconnects. Package level EM measurements were performed during >11 months. Our…”
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Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs) by Mishra, S., Sankatali, V., Vermeersch, B., Brunion, M., Lofrano, M., Abdi, D., Oprins, H., Biswas, D., Zografos, O., Hiblot, G., Van Der Plas, G., Weckx, P., Hellings, G., Myers, J., Catthoor, F., Ryckaert, J.

“…Surge in compute-demand in consumer products, mobile phones, auto mobiles, datacenters for high performance computing (HPC) applications brings in major…”
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Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps by Lesniewska, A., Pedreira, O. Varela, Lofrano, M., Murdoch, G., van der Veen, M., Dangol, A., Horiguchi, N., Tokei, Zs, Croes, K.

“…We evaluate the reliability of a semidamascene BEOL scheme with direct metal etched (DME) Ruthenium and 16 nm wide air gaps (AG). First, we show that Ru can be…”
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Anxiety related to dental care in children and adolescents in a low-income Brazilian community by Soares, F. C., Souto, G., Lofrano, M., Colares, V.

“…Aim The aims of this study were to determine the prevalence of anxiety related to dental care and analyse associated factors in children and adolescents in a…”
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Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling by Vandevelde, Bart, Ivankovic, A., Debecker, B., Lofrano, M., Vanstreels, K., Guo, W., Cherman, V., Gonzalez, M., Van der Plas, G., De Wolf, I., Beyne, E., Tokei, Z.

“…•Analytical modelling, FEM simulations and 4 point bending for BEOL strength analysis.•Reduced low-k stiffness results in exponential growth of stress in Cu…”
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Relationship between nonalcoholic fatty liver disease prevalence and visceral fat in obese adolescents by Dâmaso, A.R, do Prado, W.L, de Piano, A, Tock, L, Caranti, D.A, Lofrano, M.C, Carnier, J, Cristofalo, D.J.M, Lederman, H, Tufik, S, de Mello, M.T

“…Abstract Background Visceral adiposity is the major risk factor for paediatric nonalcoholic fatty liver disease. Aims Determine the prevalence of nonalcoholic…”
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Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach by Lofrano, M., Croes, K., De Wolf, I., Wilson, C.J.

“…The sensitivity of stress-induced-voiding to structural layouts is investigated using Finite Element Modeling and is validated experimentally. A method is…”
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IgA deficiency evidence after anti-TNF-α treatment in a psoriatic arthritis patient: case report by Iervolino, S., Lofrano, M., Di Minno, M.N.D., Foglia, F., Scarpa, R., Peluso, R.

“…It is known that the use of anti-TNF-α drugs is related to an increased incidence of infective diseases. This therapy can not be administered to patients…”
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Study of void formation kinetics in Cu interconnects using local sense structures by Croes, K, Lofrano, M, Wilson, C J, Carbonell, L, Siew, Y K, Beyer, G P, Tokei, Z

“…A test structure that allows the study of void formation kinetics during electromigration is proposed and characterized. Compared to a standard single-via…”
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Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network by Chen, R., Lofrano, M., Mirabelli, G., Sisto, G., Yang, S., Jourdain, A., Schleicher, F., Veloso, A., Zografos, O., Weckx, P., Hiblot, G., Plas, G. Van der, Hellings, G., Ryckaert, J., Beyne, E.

“…In this work, we comprehensively evaluate the impact of using backside power delivery network (BSPDN) for CPU of 2D and 3D designs at A14 node from the aspects…”
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Methotrexate in the treatment of peripheral arthritis in ulcerative colitis by Peluso, R., Atteno, M., Iervolino, S., Bruner, V., Caso, F., Costa, L., Raimodo, M., Lofrano, M., Manguso, F., Scarpa, R.

“…Objective: To evaluate efficacy of methotrexate treatment in peripheral arthritis of ulcerative colitis. Methods: We studied 18 patients (10/8 M/F; mean age:…”
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Macroenzyme investigation and monitoring in children with persistent increase of aspartate aminotransferase of unexplained origin by Fortunato, Giuliana, Iorio, Raffaele, Esposito, Pietro, Lofrano, Maria Marinella, Vegnente, Angela, Vajro, Pietro

“…Ten children with asymptomatic persistent cryptogenic increased serum levels of aspartate aminotransferase (AST) were screened for detection and monitoring of…”
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Differential diagnosis between hepatocellular carcinoma and cirrhosis through a discriminant function based on results for serum analytes by Castaldo, G, Oriani, G, Lofrano, MM, Cimino, L, Topa, M, Budillon, G, Salvatore, F, Sacchetti, L

“…We applied a multivariate analysis to a large series of serum biochemical tests in an attempt to identify a function that could efficiently discriminate…”
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Methotrexate in the treatment of peripheral arthritis in ulcerative colitis by Peluso, R, Atteno, M, Iervolino, S, Bruner, V, Caso, F, Costa, L, Raimondo, M, Lofrano, M, Manguso, F, Scarpa, R

“…To evaluate efficacy of methotrexate treatment in peripheral arthritis of ulcerative colitis. We studied 18 patients (10/8 M/F; mean age: 38.90 yrs; range:…”
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Electromigration and stress-induced-voiding in dual damascene Cu/low-k interconnects: a complex balance between vacancy and stress gradients by Croes, K, Wilson, C J, Lofrano, M, Vereecke, B, Beyer, G P, Tökei, Z

“…The influence of residual vacancy concentrations and stress gradients on electromigration both in the metal layer below and above copper via's with a diameter…”
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Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5μm pitch by Cherman, V., Van Huylenbroeck, S., Lofrano, M., Chang, X., Oprins, H., Gonzalez, M., Van der Plas, G., Beyer, G., Rebibis, K. J., Beyne, E.

“…In this paper we address the thermal, mechanical and reliability performance of wafer-to-wafer hybrid bonded CMOS wafers manufactured using standard 65nm…”
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A combined modelling approach to design test structures to study thermomigration in Cu interconnects by Ding, Y., Lofrano, M., Varela Pedreira, O., Zahedmanesh, H., Croes, K., De Wolf, I.

“…With the downscaling of microelectronic devices, thermal gradients become increasingly important, making thermomigration (TM) an important mass transport…”
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