Search Results - "Lo Miew Wan"

Effect of Reflow on Solder Joint in Low Temperature SnBi Solder Paste by Chiong, Kenny, Sutiono, Sylvia, Kumar, B. Senthil, Miew Wan, Lo, Murali, Sarangapani, HanWen, Zhang, Sig, Kang Sung

“…Double-sided system-in-package (SiP) modules have gained popularity for advanced packaging to provide advanced solutions addressing module size, cost,…”
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Interfacial reaction and thermal ageing of ball and stitch bonds by Murali, Sarangapani, Sureshkumar, V., Lo Miew Wan, Tok Chee Wei, Zhang Xi

“…In wire bonding, reliability of ball and stitch bonds is the upmost challenge. Thermal ageing (high temperature storage) is the first reliability test…”
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Effect of free-air-ball palladium distribution on palladium-coated copper wire corrosion resistance by Liao Jinzhi, Zhang Xp, Sureshkumar, Vinobaji, Danila, Bayaras Abito, Chong Kim Hui, Lim Yee Weon, Lo Miew Wan, Loke Chee Keong, Bakar, Zaiton Bte

“…Since the development of palladium-coated copper wire (CuPd) in recent years, it has been widely used in the electronic industry due to its good performance,…”
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Characterization of Coating on Fine Interconnect Materials by Huei, Yam Lip, Murali, Sarangapani, Agala, Joel, Wan, Lo Miew, Jason, Wong Chin Yeung

“…Interfacial materials, such as intentionally deposited coatings enhance the behavior of interconnect materials by providing unique properties, then the…”
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Characterization of Pressure-less Ag-Sinter using Innovative Sample Preparation Approach by Murali, Sarangapani, Evonne, Lim Yee Weon, Yuan, Chieng Yu, Wan, Lo Miew, Sungsig, SS Kang, Dennis, Ang Kwang Leong

“…Pressure-less Ag-sinter die attach materials are characterized in the present study using test samples processed to a thickness from 20 to 240\mu \mathrm{m} by…”
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