Search Results - "Lo Iacono, Filippo"

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    Signal Integrity Flow for System-in-Package and Package-on-Package Devices

    Signal Integrity Flow for System-in-Package and Package-on-Package Devices by Pulici, Paolo, Vanalli, Gian Pietro, Dellutri, Michele A., Guarnaccia, Domenico, Lo Iacono, Filippo, Campardo, Giovanni, Ripamonti, Giancarlo

    Published in Proceedings of the IEEE (01-01-2009)
    “…As data rates required for systems in package (SiPs) increase and their complexity increases, signal integrity issues become increasingly difficult to address…”
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    Signal Integrity Flow for System-in-Package and Package-on-Package Devices : Signal degradation in these packages can be avoided by a practical design process that uses appropriate rules to simplify modeling, simulation, and analysis: 3-D Integration Technologies

    Signal Integrity Flow for System-in-Package and Package-on-Package Devices : Signal degradation in these packages can be avoided by a practical design process that uses appropriate rules to simplify modeling, simulation, and analysis: 3-D Integration Technologies by PULICI, Paolo, PIETRO VANALLI, Gian, DELLUTRI, Michele A, GUARNACCIA, Domenico, LO IACONO, Filippo, CAMPARDO, Giovanni, RIPAMONTI, Giancarlo

    Published in Proceedings of the IEEE (2009)
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