Search Results - "Liu, Colin"

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  1. 1

    Prolonged mobile phone use is associated with depressive symptoms in Chinese adolescents by Liu, Jianghong, Liu, Colin X., Wu, Tina, Liu, Bao-Peng, Jia, Cun-Xian, Liu, Xianchen

    Published in Journal of affective disorders (01-12-2019)
    “…•Prolonged mobile phone use is positively associated with risk of depression.•This relationship is observed both on weekdays and weekends.•Mobile phone use and…”
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    Journal Article
  2. 2
  3. 3

    Formulation and stability evaluation of an extemporaneously prepared baclofen suspension (1 mg/mL) by Purohit, Trusha J., Thakur, Sachin S., Carruth, Jonathan, Dean, Farhan, Kim, Darin, Lee, Seunghyun, Liu, Colin, Sharma, Manisha, Hanning, Sara M.

    Published in Journal of pharmacy practice and research (01-08-2021)
    “…Background Baclofen is prescribed for both adults and children as a muscle relaxant, but no data exists to support an appropriate lower‐dose extemporaneously…”
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    Journal Article
  4. 4

    A study of chip-last embedded flip-chip package by Chao, Shin-Hua, Tong, Ho-Ming, Hung, Chih-Pin, Lai, Yishao, Liu, Colin, Hsieh, Emma, Luh, Ding-Bang

    “…Flip-chip chip-scale packaging (FCCSP) has recently emerged as a package solution achieving superior performance over traditional wire-bonding technology…”
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    Journal Article
  5. 5

    Optimal energy management integration for a petrochemical plant under considerations of uncertain power supplies by Tung-Yun Wu, Shyan-Shu Shieh, Shi-Shang Jang, Liu, C.C.L.

    Published in IEEE transactions on power systems (01-08-2005)
    “…The electric power demands of many petrochemical plants are matched by supplies from an in-house cogeneration system and from the electric grid. However, due…”
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    Journal Article
  6. 6

    A study of chip-last embedded FCCSP by Shin-Hua Chao, Chih-Pin Hung, Yishao Lai, Liu, Colin, Hsieh, Emma, Ding-Bang Luh

    “…Flip-Chip Chip-Scale Packaging (FCCSP) has recently emerged as one of mainstream package solutions due to the superior performance & miniaturization over the…”
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    Conference Proceeding