Search Results - "Lin, G.W."

269 TUBB GENE EXPRESSION IN MDS PATIENTS WITH AND WITHOUT LEUKEMIC EVOLUTION: A NESTED CASE-CONTROL STUDY by Ma, Y, Xu, X.P, Chen, B.B, Lin, G.W

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Theoretical modelling of tunable narrow band reflective spectrum using nanoscale surface plasmons by Yang, J., Lin, G.W., Niu, Y.P., Gong, S.Q.

“…The spectrum width can be narrowed to a certain degree by decreasing the coupling strength for the two-level emitter coupled to the propagating surface…”
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The effect of atomic ordering on the hydrogen absorption and desorption of Ni 4Mo alloy by Cheng, X.Y., Lin, G.W., Li, H.G.

“…Hydrogen absorption and desorption of disordered and ordered Ni 4Mo alloys were investigated. The results show that the atomic ordering can promote gaseous…”
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Effect of atomic ordering on the hydrogen-induced environmental embrittlement of Ni 4Mo intermetallics by Cheng, X.Y., Lin, G.W., Li, H.G.

“…Hydrogen induced environmental embrittlement of a Ni 4Mo alloy in different degree of ordered conditions was investigated by tensile tests in various…”
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Effect of atomic ordering on the hydrogen-induced environmental embrittlement of Ni4Mo intermetallics by Cheng, X.Y., Lin, G.W., Li, H.G.

“…Hydrogen induced environmental embrittlement of a Ni4Mo alloy in different degree of ordered conditions was investigated by tensile tests in various…”
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The effect of atomic ordering on the hydrogen absorption and desorption of Ni4Mo alloy by CHENG, X. Y, LIN, G. W, LI, H. G

“…Hydrogen absorption and desorption of disordered and ordered Ni4Mo alloys were investigated. The results show that the atomic ordering can promote gaseous…”
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The maximum solid solubility of the transition metals in palladium by Fang, S.S., Lin, G.W., Zhang, J.L., Zhou, Z.Q.

“…The maximum solid solubility limit ( C max) of transition metals dissolved in palladium can be described as an equation in semi-empirical theories with…”
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Degradation behavior of foamed nickel positive electrodes of Ni–MH batteries by Zhou, Z.Q., Lin, G.W., Zhang, J.L., Ge, J.S., Shen, J.R.

“…The extrusion mechanism has been demonstrated to be the major cause for the capacity decay of the positive electrodes during cycling. However, based on our SEM…”
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Silicon-based Packaging Platform for Light Emitting Diode by Tsou, C., Huang, Y.S., Lin, G.W.

“…In this paper, we demonstrate a silicon-based packaging platform for a package component of light emitting diode (LED) by silicon bulk micromachining…”
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