Search Results - "Lim, DongHwan"

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  1. 1

    Development of a lower extremity Exoskeleton Robot with a quasi-anthropomorphic design approach for load carriage by Donghwan Lim, Wansoo Kim, Heedon Lee, Hojun Kim, Kyoosik Shin, Taejoon Park, JiYeong Lee, Changsoo Han

    “…This study developed the Hanyang Exoskeleton Assistive Robot (HEXAR)-CR50 aimed at improving muscle strength of the wearer while transporting a load. The…”
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    Conference Proceeding
  2. 2

    Unique reliability characteristics of fully depleted silicon-on-insulator tunneling FET by Kang, Soo Cheol, Lim, Donghwan, Lim, Sung Kwan, Noh, Jinwoo, Kim, Seung-Mo, Lee, Sang Kyung, Choi, Changhwan, Lee, Byoung Hun

    Published in Japanese Journal of Applied Physics (01-04-2018)
    “…This study investigated the unique reliability characteristics of tunneling field effect transistors (TFETs) by comparing the effects of positive bias…”
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    Journal Article
  3. 3

    Chemical bath deposited ZnS buffer layer for Cu(In,Ga)Se2 thin film solar cell by Hong, Jiyeon, Lim, Donghwan, Eo, Young-Joo, Choi, Changhwan

    Published in Applied surface science (28-02-2018)
    “…[Display omitted] •Chemical bath deposited ZnS thin films were prepared by ZnSO4, Zn(CH3COO)2, and ZnCl2.•The highest deposition rate is related to stability…”
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    Journal Article
  4. 4

    Influence of oxygen vacancies in ALD HfO2-x thin films on non-volatile resistive switching phenomena with a Ti/HfO2-x/Pt structure by Sokolov, Andrey Sergeevich, Jeon, Yu-Rim, Kim, Sohyeon, Ku, Boncheol, Lim, Donghwan, Han, Hoonhee, Chae, Myeong Gyoon, Lee, Jaeho, Ha, Beom Gil, Choi, Changhwan

    Published in Applied surface science (15-03-2018)
    “…[Display omitted] •Oxygen vacancies in ALD HfOx thin film were modulated by varying oxidant pulse time.•Resistive switching behaviors are governed by…”
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    Journal Article
  5. 5

    Tunneling field effect transistors (TFETs) with 3D fin-shaped channel structure and their electrical characteristics by Lim, Donghwan, Han, Hoonhee, Choi, Changhwan

    Published in Solid-state electronics (01-04-2019)
    “…•3D fin-shaped TFET shows higher Ion and lower S.S compared to planar TFET.•Interfacial treatment with chemical oxide lowers Ioff.•3D structure and chemical…”
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    Journal Article
  6. 6

    Improved performance of gate-last FDSOI tunnel field-effect-transistors (TFETs) with modulating Al2O3 composition in atomic layer deposited HfAlOx gate dielectrics by Lim, Donghwan, Lee, Jae Ho, Choi, Changhwan

    Published in Microelectronic engineering (25-06-2017)
    “…We have studied the electrical characteristics of both n-type and p-type fully depleted silicon on insulator (FD-SOI) tunnel field-effect transistors (TFETs)…”
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    Journal Article
  7. 7

    Modeling and Experimental Validation of Cell Morphology in Microcellular-Foamed Polycaprolactone by Lim, Donghwan, Lee, Sanghyun, Jung, Seungho, Kim, Kwanhoon, Hong, Jin, Cha, Sung Woon

    Published in Polymers (26-09-2024)
    “…This study investigates the modeling and experimental validation of cell morphology in microcellular-foamed polycaprolactone (PCL) using supercritical carbon…”
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    Journal Article
  8. 8

    Comparative study of Al2O3, HfO2, and HfAlOx for improved self‐compliance bipolar resistive switching by Sokolov, Andrey S., Son, Seok Ki, Lim, Donghwan, Han, Hoon Hee, Jeon, Yu‐Rim, Lee, Jae Ho, Choi, Changhwan

    Published in Journal of the American Ceramic Society (01-12-2017)
    “…The comparison of resistive switching (RS) storage in the same device architecture is explored for atomic layer deposition (ALD) Al2O3, HfO2 and HfAlOx‐based…”
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    Journal Article
  9. 9

    Improved performance of gate-last FDSOI tunnel field-effect-transistors (TFETs) with modulating Al^sub 2^O^sub 3^ composition in atomic layer deposited HfAlO^sub x^ gate dielectrics by Lim, Donghwan, Lee, Jae Ho, Choi, Changhwan

    Published in Microelectronic engineering (25-06-2017)
    “…We have studied the electrical characteristics of both n-type and p-type fully depleted silicon on insulator (FD-SOI) tunnel field-effect transistors (TFETs)…”
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    Journal Article
  10. 10

    Monolithic 3D Integration of InGaAs Photodetectors on Si MOSFETs Using Sequential Fabrication Process by Geum, Dae-Myeong, Kim, Seong Kwang, Lee, Subin, Lim, Donghwan, Kim, Hyung-Jun, Choi, Chang Hwan, Kim, Sang-Hyeon

    Published in IEEE electron device letters (01-03-2020)
    “…We demonstrated the monolithic 3D (M3D) integration of InGaAs photodetectors (PDs) on silicon-on-insulator metal-oxide-semiconductor field-effect transistors…”
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    Journal Article
  11. 11

    Hot-Carrier Degradation Estimation of a Silicon-on-Insulator Tunneling FET Using Ambipolar Characteristics by Kang, Soo Cheol, Lim, Donghwan, Kang, Seok Jin, Lee, Sang Kyung, Choi, Changhwan, Lee, Dong Seon, Lee, Byoung Hun

    Published in IEEE electron device letters (01-11-2019)
    “…The unique degradation behavior of a tunneling field-effect transistor (TFET) under hot-carrier injection (HCI) stress has been previously investigated…”
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    Journal Article
  12. 12

    A versatile smart transformation optics device with auxetic elasto-electromagnetic metamaterials by Shin, Dongheok, Urzhumov, Yaroslav, Lim, Donghwan, Kim, Kyoungsik, Smith, David R.

    Published in Scientific reports (13-02-2014)
    “…Synergistic integration of electromagnetic (EM) and mechanical properties of metamaterials, a concept known as smart metamaterials, promises new applications…”
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    Journal Article
  13. 13

    Development of a biocompatible radiotherapy spacer using 3D printing and microcellular foaming process for enhanced prostate cancer treatment by Lim, DongHwan, Yoon, DoKun, Kim, JaeHoo, Sung, KiHoon, Choi, YoungEun, Sheen, HeeSoon, Shin, Han-Back, Cha, Sung Woon

    Published in International journal of bioprinting (06-08-2024)
    “…In this study, a new active spacer was developed using three-dimensional (3D) printing technology and microcellular foaming process to overcome the limitations…”
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    Journal Article
  14. 14

    Influence of in-situ NH3 plasma passivation on the electrical characteristics of Ga-face n-GaN MOS capacitor with atomic layer deposited HfO2 by Jung, Woo Suk, Lim, Donghwan, Han, Hoonhee, Sokolov, Andrey Sergeevich, Jeon, Yu-Rim, Choi, Changhwan

    Published in Solid-state electronics (01-11-2018)
    “…•In-situ NH3 plasma passivation for Ga-face n-GaN MOS capacitor was done by varying plasma power and exposure time.•Improvement in frequency dispersion, ΔVFB,…”
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    Journal Article
  15. 15
  16. 16

    Comparative study of Al 2 O 3 , HfO 2 , and HfAlO x for improved self‐compliance bipolar resistive switching by Sokolov, Andrey S., Son, Seok Ki, Lim, Donghwan, Han, Hoon Hee, Jeon, Yu‐Rim, Lee, Jae Ho, Choi, Changhwan

    Published in Journal of the American Ceramic Society (01-12-2017)
    “…The comparison of resistive switching ( RS ) storage in the same device architecture is explored for atomic layer deposition ( ALD ) Al 2 O 3 , HfO 2 and HfAlO…”
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    Journal Article
  17. 17

    Electrical characteristics of ALD La sub(2)O sub(3) capping layers using different lanthanum precursors in MOS devices with ALD HfO sub(2), HfSiO sub(x), and HfSiON gate dielectrics by Lim, Donghwan, Jung, Woo Suk, Kim, Young Jin, Choi, Changhwan

    Published in Microelectronic engineering (01-11-2015)
    “…We have investigated the electrical characteristics - flat band voltage (V sub(FB)) shift, equivalent oxide thickness (EOT) scaling and charge trapping - of…”
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    Journal Article
  18. 18

    The effects of process temperature on the work function modulation of ALD HfO2 MOS device with plasma enhanced ALD TiN metal gate using TDMAT precursor by Kim, Young Jin, Lim, Donghwan, Han, Hoon Hee, Sergeevich, Andrey Sokolov, Jeon, Yu-Rim, Lee, Jae Ho, Son, Seok Ki, Choi, Changhwan

    Published in Microelectronic engineering (25-06-2017)
    “…We have investigated the effects of metal gate process temperature on the effective work function (Weff) of MOS devices with all ALD HfO2/TiN gate stack and…”
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    Journal Article
  19. 19

    Remote plasma atomic layer deposited Al2O3 4H SiC MOS capacitor with remote H2 plasma passivation and post metallization annealing by Heo, Seung Chan, Lim, Donghwan, Jung, Woo Suk, Choi, Rino, Yu, Hyun-Yong, Choi, Changhwan

    Published in Microelectronic engineering (01-11-2015)
    “…[Display omitted] •ALD Al2O3/4H-SiC MOS device with remote H2 plasma passivation.•Lower Jg, lower hysteresis, higher VBD, and reduced Dit with H2 plasma…”
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    Journal Article
  20. 20

    Suppressed charge trapping characteristics of (NH^sub 4^)^sub 2^S^sub x^ passivated GaN MOS device with atomic layer deposited HfAlO^sub x^ gate dielectric by Han, Hoon Hee, Lim, Donghwan, Sergeevich, Andrey Sokolov, Jeon, Yu-Rim, Lee, Jae Ho, Son, Seok Ki, Choi, Changhwan

    Published in Microelectronic engineering (25-06-2017)
    “…The charge trapping behaviors of ammonium poly-sulfide, (NH4)2Sx, passivated GaN MOS device with atomic layer deposited HfAlOx gate dielectric and DC-sputtered…”
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    Journal Article