Search Results - "Liao, E.B."

Bendability of single-crystal Si MOSFETs investigated on flexible substrate by Li, H.Y., Guo, L.H., Loh, W.Y., Bera, L.K., Zhang, Q.X., Hwang, N., Liao, E.B., Teoh, K.W., Chua, H.M., Shen, Z.X., Cheng, C.K., Lo, G.Q., Balasubramanian, N., Kwong, D.-L.

“…This letter reports on a device layer transfer (based on thermal bonding and grinding backside Si) process and device characteristics of Si MOSFETs on a…”
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Integration of RF MEMS and CMOS IC on a Printed Circuit Board for a Compact RF System Application Based on Wafer Transfer by Zhang, Q.X., Yu, A.B., Rong Yang, Li, H.Y., Guo, L.H., Liao, E.B., Min Tang, Guo Qiang Lo, Balasubramanian, N., Dim Lee Kwong

“…In this paper, a novel platform technology for integrating radio-frequency microelectromechanical systems (RF-MEMS) and CMOS on a printed circuit board (PCB)…”
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Novel Integration of Metal-Insulator-Metal (MIM) Capacitors Comprising Perovskite-type Dielectric and Cu Bottom Electrode on Low-Temperature Packaging Substrates by Liao, E.B., Choong, T.H., Zhu, W.G., Teoh, K.W., Lim, P.C., Lo, G.Q., Kwong, D.L.

“…In this letter, a novel integration scheme, for metal-insulator-metal capacitors comprising perovskite-type dielectrics and Cu-based bottom electrodes, has…”
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High-density MIM capacitors (/spl sim/85 nF/cm/sup 2/) on organic substrates by Liao, E.B., Guo, L.H., Kumar, R., Lo, G.Q., Balasubramanian, N., Kwong, D.L.

“…For the first time, transferring the prefabricated capacitors on a silicon wafer onto FR-4 has been used to realize high-density metal-insulator-metal (MIM)…”
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Fatigue and Bridging Study of High-Aspect-Ratio Multicopper-Column Flip-Chip Interconnects Through Solder Joint Shape Modeling by Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V.

“…This paper addresses fatigue and bridging issues by numerical analysis for an ultra-fine-pitch flip-chip interconnect that consists of multiple copper columns…”
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Development of 3-D Silicon Module With TSV for System in Packaging by Khan, N., Rao, V.S., Lim, S., Ho Soon We, Lee, V., Xiaowu Zhang, Liao, E.B., Nagarajan, R., Chai, T.C., Kripesh, V., Lau, J.H.

“…Portable electronic products demand multifunctional module comprising of digital, radio frequency and memory functions. Through silicon via (TSV) technology…”
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Planar Microspring-A Novel Compliant Chip-to-Package Interconnect for Wafer-Level Packaging by Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Lo, G.Q.

“…In this paper, a novel compliant chip-to-package interconnect, planar microspring, is presented in terms of design consideration, wafer-level fabrication…”
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Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging by Liao, E.B., Tay, A.A.O., Ang, S.S., Feng, H.H., Nagarajan, R., Kripesh, V.

“…This paper presents modeling and simulation results of a modified copper-column-based flip-chip interconnect with ultrafine pitch for wafer-level packaging,…”
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Etching control of benzocyclobutene in CF 4 / O 2 and SF 6 / O 2 plasmas with thick photoresist and titanium masks by Liao, E.B., Teh, W.H., Teoh, K.W., Tay, A.A.O., Feng, H.H., Kumar, R.

“…By using thick photoresist AZ9260 and sputtered Ti film as masks, dry etching characteristics of benzocyclobutene (BCB), including etch rates, selectivities…”
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Etching control of benzocyclobutene in CF4/O2 and SF6/O2 plasmas with thick photoresist and titanium masks by LIAO, E. B, TEH, W. H, TEOH, K. W, TAY, A. A. O, FENG, H. H, KUMAR, R

“…By using thick photoresist AZ9260 and sputtered Ti film as masks, dry etching characteristics of benzocyclobutene (BCB), including etch rates, selectivities…”
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RF, DC, and Reliability Performance of MIM Capacitors Embedded in Organic Substrates by Wafer-Transfer Technology (WTT) for System-on-Package Applications by Liao, E.B., Hongyu Li, Guo, L.H., Guo-Qiang Lo, Kumar, R., Balasubramanian, N., Dim-Lee Kwong

“…In this paper, radio frequency (RF), dc, and reliability performance have been studied on metal-insulator-metal (MIM) capacitors embedded in organic…”
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Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package by Zhang, X., Chai, T.C., Lau, J.H., Selvanayagam, C.S., Biswas, K., Shiguo Liu, Pinjala, D., Tang, G.Y., Ong, Y.Y., Vempati, S.R., Wai, E., Li, H.Y., Liao, E.B., Ranganathan, N., Kripesh, V., Jiangyan Sun, Doricko, J., Vath, C.J.

“…Because of Moore's (scaling/integration) law, the Cu/low-k silicon chip is getting bigger, the pin-out is getting higher, and the pitch is getting finer. Thus,…”
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High density 3D integration using CMOS foundry technologies for 28 nm node and beyond by Lin, J C, Chiou, W C, Yang, K F, Chang, H B, Lin, Y C, Liao, E B, Hung, J P, Lin, Y L, Tsai, P H, Shih, Y C, Wu, T J, Wu, W J, Tsai, F W, Huang, Y H, Wang, T Y, Yu, C L, Chang, C H, Chen, M F, Hou, S Y, Tung, C H, Jeng, S P, Yu, D C H

“…Technology challenges and solutions in the development and fabrication of high-density three dimensional (3D) chip integration structures have been…”
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A low insertion loss 60 GHz band pass filter using wafer transfer by Luo, B., Guo, Y.X., Wang, J.P., Liao, E.B.

“…In this paper, a low insertion loss band pass filter using WTT for 60 GHz band applications is presented. The filter geometry was pre-fabricated on a Si wafer…”
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Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects by Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Mahadevan, I.

“…In this paper, macro- and micro-modeling technique is implemented to correlate the compliance, deformation and thermal fatigue damage of composite interconnect…”
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High performance embedded RF passive device process integration by Li, H.Y., Khoo, Y.M., Khan, N., Teoh, K.W., Rao, V.S., Li, H.B., Liao, E.B., Mohanraj, S., Kripesh, V., Rakesh, K.

“…We report the process evaluation and integration for the embedded RF passive device in this paper. Two sets of test vehicle were designed and fabricated for…”
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Dry Self-Assembly & Gang bonding of micro-components from silicon carrier to substrate wafer by Ong, Y.Y., Lim, Y.L., Yan, L.L., Liao, E.B., Kripesh, V.

“…We have demonstrated parallel self-assembly process based on mechanical shape-matching between the protrusions of micro-components and the cavities on an 8"…”
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Integration of RF-MEMS, passives and CMOS-IC on silicon substrate by low temperature wafer to wafer bonding technique by Zhang, Q.X., Li, H.Y., Tang, M., Yu, A.B., Liao, E.B., Rong Yang, Lo, G.Q., Balasubramanian, N., Kwong, D.L.

“…In this paper, a novel platform technology for system level integration of RF-MEMS, RF passives and CMOS-IC on silicon substrate is reported. The RF passives…”
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Self-Assembly of Components using Shape-matching by Ong, Y.Y., Lim, Y.L., Yan, L.L., Vempati, S., Liao, E.B., Kripesh, V., Yoon, S.U.

“…This paper describes a process of mass self-assembly of micro-components onto a silicon substrate using mechanical shape-locking mechanism. Protrusions of…”
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Shape matching-assisted self-assembly of microchips on a silicon substrate by Yan, L.L., Lim, Y.L., Ong, Y.Y., Liao, E.B., Kripesh, V.

“…The paper describes a process of mass assembly of microchips onto silicon substrate using mechanical shape locking mechanism. A certain pattern was fabricated…”
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