Search Results - "Li, G.Y."

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  1. 1

    Signal Processing in Cognitive Radio by Ma, Jun, Li, Geoffrey Ye, Juang, Biing Hwang

    Published in Proceedings of the IEEE (01-05-2009)
    “…Cognitive radio allows for usage of licensed frequency bands by unlicensed users. However, these unlicensed (cognitive) users need to monitor the spectrum…”
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    Journal Article
  2. 2

    Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints in reflow process by Tang, Y., Li, G.Y., Pan, Y.C.

    Published in Journal of alloys and compounds (25-03-2013)
    “…► The microstructure and kinetics of IMC growth between SAC-xTiO2 and Cu were studied. ► Addition of small amounts TiO2 nanoparticles can suppress the growth…”
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    Journal Article
  3. 3

    Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process by Tang, Y., Guo, Q.W., Luo, S.M., Li, Z.H., Li, G.Y., Hou, C.J., Zhong, Z.Y., Zhuang, J.J.

    Published in Journal of alloys and compounds (25-03-2019)
    “…The effects of adding CeO2 nanoparticles on the formation and growth of interfacial intermetallic compounds (IMCs) between Sn-0.3Ag-0.7Cu-xCeO2 (x = 0, 0.05,…”
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  4. 4
  5. 5

    Structural, optical and electrical properties of cerium and gadolinium doped CdO thin films by Pan, L.L., Li, G.Y., Lian, J.S.

    Published in Applied surface science (01-06-2013)
    “…•Highly textured cerium and gadolinium co-doped CdO films were deposited on glass substrates by RF magnetron sputtering.•The average optical transmittance of…”
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  6. 6

    Fire retardant mechanism analysis between ammonium polyphosphate and triphenyl phosphate in unsaturated polyester resin by Pan, L.L., Li, G.Y., Su, Y.C., Lian, J.S.

    Published in Polymer degradation and stability (01-09-2012)
    “…Ammonium polyphosphate (APP) and triphenyl phosphate (TPP) were added in a dicyclopentadiene (DCPD) modified unsaturated polyester resin (UPR) as intumescent…”
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  7. 7

    Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder by Tang, Y., Li, G.Y., Pan, Y.C.

    Published in Materials in engineering (01-03-2014)
    “…Photomicrographs revealing slip character: (a) low magnification photograph of slip on planes in the Sn–3.0Ag–0.5Cu–0.1TiO2 composite solder alloy, (b) slip…”
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  8. 8

    An ES-FEM for accurate analysis of 3D mid-frequency acoustics using tetrahedron mesh by He, Z.C., Li, G.Y., Zhong, Z.H., Cheng, A.G., Zhang, G.Y., Li, Eric, Liu, G.R.

    Published in Computers & structures (01-09-2012)
    “…► An ES-FEM is proposed for 3D acoustics problems in the mid-frequency range. ► The gradient smoothing operation is applied on a new smoothing domain for this…”
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  9. 9

    The role of twinning–detwinning on fatigue fracture morphology of Mg–3%Al–1%Zn alloy by Yin, S.M., Yang, F., Yang, X.M., Wu, S.D., Li, S.X., Li, G.Y.

    “…Typical fracture morphology of Mg–3%Al–1%Zn (AZ31) alloy after low cycle fatigue was investigated using SEM and optical microscope. It is shown that prolific…”
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  10. 10

    Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints by Li, Z.L., Cheng, L.X., Li, G.Y., Huang, J.H., Tang, Y.

    Published in Journal of alloys and compounds (01-03-2017)
    “…The influence of the joint size on the growth of intermetallic compound (IMC) between Sn-3.0Ag-0.5Cu-0.1TiO2 composite solder and Cu pad during isothermal…”
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    Journal Article
  11. 11

    Deformation twinning in polycrystalline copper at room temperature and low strain rate by Huang, C.X., Wang, K., Wu, S.D., Zhang, Z.F., Li, G.Y., Li, S.X.

    Published in Acta materialia (01-02-2006)
    “…Deformation twins were widely observed in polycrystalline Cu with grain sizes varying from micrometers to nanometers during the process of equal channel…”
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  12. 12

    Static and free vibration analysis of laminated composite plates using the conforming radial point interpolation method by Liu, G.R., Zhao, X., Dai, K.Y., Zhong, Z.H., Li, G.Y., Han, X.

    Published in Composites science and technology (01-02-2008)
    “…In this paper, a mesh-free formulation for the static and free vibration analyses of composite plates is presented via a linearly conforming radial point…”
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  13. 13

    Metal forming analysis using the edge-based smoothed finite element method by Cui, X.Y., Li, G.Y.

    Published in Finite elements in analysis and design (01-01-2013)
    “…This paper presents an edge-based gradient smoothing technique for the simulation of metal forming processes. In presented method, the work pieces are first…”
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  14. 14

    A study and application of zinc phosphate coating on AZ91D magnesium alloy by Niu, L.Y., Jiang, Z.H., Li, G.Y., Gu, C.D., Lian, J.S.

    Published in Surface & coatings technology (08-02-2006)
    “…A technology for obtaining the zinc phosphate coating on an AZ91D magnesium alloy was investigated. The main ingredients in the phosphating bath were H 3PO 4,…”
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  15. 15

    A nodal integration technique for meshfree radial point interpolation method (NI-RPIM) by Liu, G.R., Zhang, G.Y., Wang, Y.Y., Zhong, Z.H., Li, G.Y., Han, X.

    “…A novel nodal integration technique for the meshfree radial point interpolation method (NI-RPIM) is presented for solid mechanics problems. In the NI-RPIM,…”
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  16. 16

    Electroless Ni–Sn–P coating on AZ91D magnesium alloy and its corrosion resistance by Zhang, W.X., Jiang, Z.H., Li, G.Y., Jiang, Q., Lian, J.S.

    Published in Surface & coatings technology (15-03-2008)
    “…An electroless Ni–Sn–P coating was deposited on AZ91D magnesium alloy in an alkaline-citrate-based bath where nickel sulphate and sodium stannate were used as…”
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  17. 17

    Spatial spectrum holes for cognitive radio with relay-assisted directional transmission by Guodong Zhao, Jun Ma, Li, G.Y., Tao Wu, Young Kwon, Soong, A., Chenyang Yang

    “…Spectrum hole (SH) is defined as a spectrum band that can be utilized by unlicensed users, which is a basic resource for cognitive radio (CR) systems. Most of…”
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  18. 18

    Influence of Sb on IMC growth in Sn–Ag–Cu–Sb Pb-free solder joints in reflow process by Chen, B.L., Li, G.Y.

    Published in Thin solid films (01-09-2004)
    “…The influence of Sb on the soldering reaction and growth kinetics of Intermetallic compound (IMC) in Sn–3.5Ag–0.7Cu– xSb ( x=0, 0.5, 1.0, and 1.5) lead-free…”
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  19. 19

    On the critical inclusion size of high strength steels under ultra-high cycle fatigue by Yang, Z.G., Zhang, J.M., Li, S.X., Li, G.Y., Wang, Q.Y., Hui, W.J., Weng, Y.Q.

    “…In this paper, the critical inclusion size (CIS) of high strength steels with given matrix hardness or tensile strength and the surface roughness under…”
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  20. 20

    Proactive detection of spectrum opportunities in primary systems with power control by Guodong Zhao, Li, G.Y., Chenyang Yang

    “…Spectrum sensing finds spectrum opportunities for cognitive radio (CR) and enables CR users to work without harmful interference to primary users. Most of…”
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