Search Results - "Lhostis, Sandrine"

Electrical Behavior of Phase-Change Memory Cells Based on GeTe by Perniola, Luca, Sousa, Veronique, Fantini, Andrea, Arbaoui, Edrisse, Bastard, Audrey, Armand, Marilyn, Fargeix, Alain, Jahan, Carine, Nodin, Jean-Francois, Persico, Alain, Blachier, Denis, Toffoli, Alain, Loubriat, Sebastien, Gourvest, Emanuel, Betti Beneventi, Giovanni, Feldis, Helene, Maitrejean, Sylvain, Lhostis, Sandrine, Roule, Anne, Cueto, Olga, Reimbold, Gilles, Poupinet, Ludovic, Billon, Thierry, De Salvo, Barbara, Bensahel, Daniel, Mazoyer, Pascale, Annunziata, Roberto, Zuliani, Paola, Boulanger, Fabien

“…In this letter, we present a study on the electrical behavior of phase-change memories (PCMs) based on a GeTe active material. GeTe PCMs show, first, extremely…”
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Effect of ion implantation energy for the synthesis of Ge nanocrystals in SiN films with HfO2/SiO2 stack tunnel dielectrics for memory application by Sahu, Bhabani Shankar, Gloux, Florence, Slaoui, Abdelilah, Carrada, Marzia, Muller, Dominique, Groenen, Jesse, Bonafos, Caroline, Lhostis, Sandrine

“…Ge nanocrystals (Ge-NCs) embedded in SiN dielectrics with HfO 2 /SiO 2 stack tunnel dielectrics were synthesized by utilizing low-energy (≤5 keV) ion…”
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From Electrical to Physical-Chemical Characterization of the Cu/SiO₂ Hybrid-Bonding Interface-A Cu₂O-Layer as a Cu Diffusion Barrier? by Moreau, Stephane, Manzanarez, Herve, Bernier, Nicolas, Jourdon, Joris, Lhostis, Sandrine, Fremont, Helene

“…This letter discusses copper (Cu) diffusion in the framework of the development of future 3D stacked devices by means of hybrid bonding-based interconnects…”
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Search for copper diffusion at hybrid bonding interface through chemical and electrical characterizations by Jourdon, Joris, Lhostis, Sandrine, Moreau, Stéphane, Lamontagne, Patrick, Frémont, Hélène

“…Cu/SiO2 diffusion at hybrid bonding interface without diffusion barrier was investigated in order to validate the electrical insulation of interconnects. The…”
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Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits by Ayoub, Bassel, Lhostis, Sandrine, Moreau, Stéphane, Mattei, Jean-Gabriel, Mukhtarov, Anna, Frémont, Hélène

“…Reliability concerns are often risen for the hybrid bonding integration due to a potential misalignment in the bonding step leading that Cu directly faces…”
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Angular and polarization properties of cross-holes nanostructured metallic filters by Girard-Desprolet, Romain, Boutami, Salim, Lhostis, Sandrine, Vitrant, Guy

“…It has been shown in literature that cross-shaped holes arrays can be made insensitive to polarization at normal incidence, and can even feature good stability…”
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Evaluation of Hybrid Bonding Interface Quality by Contact Resistivity Measurement by Jourdon, Joris, Lhostis, Sandrine, Moreau, Stephane, Bresson, Nicolas, Salome, Pascal, Fremont, Helene

“…With the rise of hybrid bonding as a solution for fine pitch 3-D integration, new methods are required to evaluate the bonding quality at a wafer level…”
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Reliability of the hybrid bonding level using submicrometric bonding pads by Lhostis, S., Ayoub, B., Frémont, H., Moreau, S., Mattei, J.-G., Lamontagne, P., Tournier, A.

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In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration by Ayoub, Bassel, Moreau, Stéphane, Lhostis, Sandrine, Frémont, Hélène, Mermoz, Sébastien, Souchier, Emeline, Deloffre, Emilie, Escoubas, Stéphanie, Cornelius, Thomas W., Thomas, Olivier

“…Hybrid bonding is a very promising 3D packaging technology which allows extremely high interconnect density between electronic chips. In its most advanced…”
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Theoretical and experimental study of a thermal damper based on a CNT/PCM composite structure for transient electronic cooling by Kinkelin, Christophe, Lips, Stéphane, Soupremanien, Ulrich, Remondière, Vincent, Dijon, Jean, Le Poche, Hélène, Ollier, Emmanuel, Zegaoui, Malek, Rolland, Nathalie, Rolland, Paul-Alain, Lhostis, Sandrine, Descouts, Brigitte, Kaplan, Yann, Lefèvre, Frédéric

“…•Two non-dimensional parameters enabling to design an ideal thermal damper are identified.•Latent energy storage capacity of embedded PCM is estimated and…”
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Correlation Between Electromigration-Related Void Volumes and Time-to-Failure by High Resolution X-Ray Tomography and Modeling by Moreau, Stephane, Fraczkiewicz, Alexandra, Bouchu, David, Bleuet, Pierre, Cloetens, Peter, Cesar Da Silva, Julio, Manzanarez, Herve, Lorut, Frederic, Lhostis, Sandrine

“…High resolution synchrotron tomography has demonstrated a proportionality between electromigration induced void volume and time-to-failure in hybrid bonding…”
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Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 nm by Lhostis, S., Ayoub, B., Sart, C., Moreau, S., Souchier, E., Gusmao Cacho, M. G., Deloffre, E., Mermoz, S., Rey, C., Le Roux, F., Aybeke, E., Gallois-Garreignot, S., Frémont, H., Tournier, A.

“…Three-dimensional (3D) stacking using hybrid bonding is the most scalable method for 3D integration. As the hybrid bonding pad width is reduced to adopt a…”
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Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach by Wlanis, Thomas, Hammer, René, Ecker, Werner, Lhostis, Sandrine, Sart, Clément, Gallois-Garreignot, Sébastien, Rebhan, Bernhard, Maier, Günther A.

“…Cu-SiO2 direct hybrid bonding is considered as one of the key enabling technologies for 3D integration. Previous studies showed that the main process…”
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Impact of process factors on the performance of hole array metallic filters by Girard-Desprolet, Romain, Lhostis, Sandrine, Beylier, Charlotte, Farys, Vincent, Vitrant, Guy, Boutami, Salim

“…In this work, we evaluate through rigorous coupled-wave analysis simulations the effect of various process-related inaccuracies on plasmonic filters…”
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Thin film characterization by total reflection x-ray fluorescence by Danel, Adrien, Nolot, Emmanuel, Veillerot, Marc, Olivier, Ségolène, Decorps, Tifenn, Calvo-Muñoz, Maria-Luisa, Hartmann, Jean-Michel, Lhostis, Sandrine, Kohno, Hiroshi, Yamagami, Motoyuki, Geoffroy, Charles

“…Sensitive and accurate characterization of films thinner than a few nm used in nanoelectronics represents a challenge for many conventional production…”
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RC delay mitigation for sub 700 nm hybrid bonding pitch by Lhostis, Sandrine, Ayoub, Bassel, Fremont, Helene, Moreau, Stephane, Mermoz, Sebastien, Deloffre, Emilie, Souchier, Emeline, Cacho, Maria Gabriela Gusmao, Aybeke, Ece, Lamontagne, Patrick, Rey, Christelle, Tournier, Arnaud

“…Hybrid bonding is one of the most scalable 3D integration methods allowing very high interconnect density. The bonding pitch reduction leads to an increase in…”
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Sub 1\ \mu \mathrm Pitch Achievement for Cu/SiO2 Hybrid Bonding by Ayoub, Bassel, Lhostis, Sandrine, Moreau, Stephane, Souchier, Emeline, Deloffre, Emilie, Mermoz, Sebastien, Cacho, Maria Gabriela Gusmao, Szekely, Norah, Rey, Christelle, Aybeke, Ece, Gredy, Victor, Lamontagne, Patrick, Thomas, Olivier, Fremont, Helene

“…With hybrid bonding pitch reduction, many challenges are arising especially the ones related to Cu-Cu connections with submicron Cu pads. A methodology is…”
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Numerical and experimental investigations on the hybrid bonding of Cu/SiÜ2 patterned surfaces using a cohesive model by Sart, Clement, Estevez, Rafael, Fiori, Vincent, Lhostis, Sandrine, Parry, Guillaume, Gonella, Roberto

“…Among the numerous ways to process 3D stacking of integrated circuits, a promising method is the use of Cu/SiO 2 hybrid bonding, which enables simultaneous…”
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Mass Transport-Induced Failure of Hybrid Bonding-Based Integration for Advanced Image Sensor Applications by Moreau, Stephane, Bouchu, David, Balan, Viorel, Le Berrigo, Anne-Lise, Jouve, Amandine, Henrion, Yann, Besset, Carine, Scevola, Daniel, Lhostis, Sandrine, Guyader, Francois, Deloffre, Emilie, Mermoz, Sebastien, Pruvost, Julien

“…This paper presents, for the first time, an electromigration study for a hybrid bonding-based integration for advanced image sensor applications. This work…”
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Impact of integrating microchannel cooling within 3D microelectronic packages for portable applications by Collin, Louis-Michel, Frechette, Luc G., Souifi, Abdelkader, Lhostis, Sandrine, de Crecy, Francois, Cheramy, Severine, Colonna, Jean-Philippe, Fiori, Vincent

“…This work presents the impact of integrating microfluidic channels at different locations in a 3D stacked chip configuration to improve its thermal management…”
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