Search Results - "Leyrer, Benjamin"

Model-Guided Manufacturing of Transducer Arrays Based on Single-Fibre Piezocomposites by Angerer, Martin, Zapf, Michael, Leyrer, Benjamin, Ruiter, Nicole V.

“…For breast cancer imaging, ultrasound computer tomography (USCT) is an emerging technology. To improve the image quality of our full 3-D system, a new…”
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Semi-Automated Packaging of Transducer Arrays for 3D Ultrasound Computer Tomography by Angerer, Martin, Zapf, Michael, Leyrer, Benjamin, Ruiter, Nicole V.

“…A semi-automated packaging process for transducer array manufacturing is presented. As an major innovation, a transducer disc is integrated in a sandwich…”
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Reliability of Silicone and Epoxy Resin Encapsulated Power Modules in HV-H3TRB tests with Thin-Resin coated Dice by Steiner, Felix, Wurst, Helge, Leyrer, Benjamin, Ishikawa, Dai, Nakako, Hideo, Blank, Thomas

“…Soft silicone gels, as the standard potting materials for power electronic modules, provide little protection against water ingress and thus cannot protect the…”
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Copper sintered Si3N4 Power Modules in Thermal Shock Tests by Blank, Thomas, Zhang, Hongpeng, Wurst, Helge, Leyrer, Benjamin, Steiner, Felix, Ishikawa, Dai, Geckele, Udo, Peric, Ivan

“…The mechanical behavior of Al 2 O 3 -DCB and Si 3 N 4 -AMB power modules comprising copper sintered SiC-and Si-dice in liquid to liquid thermal shock cycles…”
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Die-attach Properties of Pressure-sintered Copper Joints on Adhesive Metallization Surfaces in N2 Atmosphere by Ishikawa, Dai, An, Bao Ngoc, Mail, Matthias, Wurst, Helge, Leyrer, Benjamin, Blank, Thomas, Weber, Marc, Nakako, Hideo

“…Die-attach properties of mechanical pressure-assisted sintered copper (pressure-sintered Cu) on some metallization layers in N2 atmosphere for high-power…”
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GaAs Diode Rectifier Power Module in mixed Ag- and Large Area Cu-Sintering Technology for Ultra-Fast and Wireless Electric Vehicle Battery Charging by Blank, Thomas, Dudek, Volker, Luh, Matthias, An, Bao Ngoc, Wurst, Helge, Leyrer, Benjamin, Ishikawa, Dai, Weber, Marc

“…This paper describes the properties of GaAs PIN power diodes and demonstrates their utilization in a 650V 10kW LLC converter for fast charging of electric…”
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Analysis of Bonding Interfaces of Pressureless-sintered Cu on Metallization Layers by Ishikawa, Dai, An, Bao Ngoc, Mail, Matthias, Wurst, Helge, Leyrer, Benjamin, Blank, Thomas, Weber, Marc, Ueda, Suguru, Nakako, Hideo, Kawana, Yuki

“…this paper describes thermal stabilities (573 K for 8 h) of pressureless-sintered Copper (Cu) on four kinds of top metallization layers (Ni, Cu, Ag, and Au) by…”
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A highly integrated copper sintered SiC power module for fast switching operation by An, Bao Ngoc, Ishikawa, Dai, Blank, Thomas, Wurst, Helge, Demattio, Horst, Leyrer, Benjamin, Kolb, Johannes, Scherer, Torsten, Simon, Ansgar, Weber, Marc

“…A novel 1200 V and 110 A SiC pin-fin direct cooled six-pack power module with integrated DC-link capacitor and gate driver circuits is presented. The SiC power…”
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Highly integrated power modules based on copper thick-film-on-DCB for high frequency operation of SiC semiconductors - Design and manufacture by Schmenger, Max, Meisser, Michael, Hamilton, Dean, Leyrer, Benjamin, Bernd, Martin, Mawby, Philip, Blank, Thomas

“…This paper encompasses the design and the manufacture of a full-SiC module based on copper thick-film. Both DC-link capacitors as well as gate drives are…”
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Evaluation of Ag-sinter pastes for the die attachment in power electronic modules using design of experiments by Bao Ngoc An, Kempf, Maurizio, Leyrer, Benjamin, Blank, Thomas, Kolb, Johannes, Weber, Marc

“…Silver sintering is a potential die attach technology to replace the solder technology for power electronic systems. A design of experiments (DoE) is performed…”
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High power density LED modules with silver sintering die attach on aluminum nitride substrates by Schneider, Marc, Leyrer, Benjamin, Herbold, Christian, Maikowske, Stefan

“…Current research studies deal with the investigation of the thermal and optical properties of four LED modules on different substrate materials. The LED…”
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Very high power density LED modules on aluminum substrates with embedded water cooling by Schneider, Marc, Leyrer, Benjamin, Herbold, Christian, Maikowske, Stefan

“…We present optical measurements of an LED module consisting of 98 UV LEDs with an emission wavelength of 395 nm soldered onto a ceramic substrate within an…”
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Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties by Ishikawa, Dai, Nakako, Hideo, Kawana, Yuki, Sugama, Chie, Negishi, Motohiro, Ejiri, Yoshinori, Ueda, Suguru, An, Bao Ngoc, Wurst, Helge, Leyrer, Benjamin, Blank, Thomas, Weber, Marc

“…this paper describes the sintering properties and bonding properties of copper (Cu) die-bonding sinter paste for power devices operating at high temperatures…”
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Blue and white light emitting high power density LED modules by Schneider, Marc, Leyrer, Benjamin, Osswald, Bernhard, Herbold, Christian, Herrmann, Franziska, Eilert, Kirsten, Brandner, Jurgen B., Jin-Kai Chang, Yi-Chung Huang, Wood-Hi Cheng

“…We present optical measurements of an optimized LED module consisting of 98 blue light emitting LED chips silver-sintered onto an aluminum nitride ceramic…”
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Index matched fluidic packaging of high power UV LED clusters on aluminum substrates for improved optical output power by Schneider, M., Leyrer, B., Herbold, C., Maikowske, S., Brandner, J. J.

“…We present an improved cooling for a high power density UV LED module for a wavelength of 395 nm. The module consists of 98 LED chips soldered on a thick film…”
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Thermal improvements for high power UV LED clusters by Schneider, M., Leyrer, B., Herbold, C., Trampert, K., Brandner, J. J.

“…We present a high power density UV LED module for a wavelength of 395 nm with an optical power density of 27.3 W/cm 2 . The module consists of 98 densely…”
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