Search Results - "Lenos, A"

Use of a carotid artery for arterial cannulation: side-related differences by Urbanski, P P, Lenos, A, Lindemann, Y, Zacher, M, Frank, S, Diegeler, A

“…Cannulation of arch arteries (innominate, axillary or carotid) for arterial return during cardiopulmonary bypass is increasingly being used; however, the flow…”
Get more information

First experiences with protected VT ablation using surgical Impella 5.5 by Nentwich, K, Ene, E, Hijazi, H, Berkowitz, A, Lenos, A, Deneke, T

“…Abstract Introduction Ablation of ventricular arrhythmias (VA) is still challenging due to the complex substrate of the underlying heart disease. Depending on…”
Get full text

Conventional or endovascular aortic repair for patients with cardiac and aortic pathologies? by Lenos, Aristidis, Wagner, Matthias, Urbanski, Paul P.

“…A 62-year-old man with descending aorta aneurysm combined with cardiac pathologies was assessed as not suitable for conventional surgery and underwent…”
Get full text

Individualisierte Indikationsstellung für den isolierten Aortenklappenersatz by Lenos, A, Diegeler, A

“…Bis vor circa 10 Jahren folgte die Entscheidung zum Operationsverfahren bei der isolierten Aortenklappenstenose einem relativ einfachen Algorithmus. Die…”
Get full text

Individualisierte Indikationsstellung für den isolierten Aortenklappenersatz: Methode, Zugang und Patientenselektion by Lenos, A., Diegeler, A.

“…Zusammenfassung Bis vor circa 10 Jahren folgte die Entscheidung zum Operationsverfahren bei der isolierten Aortenklappenstenose einem relativ einfachen…”
Get full text

Low-cost, wafer level underfilling and reliability testing of flip chip devices by Grieve, A., Capote, M.A., Lenos, H.A., Soriano, A.

“…Wafer level underfilling of flip-chip devices offers great potential for high volume packaging at low cost. However, to date, few methods of wafer level…”
Get full text

A novel, wafer-scale technology for addressing process and cost obstacles associated with underfilling FCOB by Burress, R.V., Capote, M.A., Yong-Joon Lee, Lenos, H.A., Zamora, J.F.

“…This paper provides an update on development work underway to produce a novel wafer-scale packaging technology. The technology, referred to as multi-layer,…”
Get full text

A practical, flip-chip, multi-layer pre-encapsulation technology for wafer-scale underfill by Burress, R.V., Capote, M.A., Yong-Joon Lee, Lenos, H.A., Zamora, J.F.

“…This paper describes the conception, development, and application of a novel materials set and methodology for fabricating assembly-ready flip chips…”
Get full text