Search Results - "Lehtonen, S. John"

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  1. 1
    Miniature atomic scalar magnetometer for space based on the rubidium isotope 87 Rb

    Miniature atomic scalar magnetometer for space based on the rubidium isotope 87 Rb by Korth, Haje, Strohbehn, Kim, Tejada, Francisco, Andreou, Andreas G, Kitching, John, Knappe, Svenja, Lehtonen, S John, London, Shaughn M, Kafel, Matiwos

    “…A miniature atomic scalar magnetometer based on the rubidium isotope Rb was developed for operation in space. The instrument design implements both and mode…”
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  2. 2
    Miniature atomic scalar magnetometer for space based on the rubidium isotope 87Rb

    Miniature atomic scalar magnetometer for space based on the rubidium isotope 87Rb by Korth, Haje, Strohbehn, Kim, Tejada, Francisco, Andreou, Andreas G., Kitching, John, Knappe, Svenja, Lehtonen, S. John, London, Shaughn M., Kafel, Matiwos

    “…A miniature atomic scalar magnetometer based on the rubidium isotope 87Rb was developed for operation in space. The instrument design implements both Mx and Mz…”
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  3. 3
    Development of Ka-band frequency translators for high data rate communications

    Development of Ka-band frequency translators for high data rate communications by Angert, Matthew P, Treadway, Jacob P, Haskins, Christopher B, Bernacik, Mark G, Lehtonen, S John, Lascari, Lance

    Published in 2010 IEEE Aerospace Conference (01-03-2010)
    “…As future communications in space require increasing data rates, Ka-band technology is needed to enable wider bandwidths and higher data rates. Linear…”
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  4. 4
    Development of a flight qualified Ka-band multi-chip module for the solar probe plus mission

    Development of a flight qualified Ka-band multi-chip module for the solar probe plus mission by Matlin, Daniel E., Sharma, Avinash, Angert, Matthew P., Sheng Cheng, Lehtonen, John S.

    Published in 2017 IEEE Aerospace Conference (01-03-2017)
    “…The Johns Hopkins University Applied Physics Lab (JHU/APL) has developed a flight qualified, hermetically sealed, I/Q modulator Ka-band Multi-chip Module…”
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  5. 5
    Micro Processing a Path to Aggressive Instrument Miniaturization for Micro and Picosats

    Micro Processing a Path to Aggressive Instrument Miniaturization for Micro and Picosats by Wesolek, D.M., Darrin, A.G., Osiander, R., Lehtonen, S.J., Edwards, R.L., Hererro, F.A.

    Published in 2005 IEEE Aerospace Conference (2005)
    “…Advanced micro-fabrication and packaging techniques provided through microelectromechanical systems (MEMS) technology enable fabrication and system integration…”
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  6. 6
    Wirebonding on various multichip module substrates and metallurgies

    Wirebonding on various multichip module substrates and metallurgies by Charles, H.K., Mach, K.J., Edwards, R.L., Lehtonen, S.J., Lee, D.M.

    “…Wirebonding is still the mainstay, first-level interconnect for worldwide electronic products. As high-density circuit technology such as multichip modules…”
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