Search Results - "Lehtonen, John"

Miniature atomic scalar magnetometer for space based on the rubidium isotope 87 Rb by Korth, Haje, Strohbehn, Kim, Tejada, Francisco, Andreou, Andreas G, Kitching, John, Knappe, Svenja, Lehtonen, S John, London, Shaughn M, Kafel, Matiwos

“…A miniature atomic scalar magnetometer based on the rubidium isotope Rb was developed for operation in space. The instrument design implements both and mode…”
Get full text

Miniature atomic scalar magnetometer for space based on the rubidium isotope 87Rb by Korth, Haje, Strohbehn, Kim, Tejada, Francisco, Andreou, Andreas G., Kitching, John, Knappe, Svenja, Lehtonen, S. John, London, Shaughn M., Kafel, Matiwos

“…A miniature atomic scalar magnetometer based on the rubidium isotope 87Rb was developed for operation in space. The instrument design implements both Mx and Mz…”
Get full text

High efficiency 25 Watt GaN X-band SSPA for deep space missions by Sharma, Avinash, Cheng, Sheng, Lehtonen, John, Hong, Albert, Ling, Sharon, Wallis, Robert, Sheldon, Colin

“…Deep space missions often require a rugged, high efficiency, low mass X-Band power amplifier to return science data back to Earth. A high efficiency 25 W GaN…”
Get full text

Development of a flight qualified Ka-band multi-chip module for the solar probe plus mission by Matlin, Daniel E., Sharma, Avinash, Angert, Matthew P., Sheng Cheng, Lehtonen, John S.

“…The Johns Hopkins University Applied Physics Lab (JHU/APL) has developed a flight qualified, hermetically sealed, I/Q modulator Ka-band Multi-chip Module…”
Get full text

Qualification of X-band GaN Hybrid Power Amplifiers For Near Earth and Deep Space by Dennison, Justin R., Sharma, Avinash, Lehtonen, John

“…In support of the National Aeronautics and Space Administration's (NASA's) Interstellar Mapping and Acceleration Probe (IMAP) mission, an X-band Gain Solid…”
Get full text

Development of Ka-band frequency translators for high data rate communications by Angert, Matthew P, Treadway, Jacob P, Haskins, Christopher B, Bernacik, Mark G, Lehtonen, S John, Lascari, Lance

“…As future communications in space require increasing data rates, Ka-band technology is needed to enable wider bandwidths and higher data rates. Linear…”
Get full text

X-band GaN SSPA for Near Earth and Deep Space Missions by Dennison, Justin R., Cheng, Sheng, Sharma, Avinash, Lehtonen, John, Dalal, Neil, Wallis, Robert, Matlin, Daniel

“…The Frontier Solid State Power Amplifier (SSPA), developed at the Johns Hopkins University Applied Physics Laboratory (JHU/APL) to support NASA's Interstellar…”
Get full text

Ka-band I/Q modulator Multi-Chip Module for high data rate communications by Sharma, Avinash, Angert, Matthew P, Treadway, Jacob P, Sheng Cheng, Malouf, Perry, Lehtonen, John

“…This paper describes the development and test results of a flight qualified, hermetic I/Q modulator Multi-Chip Module (MCM) with X-band input and Ka-band…”
Get full text

Novel micro electro mechanical systems (MEMS) packaging for the skin of the satellite by Darrin, M.A., Osiander, R., Lehtonen, J., Farrar, D., Douglas, D., Swanson, T.

“…This paper includes a discussion of the novel packaging techniques that are needed to place MEMS based thermal control devices on the skin of various…”
Get full text

Novel Micro ElectroMechanical Systems (MEMS) Packaging for the Skin of the Satellite by Darrin, M Ann, Osiander, Robert, Lehtonen, John, Farrar, Dawnielle, Douglas, Donya, Swanson, Ted

“…This paper includes a discussion of the novel packaging techniques that are needed to place MEMS based thermal control devices on the skin of various…”
Get full text

Novel Micro ElectroMechanical Systems (MEMS) Packaging for the Skin of the Satellite by Darrin, M. Ann, Osiander, Robert, Lehtonen, John, Farrar, Dawnielle, Douglas, Donya, Swanson, Ted

“…This paper includes a discussion of the novel packaging techniques that are needed to place MEMS based thermal control devices on the skin of various…”
Get full text

Micro Processing a Path to Aggressive Instrument Miniaturization for Micro and Picosats by Wesolek, D.M., Darrin, A.G., Osiander, R., Lehtonen, S.J., Edwards, R.L., Hererro, F.A.

“…Advanced micro-fabrication and packaging techniques provided through microelectromechanical systems (MEMS) technology enable fabrication and system integration…”
Get full text

Wirebonding on various multichip module substrates and metallurgies by Charles, H.K., Mach, K.J., Edwards, R.L., Lehtonen, S.J., Lee, D.M.

“…Wirebonding is still the mainstay, first-level interconnect for worldwide electronic products. As high-density circuit technology such as multichip modules…”
Get full text