Search Results - "Lee Yong Jiun"

Hotspot Mitigating With Obliquely Finned Microchannel Heat Sink-An Experimental Study by Lee, Yong Jiun, Lee, Poh Seng, Chou, Siaw Kiang

“…Sectional oblique fins are employed, in contrast to continuous fins, in order to modulate the flow in a microchannel heat sink. The breakage of continuous fin…”
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Trapezoidal Microchannel Heat Sink With Pressure-Driven and Electro-Osmotic Flows for Microelectronic Cooling by Han, Yong, Lee, Yong Jiun, Zhang, Xiaowu

“…Thermal performances of the trapezoidal microchannel heat sink (MCHS) with pure pressure driven flow (PDF), pure electro-osmotic flow (EOF) and combined flow…”
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Fluid flow and heat transfer investigations on enhanced microchannel heat sink using oblique fins with parametric study by Lee, Yong Jiun, Singh, Pawan K., Lee, Poh Seng

“…Enhanced microchannel heat sink with sectional oblique fin is used to modulate the flow in contrast to continuous straight fin. The re-initialization of…”
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Experimental investigation of oblique finned microchannel heat sink by Yong-Jiun Lee, Poh-Seng Lee, Siaw-Kiang Chou

“…Sectional oblique fins are employed in contrast to the continuous fins in order to modulate the flow in microchannel heat sink. The breakage of continuous fin…”
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Thermal management of hotspots using upstream laminar micro-jet impinging array by Yong Han, Yong Jiun Lee, Boon Long Lau, Xiaowu Zhang, Yoke Choy Leong, Kok Fah Choo, Poh Keong Chan

“…The problem of heat removal is likely to become more severe due to the presence of hotspots in the integrated circuit chip. The heat dissipation capability of…”
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Thermal-mechanical considerations of a novel power module with high junction temperature by Ho Siow Ling, Lee Yong Jiun, Hwang How Yuan, Zhang Heng Yun, Rhee, Daniel

“…Mechanical and thermal analyses are performed for a power module with target junction temperature of 220°C. The initial design of the package consists of six…”
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GaN-on-Si hotspot thermal management using direct-die-attached microchannel heat sink by Yong Jiun Lee, Boon Long Lau, Yoke Choy Leong, Kok Fah Choo, Xiaowu Zhang, Poh Keong Chan

“…GaN-on-Si device posts new challenge to thermal management with its highly concentrated heat flux dissipation from HEMT. In order to characterize GaN-on-Si…”
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