Search Results - "Lee, Taek Yeong"
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A Zeroing Cell-to-Cell Interference Page Architecture With Temporary LSB Storing and Parallel MSB Program Scheme for MLC NAND Flash Memories
Published in IEEE journal of solid-state circuits (01-04-2008)“…A new MLC NAND page architecture is presented as a breakthrough solution for sub-40-nm MLC NAND flash memories and beyond. To reduce cell-to-cell interference…”
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Journal Article Conference Proceeding -
2
A 31 ns Random Cycle VCAT-Based 4F ^ DRAM With Manufacturability and Enhanced Cell Efficiency
Published in IEEE journal of solid-state circuits (01-04-2010)“…A functional 4F 2 DRAM was implemented based on the technology combination of stack capacitor and surrounding-gate vertical channel access transistor (VCAT). A…”
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3
A Fully Performance Compatible 45 nm 4-Gigabit Three Dimensional Double-Stacked Multi-Level NAND Flash Memory With Shared Bit-Line Structure
Published in IEEE journal of solid-state circuits (01-01-2009)“…A 3-dimensional double stacked 4 gigabit multilevel cell NAND flash memory device with shared bitline structure have successfully developed. The device is…”
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4
Improving Read Disturb Characteristics by Self-Boosting Read Scheme for Multilevel NAND Flash Memories
Published in Japanese Journal of Applied Physics (01-04-2009)Get full text
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5
A dual-mode NAND flash memory: 1-Gb multilevel and high-performance 512-Mb single-level modes
Published in IEEE journal of solid-state circuits (01-11-2001)“…A 116.7-mm/sup 2/ NAND flash memory having two modes, 1-Gb multilevel program cell (MLC) and high-performance 512-Mb single-level program cell (SLC) modes, is…”
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6
A 20nm 1.8V 8Gb PRAM with 40MB/s program bandwidth
Published in 2012 IEEE International Solid-State Circuits Conference (01-02-2012)“…Phase-change random access memory (PRAM) is considered as one of the most promising candidates for future memories because of its good scalability and…”
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Conference Proceeding -
7
A study of electromigration in 3-D flip Chip Solder joint using numerical Simulation of heat flux and current density
Published in IEEE transactions on components and packaging technologies (01-09-2004)“…This paper applies an analogy between heat flow and current flow to examine the current density distribution in a solder interconnect, which has a direct…”
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Journal Article -
8
Threshold voltage reduction model for buried channel PMOSFETs using quasi-2-D Poisson equation
Published in IEEE transactions on electron devices (01-12-2000)“…A quasi-two-dimensional (2-D) threshold voltage reduction model for buried channel pMOSFETs is derived. In order to account for the coexistence of isoand…”
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9
Disturbance-suppressed ReRAM write algorithm for high-capacity and high-performance memory
Published in 2014 14th Annual Non-Volatile Memory Technology Symposium (NVMTS) (01-10-2014)“…In this paper, the mechanism of write disturbance, a unique phenomenon in high density ReRAM, is experimentally identified and quantified using fabricated test…”
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Conference Proceeding -
10
Indium doped nMOSFETs and buried channel pMOSFETs with n+ polysilicon gate
Published in Japanese Journal of Applied Physics (01-03-1997)“…We have investigated the properties of indium for channel doping engineering. We have fabricated 0.1 µ m super-steep-retrograde (SSR) channel nMOSFETs and…”
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Conference Proceeding Journal Article -
11
Influences of particle size upon room temperature structure of BaTiO3 thin films on p-Si substrates
Published in Journal of materials science. Materials in electronics (2008)“…The current study performed the growth of BaTiO 3 thin film on p-Si substrate by using RF-Magnetron sputtering system and the effects of thickness and particle…”
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12
55 nm capacitor-less 1T DRAM cell transistor with non-overlap structure
Published in 2008 IEEE International Electron Devices Meeting (01-12-2008)“…This paper presents a capacitor-less 1T DRAM cell transistor with high scalability and long retention time. It adopts gate to source/drain non-overlap…”
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Conference Proceeding -
13
A Zeroing Cell-to-Cell Interference Page Architecture with Temporary LSB Storing Program Scheme for Sub-40nm MLC NAND Flash Memories and beyond
Published in 2007 IEEE Symposium on VLSI Circuits (01-06-2007)“…A new page architecture with temporary LSB storing program scheme is presented as a breakthrough solution for sub-40nm FG (floating-gate) MLC NAND flash…”
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Conference Proceeding -
14
Dynamic Vpass ISPP scheme and optimized erase Vth control for high program inhibition in MLC NAND flash memories
Published in 2009 Symposium on VLSI Circuits (01-06-2009)“…In this paper, dynamic Vpass ISPP schemes and optimizing Vth of erase cells are presented for achieving high program inhibition of sub-40nm MLC NAND flash and…”
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Conference Proceeding -
15
SCR-based ESD Protection for High Bandwidth DRAMs
Published in 2007 IEEE Asian Solid-State Circuits Conference (01-11-2007)“…A modified SCR (silicon controlled rectifier) is proposed as an ESD protection for high speed signaling systems. With low voltage triggering (LVT)…”
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Conference Proceeding -
16
A 31ns random cycle VCAT-based 4F2 DRAM with enhanced cell efficiency
Published in 2009 Symposium on VLSI Circuits (01-06-2009)“…This paper reports a functional 4F 2 DRAM based on a vertical-channel-access-transistor (VCAT). A new core design methodology is applied to accommodate 4F 2…”
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Conference Proceeding -
17
Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations
Published in 2007 International Conference on Electronic Materials and Packaging (01-11-2007)“…In the present work, Kirkendall void formation and drop impact reliability between Pb-free solder and Cu metallization were investigated. Pb-free solders,…”
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Conference Proceeding -
18
A comparative study of ENIG and Cu OSP surface finishes on the mechanical reliability of Sn-3.0Ag-0.5Cu and Sn-36.8Pb-0.4Ag Solders
Published in 2006 International Conference on Electronic Materials and Packaging (01-12-2006)“…The mechanical reliability of surface finishes ; electroless Ni(P)/Au(ENIG), Cu OSP and electrolytic Ni/Au finishes, were evaluated with Sn-3.0Ag-0.5Cu (all in…”
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Conference Proceeding -
19
A study of electromigration in 3D flip chip solder joint using numerical simulation of heat flux and current density
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)“…This paper applies an analogy between heat flow and current flow to examine the current density distribution in a solder interconnect, which has a direct…”
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Conference Proceeding -
20
A 31 ns Random Cycle VCAT-Based 4F 2 DRAM With Manufacturability and Enhanced Cell Efficiency
Published in IEEE journal of solid-state circuits (01-04-2010)“…A functional hbox 4 F 2 DRAM was implemented based on the technology combination of stack capacitor and surrounding-gate vertical channel access transistor…”
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Journal Article