Search Results - "Lee, Ricky S. W."

Large-Emitting-Area Quantum Dot Light-Emitting Diodes Fabricated by an All-Solution Process by Tu, Ning, Lee, S. W. Ricky

“…Quantum dots (QDs) have attracted a lot of attention over the past decades due to their sharp emission spectrum and color, which can be tuned by changing just…”
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Development of Uniform Polydimethylsiloxane Arrays through Inkjet Printing by Tu, Ning, Lo, Jeffery C C, Lee, S W Ricky

“…The inkjet printing method is a promising method to deposit polymer and functional nanoparticles at the microscale. It can be applied in the fabrication of…”
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Association of hospital-treated infectious diseases and infection burden with cardiovascular diseases and life expectancy by Zheng, Jiazhen, Ni, Can, Lee, S W Ricky, Li, Fu-Rong, Huang, Jinghan, Zhou, Rui, Huang, Yining, Lip, Gregory Y H, Wu, Xianbo, Tang, Shaojun

“…The association of a broad spectrum of infectious diseases with cardiovascular outcomes remains unclear. We aim to provide the cardiovascular risk profiles…”
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UV LED Assisted Printing Platform for Fabrication of Micro-Scale Polymer Pillars by Qiu, Xing, Lo, Jeffery C. C., Cheng, Yuanjie, Lee, S. W. Ricky, Tseng, Yong Jhe, Yi, Hung Kuan, Chiu, Peter

“…Ultraviolet (UV) assisted printing has emerged as a promising additive manufacturing (AM) technology, which puts UV light sources with focused emission in high…”
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A Flexible Thin-Film Inductor for High-Efficiency Wireless Power Transfer by Yao, Yuan, Qiu, Xing, Cheng, Yuanjie, LO, Jeffery C. C., Ricky Lee, S. W., Ki, Wing-Hung, Tsui, Chi-Ying

“…The design of a thin-film spiral inductor with multi-fin structure on a flexible substrate is proposed that can be used in a fully integrated wireless power…”
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Reliability of high-power LED packaging and assembly by Shin, Moo Whan, Lai, Yi-Shao

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Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn–Cu–Ni (SCN) lead-free solder joints by Yang, Chaoran, Song, Fubin, Ricky Lee, S.W.

“…•Ni in the SnCu solder can promote the growth of (Cu, Ni)6Sn5 and suppress the growth of Cu3Sn.•Ni improves the IMC strength, in terms of reducing the…”
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Solder Joint Reliability by Lee, Professor S.W. Ricky

“…The decision to move to lead-free solders has been made, but processing and performance challenges remain. This paper considers the transition in terms of…”
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Super flexible GaN light emitting diodes using microscale pyramid arrays through laser lift-off and dual transfer by Tian, Zhenhuan, Li, Yufeng, Su, Xilin, Feng, Lungang, Wang, Shuai, Ding, Wen, Li, Qiang, Zhang, Ye, Guo, Maofeng, Yun, Feng, Lee, S W Ricky

“…We demonstrated a method to obtain super flexible LEDs, based on high quality pyramid arrays grown directly on sapphire substrates. Laser lift-off (LLO) and…”
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Inkjet Printing High Resolution Polydimethylsiloxane Dots Array by Tu, Ning, Lo, Jeffery C. C., Ricky Lee, S. W.

“…Inkjet printing polydimethylsiloxane (PDMS) has gain attention in the development of quantum dots light emitting diodes (QLEDs), color conversion layers,…”
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A Novel Approach to Characterize Phosphor Particles for the Color Tuning of WLEDs by Jiaqi Wang, Lo, Jeffery C. C., Lee, S. W. Ricky, Mian Tao, Huayong Zou, Feng Yun

“…A novel approach was proposed to characterize the optical performance of phosphor particles based on a laser particle analyzer (LPA). For Sr 3 SiO 5 :Eu…”
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Reliability and Lifetime of a Novel 222-nm KrCl Excilamp by Zhao, Fanny, Zeng, Yapei, Wu, Hao, Chen, Junquan, Yang, Guoming, Zhen, Li, Shieh, Brian, Lee, S. W. Ricky

“…Recent studies in the epidermis have shown that Far-UVC (200-230nm) is a promising candidate against Novel Coronavirus (SARS-Cov-2) with little DNA damage. Due…”
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Fan-Out Wafer-Level Packaging for Heterogeneous Integration by Lau, John H., Ming Li, Li Qingqian, Margie, Chen, Tony, Xu, Iris, Qing Xiang Yong, Zhong Cheng, Fan, Nelson, Kuah, Eric, Zhang Li, Kim Hwee Tan, Yiu-Ming Cheung, Ng, Eric, Lo, Penny, Wu Kai, Ji Hao, Koh Sau Wee, Jiang Ran, Cao Xi, Beica, Rozalia, Sze Pei Lim, Lee, N. C., Cheng-Ta Ko, Yang, Henry, Yu-Hua Chen, Mian Tao, Lo, Jeffery, Lee, Ricky S. W.

“…The design, materials, process, fabrication, and reliability of a heterogeneous integration of four chips and four capacitors by a fan-out wafer-level…”
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Lifetime and Failure Analysis of LEDs Driven by the Constant-Amplitude Current with Pulse Width Modulation by Zhao, Fanny, Chen, Junquan, Wu, Hao, Zeng, Yapei, Dong, Guoshuai, Yang, Guoming, Shieh, Brian, Ricky Lee, S. W.

“…The lifetime projection of light-emitting diodes (LEDs) driven by DC current has been addressed by IESNA LM80-80 and TM-21-11. For applications such as visible…”
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Mechanical system and dynamic control in photolithography for nanoscale fabrication: A critical review by Song, Yi, Gui, Chengqun, Huo, Zongliang, Lee, S. W. Ricky, Liu, Sheng

“…As one of the most advanced and precise equipment in the world, a photolithography scanner is able to fabricate nanometer‐scale devices on a chip. To realize…”
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Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration by Cheng-Ta Ko, Yang, Henry, Lau, John H., Ming Li, Li, Margie, Lin, Curry, Lin, J. W., Chen, Tony, Xu, Iris, Chieh-Lin Chang, Jhih-Yuan Pan, Hsing-Hui Wu, Qing Xiang Yong, Fan, Nelson, Kuah, Eric, Zhang Li, Kim Hwee Tan, Yiu-Ming Cheung, Ng, Eric, Wu Kai, Ji Hao, Beica, Rozalia, Lin, Marc, Yu-Hua Chen, Zhong Cheng, Koh Sau Wee, Jiang Ran, Cao Xi, Sze Pei Lim, Lee, N. C., Mian Tao, Lo, Jeffery, Lee, Ricky S. W.

“…The design, materials, process, fabrication, and reliability of a heterogeneous integration of four chips by a fan-out panel-level packaging (FOPLP) method are…”
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Inkjet Printing PEDOT:PSS without Coffee Ring Effect for QLED Applicaitons by TU, Ning, Ricky LEE, S. W.

“…This paper describes a method to inkjet print Poly (ethylenedioxythiophene): polystyrene sulphonate (PEODT: PSS) without coffee ring effect. PEDOT: PSS is a…”
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The Effect of Metallic Interconnect Spacing on the Thermal Resistance of Flip-Chip Light-Emitting Diodes With Underfill Encapsulation by Shang, Andrew W., Lo, Jeffery C. C., Lee, S. W. Ricky

“…While highly thermally conductive underfill material has been proposed as a solution for reducing the thermal resistance of flip-chip light-emitting diode…”
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Junction Temperature Prediction of the Multi-LED Module with the Modified Thermal Resistance Matrix by Zhao, Fanny, Shieh, Brian, Zeng, Fangyun, Yang, Guoming, Ricky Lee, S. W.

“…The junction temperature of LEDs is important for its life, reliability and efficacy. The existing transient measurement method of the junction temperature of…”
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Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes by Shang, Andrew W., Lo, Jeffery C. C., Lee, Ricky S. W.

“…Light-emitting diode (LED) devices depend strongly on proper thermal management to mitigate negative effects caused by high operating temperature, especially…”
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