Search Results - "Lee, Kangwook"

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  1. 1

    When Do Redundant Requests Reduce Latency? by Shah, Nihar B., Kangwook Lee, Ramchandran, Kannan

    Published in IEEE transactions on communications (01-02-2016)
    “…Many systems possess the flexibility to serve requests in more than one way, such as distributed storage systems that store multiple copies of the data. In…”
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    Journal Article
  2. 2

    Hypergraph Spectral Clustering in the Weighted Stochastic Block Model by Ahn, Kwangjun, Lee, Kangwook, Suh, Changho

    “…Spectral clustering is a celebrated algorithm that partitions the objects based on pairwise similarity information. While this approach has been successfully…”
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    Journal Article
  3. 3

    On Scheduling Redundant Requests With Cancellation Overheads by Kangwook Lee, Pedarsani, Ramtin, Ramchandran, Kannan

    Published in IEEE/ACM transactions on networking (01-04-2017)
    “…Reducing latency in distributed computing and data storage systems is gaining increasing importance. Several empirical works have reported on the efficacy of…”
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    Journal Article
  4. 4

    The MDS Queue: Analysing the Latency Performance of Erasure Codes by Kangwook Lee, Shah, Nihar B., Longbo Huang, Ramchandran, Kannan

    Published in IEEE transactions on information theory (01-05-2017)
    “…In order to scale economically, data centers are increasingly evolving their data storage methods from simple data replication to more powerful erasure codes,…”
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    Journal Article
  5. 5

    PhaseCode: Fast and Efficient Compressive Phase Retrieval Based on Sparse-Graph Codes by Pedarsani, Ramtin, Dong Yin, Kangwook Lee, Ramchandran, Kannan

    Published in IEEE transactions on information theory (01-06-2017)
    “…We consider the problem of recovering a complex signal x ∈ ℂ n from m intensity measurements of the form |a i H x|, 1 ≤ i ≤ m, where a i H is the ith row of…”
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    Journal Article
  6. 6

    High-dimensional coded matrix multiplication by Kangwook Lee, Changho Suh, Ramchandran, Kannan

    “…Coded computation is a framework for providing redundancy in distributed computing systems to make them robust to slower nodes, or stragglers. In [1], the…”
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    Conference Proceeding
  7. 7

    Comprehensive analysis of a peripheral blood transcriptome signature in piglets infected with Salmonella Typhimurium: insight into immune responses by Bok, Eun-Yeong, Yi, Seung-Won, Lee, Han Gyu, Kim, Jae Kyeom, Lee, Kangwook, Ha, Seungmin, Kim, Bumseok, Jung, Young-Hun, Oh, Sang-Ik

    Published in Applied biological chemistry (01-12-2024)
    “…Salmonella Typhimurium (ST) infection in pigs poses a significant threat to animal health and food safety; the intricate mechanisms underlying host–immune…”
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    Journal Article
  8. 8

    A VoD System for Massively Scaled, Heterogeneous Environments: Design and Implementation by Kangwook Lee, Yan, Lisa, Parekh, Abhay, Ramchandran, Kannan

    “…We propose, analyze and implement a general architecture for massively parallel VoD content distribution. We allow for devices that have a wide range of…”
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    Conference Proceeding Journal Article
  9. 9

    p53 activation enhances the sensitivity of non-small cell lung cancer to the combination of SH003 and docetaxel by inhibiting de novo pyrimidine synthesis by Choi, Yu-Jeong, Lee, Kangwook, Lee, Seo Yeon, Kwon, Youngbin, Woo, Jaehyuk, Jeon, Chan-Yong, Ko, Seong-Gyu

    Published in Cancer cell international (04-05-2024)
    “…Identifying molecular biomarkers for predicting responses to anti-cancer drugs can enhance treatment precision and minimize side effects. This study…”
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    Journal Article
  10. 10

    Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration by Kangwook Lee, Bea, Jichel, Fukushima, Takafumi, Ramalingam, Suresh, Xin Wu, Tanaka, Tetsu, Koyanagi, Mitsumasa

    Published in IEEE electron device letters (01-01-2016)
    “…We propose a novel hybrid bonding technology with a high stacking yield using ultra-high density Cu nanopillar (CNP) for exascale 2.5D/3D integration. To solve…”
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    Journal Article
  11. 11

    Metabolomic Analysis of Exosomes Derived from Lung Cancer Cell Line H460 Treated with SH003 and Docetaxel by Choi, Yu-Jeong, Lee, Kangwook, Jeong, Miso, Shin, Yong Cheol, Ko, Seong-Gyu

    Published in Metabolites (28-10-2022)
    “…Exosomes released from tumor cells treated with cancer-targeting drugs reflect altered metabolic processes within the cells. Therefore, metabolites in exosomes…”
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    Journal Article
  12. 12

    Evaluation of Cu Diffusion From Cu Through-Silicon Via (TSV) in Three-Dimensional LSI by Transient Capacitance Measurement by Bea, J., Kangwook Lee, Fukushima, T., Tanaka, T., Koyanagi, M.

    Published in IEEE electron device letters (01-07-2011)
    “…The influence of Cu contamination from Cu through-silicon via (TSV) on device reliability in the 3-D LSI has been electrically evaluated by capacitance-time…”
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    Journal Article
  13. 13

    Network pharmacology study to explore the multiple molecular mechanism of SH003 in the treatment of non-small cell lung cancer by Lee, Kangwook, Choi, Yu-Jeong, Lim, Hae-In, Cho, Kwang Jin, Kang, Nuri, Ko, Seong-Gyu

    Published in BMC complementary and alternative medicine (01-02-2024)
    “…Non-small cell lung cancer (NSCLC) is one of the leading causes of human death worldwide. Herbal prescription SH003 has been developed to treat several cancers…”
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    Journal Article
  14. 14

    Evaluation of Cu Contamination at Backside Surface of Thinned Wafer in 3-D Integration by Transient-Capacitance Measurement by Bea, J, Kangwook Lee, Fukushima, T, Tanaka, T, Koyanagi, M

    Published in IEEE electron device letters (01-01-2011)
    “…The influence of Cu contamination at backside surface of a thinned wafer in three-dimensional LSI was electrically evaluated by capacitance-time (C-t)…”
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    Journal Article
  15. 15

    Degradation of Memory Retention Characteristics in DRAM Chip by Si Thinning for 3-D Integration by Lee, Kangwook, Tanikawa, Seiya, Murugesan, Mariappine, Naganuma, Hideki, Shimamoto, Haro, Fukushima, Takafumi, Tanaka, Tetsu, Koyanagi, Mitsumasa

    Published in IEEE electron device letters (01-08-2013)
    “…The Young's modulus (E) of Si substrate begin to noticeably decrease below 50-μm thickness. The Young's modulus in 30-μm thick Si substrate decreased by 30%…”
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    Journal Article
  16. 16

    Network Pharmacological Analysis and Experimental Validation of the Effect of Smilacis Glabrae Rhixoma on Gastrointestinal Motility Disorder by Choi, Na-Ri, Lee, Kangwook, Seo, Mujin, Ko, Seok-Jae, Choi, Woo-Gyun, Kim, Sang-Chan, Kim, Jinsung, Park, Jae-Woo, Kim, Byung-Joo

    Published in Plants (Basel) (30-03-2023)
    “…Gastrointestinal motility disorder (GMD) is a disease that causes digestive problems due to inhibition of the movement of the gastrointestinal tract and is one…”
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    Journal Article
  17. 17

    Asynchronous and noncoherent neighbor discovery for the IoT using sparse-graph codes by Chandrasekher, Kabir, Kangwook Lee, Kairouz, Peter, Pedarsani, Ramtin, Ramchandran, Kannan

    “…In this paper, we design a fast and efficient energy-based and asynchronous neighbor discovery protocol for the Internet of Things (IoT). In our solution, we…”
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    Conference Proceeding
  18. 18

    Patient With Unresectable Cholangiocarcinoma Treated With Radiofrequency Hyperthermia in Combination With Chemotherapy: A Case Report by Ryu, Juyoung, Lee, Kangwook, Joe, Changmug, Joo, JongCheon, Lee, Namhun, Yoo, Hwa-Seung

    Published in Integrative cancer therapies (01-06-2018)
    “…Hyperthermia, which is a noninvasive treatment that causes tumor cells to become heated and that works in synergy with anticancer drugs and radiation therapy,…”
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    Journal Article
  19. 19

    Through-Silicon Photonic Via and Unidirectional Coupler for High-Speed Data Transmission in Optoelectronic Three-Dimensional LSI by Noriki, A., Kangwook Lee, Bea, J., Fukushima, T., Tanaka, T., Koyanagi, M.

    Published in IEEE electron device letters (01-02-2012)
    “…We develop Si-core through-silicon photonic via (TSPV) and unidirectional coupler for low-loss and high-speed data transmission in an optoelectronic 3-D LSI…”
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    Journal Article
  20. 20

    Impact of Cu Contamination on Memory Retention Characteristics in Thinned DRAM Chip for 3-D Integration by Kangwook Lee, Tani, T., Naganuma, H., Ohara, Y., Fukushima, T., Tanaka, T., Koyanagi, M.

    Published in IEEE electron device letters (01-09-2012)
    “…The influence of Cu diffusion at the backside surface of a thinned dynamic random access memory (DRAM) chip for 3-D integration on memory retention…”
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    Journal Article