Search Results - "Lee, Kangwook"
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When Do Redundant Requests Reduce Latency?
Published in IEEE transactions on communications (01-02-2016)“…Many systems possess the flexibility to serve requests in more than one way, such as distributed storage systems that store multiple copies of the data. In…”
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2
Hypergraph Spectral Clustering in the Weighted Stochastic Block Model
Published in IEEE journal of selected topics in signal processing (01-10-2018)“…Spectral clustering is a celebrated algorithm that partitions the objects based on pairwise similarity information. While this approach has been successfully…”
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3
On Scheduling Redundant Requests With Cancellation Overheads
Published in IEEE/ACM transactions on networking (01-04-2017)“…Reducing latency in distributed computing and data storage systems is gaining increasing importance. Several empirical works have reported on the efficacy of…”
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4
The MDS Queue: Analysing the Latency Performance of Erasure Codes
Published in IEEE transactions on information theory (01-05-2017)“…In order to scale economically, data centers are increasingly evolving their data storage methods from simple data replication to more powerful erasure codes,…”
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PhaseCode: Fast and Efficient Compressive Phase Retrieval Based on Sparse-Graph Codes
Published in IEEE transactions on information theory (01-06-2017)“…We consider the problem of recovering a complex signal x ∈ ℂ n from m intensity measurements of the form |a i H x|, 1 ≤ i ≤ m, where a i H is the ith row of…”
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High-dimensional coded matrix multiplication
Published in 2017 IEEE International Symposium on Information Theory (ISIT) (01-06-2017)“…Coded computation is a framework for providing redundancy in distributed computing systems to make them robust to slower nodes, or stragglers. In [1], the…”
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Conference Proceeding -
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Comprehensive analysis of a peripheral blood transcriptome signature in piglets infected with Salmonella Typhimurium: insight into immune responses
Published in Applied biological chemistry (01-12-2024)“…Salmonella Typhimurium (ST) infection in pigs poses a significant threat to animal health and food safety; the intricate mechanisms underlying host–immune…”
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A VoD System for Massively Scaled, Heterogeneous Environments: Design and Implementation
Published in 2013 IEEE 21st International Symposium on Modelling, Analysis and Simulation of Computer and Telecommunication Systems (01-08-2013)“…We propose, analyze and implement a general architecture for massively parallel VoD content distribution. We allow for devices that have a wide range of…”
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p53 activation enhances the sensitivity of non-small cell lung cancer to the combination of SH003 and docetaxel by inhibiting de novo pyrimidine synthesis
Published in Cancer cell international (04-05-2024)“…Identifying molecular biomarkers for predicting responses to anti-cancer drugs can enhance treatment precision and minimize side effects. This study…”
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10
Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration
Published in IEEE electron device letters (01-01-2016)“…We propose a novel hybrid bonding technology with a high stacking yield using ultra-high density Cu nanopillar (CNP) for exascale 2.5D/3D integration. To solve…”
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Metabolomic Analysis of Exosomes Derived from Lung Cancer Cell Line H460 Treated with SH003 and Docetaxel
Published in Metabolites (28-10-2022)“…Exosomes released from tumor cells treated with cancer-targeting drugs reflect altered metabolic processes within the cells. Therefore, metabolites in exosomes…”
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12
Evaluation of Cu Diffusion From Cu Through-Silicon Via (TSV) in Three-Dimensional LSI by Transient Capacitance Measurement
Published in IEEE electron device letters (01-07-2011)“…The influence of Cu contamination from Cu through-silicon via (TSV) on device reliability in the 3-D LSI has been electrically evaluated by capacitance-time…”
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13
Network pharmacology study to explore the multiple molecular mechanism of SH003 in the treatment of non-small cell lung cancer
Published in BMC complementary and alternative medicine (01-02-2024)“…Non-small cell lung cancer (NSCLC) is one of the leading causes of human death worldwide. Herbal prescription SH003 has been developed to treat several cancers…”
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14
Evaluation of Cu Contamination at Backside Surface of Thinned Wafer in 3-D Integration by Transient-Capacitance Measurement
Published in IEEE electron device letters (01-01-2011)“…The influence of Cu contamination at backside surface of a thinned wafer in three-dimensional LSI was electrically evaluated by capacitance-time (C-t)…”
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15
Degradation of Memory Retention Characteristics in DRAM Chip by Si Thinning for 3-D Integration
Published in IEEE electron device letters (01-08-2013)“…The Young's modulus (E) of Si substrate begin to noticeably decrease below 50-μm thickness. The Young's modulus in 30-μm thick Si substrate decreased by 30%…”
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Network Pharmacological Analysis and Experimental Validation of the Effect of Smilacis Glabrae Rhixoma on Gastrointestinal Motility Disorder
Published in Plants (Basel) (30-03-2023)“…Gastrointestinal motility disorder (GMD) is a disease that causes digestive problems due to inhibition of the movement of the gastrointestinal tract and is one…”
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Asynchronous and noncoherent neighbor discovery for the IoT using sparse-graph codes
Published in 2017 IEEE International Conference on Communications (ICC) (01-05-2017)“…In this paper, we design a fast and efficient energy-based and asynchronous neighbor discovery protocol for the Internet of Things (IoT). In our solution, we…”
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Conference Proceeding -
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Patient With Unresectable Cholangiocarcinoma Treated With Radiofrequency Hyperthermia in Combination With Chemotherapy: A Case Report
Published in Integrative cancer therapies (01-06-2018)“…Hyperthermia, which is a noninvasive treatment that causes tumor cells to become heated and that works in synergy with anticancer drugs and radiation therapy,…”
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Through-Silicon Photonic Via and Unidirectional Coupler for High-Speed Data Transmission in Optoelectronic Three-Dimensional LSI
Published in IEEE electron device letters (01-02-2012)“…We develop Si-core through-silicon photonic via (TSPV) and unidirectional coupler for low-loss and high-speed data transmission in an optoelectronic 3-D LSI…”
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Impact of Cu Contamination on Memory Retention Characteristics in Thinned DRAM Chip for 3-D Integration
Published in IEEE electron device letters (01-09-2012)“…The influence of Cu diffusion at the backside surface of a thinned dynamic random access memory (DRAM) chip for 3-D integration on memory retention…”
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