Search Results - "Lee, GyuJei"

A Study on the Advanced Chip to Wafer Stack for Better Thermal Dissipation of High Bandwidth Memory by Lee, Sangyong, Park, Jinwoo, Moon, Jong-Kyu, Kim, Minsuk, Lee, Gyujei, Lee, Kangwook

“…One of the technical challenges in 2.5D SiP is thermal issue increase with higher performance. In this paper, mass reflow bonding with molded underfll process…”
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Mechanical characterization of polymer passivation layer in semiconductor applications using IIT and FEA by Lee, Gyujei, Kim, Yuhwan, Kwon, Dongil

“…Various kinds of polymer passivation and associated equipment have been developed for inter-level insulation, buffering, and α -rays shielding layers in…”
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Mechanical characterization of residual stress around TSV through instrumented indentation algorithm by Gyujei Lee, Suk-woo Jeon, Kwang-yoo Byun, Dongil Kwon

“…Today, copper is the best material for TSV (through silicon via) filling because it can fill a large structural volume and it has good electrical performance…”
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Interfacial characterization of catalyst coating on electrolyte polymer through microscratch analysis in DMFC by Lee, Gyujei, Lee, Hankyu, Kwon, Dongil

“…This study combined scratch testing and fracture-mechanical analysis to characterize the interfacial adhesion of catalyst coating on electrolyte polymer in…”
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Microstructure and stress characterization around TSV using in-situ PIT-in-SEM by Gyujei Lee, Min-jae Choi, Suk-woo Jeon, Kwang-yoo Byun, Dongil Kwon

“…Many studies have characterized the residual stress around TSV by using direct experimental measurement, finite element simulation, and microstructural…”
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Quantification of micropartial residual stress for mechanical characterization of TSV through nanoinstrumented indentation testing by Gyujei Lee, Ho Young Son, Joon Ki Hong, Kwang Yoo Byun, Dongil Kwon

“…Most TSVs filled with plated copper offer many reliability problems. When subjected to thermal-cycled plating processes, the very large CTE (coefficient of…”
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Development of single cantilever beam method to measure the adhesion of thin film adhesive on silicon chip by Shin, DongKil, Lee, JungJu, Yoon, ChulKeun, Lee, GyuJei, Hong, JoonKi, Kim, NamSuk

“…•The SCB was successfully modified to measure the adhesion of film adhesive.•The specimen was designed without attachment of any adherend.•Delamination was…”
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Characterization of elastic modulus and work of adhesion in elastomeric polymers using microinstrumented indentation technique by Lee, Gyujei, Kang, Seung-Kyun, Kwon, Dongil

“…This study combines Johnson–Kendall–Roberts (JKR) theory with the instrumented indentation technique (IIT) to evaluate the work of adhesion and modulus of…”
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Interfacial reliability and micropartial stress analysis between TSV and CPB through NIT and MSA by Gyujei Lee, Yu-hwan Kim, Suk-woo Jeon, Kwang-yoo Byun, Dongil Kwon

“…As Moore predicted in 1965, the scale of microelectronic devices continues to diminish at tremendous speed, and today the limitations of conventional 2D…”
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Structural Characterization of 2.5D System in Package Combined with High Bandwidth Memory for Enhanced Quality and Reliability by Lee, Byoungdo, Choi, Jinwoo, Lee, Sangyong, Park, Jinwoo, Kang, Jihoon, Kwon, Unoh, Lee, Gyujei, Lee, Kangwook

“…2.5D body size is expanding due to SoC/HBM system integration to maximize artificial intelligence (AI) performance. Accordingly, thermal and mechanical stress…”
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Effects of Twin Boundary and Precipitates on Board Level Reliability in Sn-Ag-Cu(SAC) Solder Joints through EBSD Analysis by Yoon, Dal-Jin, Lee, Byoungdo, Kim, Jihye, Hyun, Sungho, Lee, Gyujei, Lee, Kangwook

“…In order to improve the high board level reliability characteristics of electronic packages, a solder joint composed of a three-component composition of…”
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